JPH05129051A - Ic's built-in connector - Google Patents

Abstract

PURPOSE:To omit the wiring length substantially, prevent noise from being mixed in, and reduce a wiring area by projecting two leads of an IC from a casing, using one lead as a substrate connecting pin, and using the other lead as a connector pin when the IC is housed in the casing formed of a resinous molding. CONSTITUTION:A connector 1 is constituted of a package IC 2 having a pair of leads 2a and 2b and a casing 3 to cover the IC 2 formed so as to project these leads 2a and 2b. Here, the IC 2 is an element in which an input and an output of a buffer driver transistor array and so on are made symmetrical with each other. As for the sealing-up of the IC2 in a resinous molding 3, one lead 2a is bent downward by 90 degrees, and the other lead 2b is extended in the horizontal direction along a guide part 3a of the molding 3. In this way, the lead 2a is used for substrate connection, and the lead 2b is used for a connector, respectively.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connector for a printed circuit board or a relay, which has a built-in IC.

[0002]

2. Description of the Related Art When connecting an IC and a connector on a printed circuit board, the IC 11 and the connector 12 are separately arranged on the front side of the printed circuit board 10, as shown in FIG.
It is general that the leads 11a on one side of the IC 11 and the pins 12a of the connector 12 are connected by the wiring 13 on the back side of the substrate 10. In this state, the pin 12 of the connector 12
The housing 14 having the flexible flat cable 14a is attached and detached to and from b.

[0003]

However, the connection as shown in FIG. 3 requires a mounting area for each of the IC 11 and the connector 12 and a wiring area between the IC 11 and the connector 12, and the high density of the set. It becomes a factor that hinders implementation. Therefore, an object of the present invention is to realize high-density packaging of a set.

[0004]

The above-mentioned object is to achieve the object of the present invention.
This is achieved by the C built-in connector. That is, the connector of the present invention is designed so that the IC and the lead of this IC are projected.
It is characterized in that a lead covering one side of the IC projecting from the casing is used as a pin for board connection and a lead on the other side is used as a pin for connector.

In this connector, the packaged IC is housed in a casing, and the leads on one side and the other side of the IC project from the casing, and the leads on one side serve as pins for connecting the board and the leads on the other side. Are used as connector pins. Therefore, the mounting area is only for the connector, and both the IC area and the connector area are not required unlike the conventional case. Further, since the connector itself has an IC built therein, a wiring area between the IC and the connector is substantially unnecessary. This enables high-density mounting on a printed circuit board or the like.

Incidentally, the casing is an IC without electrical influence.
There is no limitation on the material and shape of the resin as long as it can be accommodated, but resin is preferable as the material. When the package IC is molded with resin, the resin mold itself serves as a casing, and a connector in which the IC and the casing are integrated can be easily obtained.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The IC built-in connector of the present invention will be described below based on embodiments. FIG. 1 is a cross-sectional view of a connector of one embodiment mounted on a printed board, and FIG. 2 is a perspective view thereof. The connector 1 includes a pair of leads 2a and 2b.
Package IC2 having a lead and lead 2 of this IC2
The casing 3 covers the IC 2 so that a and 2b project. In this embodiment, the IC 2 housed in the casing 3 is such that the input and output of the buffer, driver, transistor array, etc. are arranged symmetrically,
The casing 3 is made of resin in which the IC 2 is molded.

The encapsulation of the IC 2 in the resin mold 3 is shown in FIG.
As can be seen from the above, the lead 2a on one side of the IC 2 is bent downward by 90 degrees and the lead 2b on the other side is horizontally extended. As a result, the resin mold 3
The lead 2a protruding from the pin functions as a pin for connecting the board, and the lead 2b functions as a pin for the connector. Further, in this embodiment, the resin mold 3 has a guide portion 3a extending along the lead 2b.

In such an IC built-in connector 1, if the lead 2a is inserted into the electronic component insertion hole 10a formed in the printed board 10 (see FIG. 1) and fixed by soldering, as in a normal connector, the connector 1 Are mounted on the substrate 10. An adhesive or the like may be used if necessary in order to securely fix the connector 1 to the substrate 10. Connector 1
When the housing 20 having the flexible flat cable 21 is inserted into the lead 2b in the state in which is attached to the substrate 10, the IC 2 and the cable 21 and the substrate 10 and the cable 21 can be connected at the same time.
At this time, the housing 20 makes the guide portion 3 of the resin mold 3
Since it is guided by a, the housing 20 is connected to the lead 2
It can be easily fitted into b.

Signals are exchanged between the wiring of the substrate 10 and the cable 21 when the signal input from the lead 2a is transferred to the IC2.
The signal processed differently from the input signal is different from the input signal in the lead 2b.
From the output to the cable 21 or vice versa. A specific application of the IC built-in connector 1 is the following buffer IC built-in connector. That is, for example, when a high-impedance signal is transmitted to another substrate by a cable, if the signal is passed through the cable as it is, noise is likely to be mixed into the signal on the way. As a measure against this,
It is conceivable to add a buffer circuit on the substrate and send a signal obtained by converting high impedance to low impedance to the cable via the connector.

If a buffer IC built-in connector having a built-in buffer circuit is used, it is not necessary to provide a new buffer circuit on the substrate, and noise countermeasures and mounting area reduction can be realized at the same time. Further, as compared with the case where the buffer circuit and the connector are separately provided, the wiring length between the buffer circuit and the connector is substantially eliminated, so that noise is less likely to be mixed into the signal from the wiring and the wiring area can be reduced. ..

[0012]

As described above, the connector with a built-in IC according to the present invention has an IC projecting from the casing containing the IC.
Since the lead on one side is used as the pin for connecting the board and the lead on the other side is used as the pin for the connector, the following effects are obtained. (1) Since the IC and connector are integrated for both IC and connector, the mounting area and wiring area on the substrate can be reduced, and high-density mounting of the set can be realized. (2) Since the wiring length on the substrate is shortened, the inductance is reduced, which is effective as a noise countermeasure.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a state in which a connector according to an embodiment of the present invention is mounted on a board.

FIG. 2 is a perspective view of the connector shown in FIG.

FIG. 3 is a cross-sectional view of a conventional example showing a state in which an IC and a connector are connected on a board.

[Explanation of symbols]

 1 IC Built-in Connector 2 IC 2a, 2b Lead 3 Resin Mold (Casing) 10 Printed Circuit Board

Claims (2)

[Claims] 1. An IC and a casing for covering the IC so that the leads of the IC project so that the leads on one side of the IC projecting from the casing are pins for connecting to a board.
A connector with a built-in IC, characterized in that the lead on the other side is used as a connector pin. 2. The IC built-in connector according to claim 1, wherein the casing is made of resin.