JPH0512863B2 - - Google Patents
Info
- Publication number
- JPH0512863B2 JPH0512863B2 JP56177201A JP17720181A JPH0512863B2 JP H0512863 B2 JPH0512863 B2 JP H0512863B2 JP 56177201 A JP56177201 A JP 56177201A JP 17720181 A JP17720181 A JP 17720181A JP H0512863 B2 JPH0512863 B2 JP H0512863B2
- Authority
- JP
- Japan
- Prior art keywords
- conductivity type
- semiconductor layer
- layer
- semiconductor
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/60—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of BJTs
- H10D84/65—Integrated injection logic
- H10D84/658—Integrated injection logic integrated in combination with analog structures
Landscapes
- Bipolar Transistors (AREA)
- Element Separation (AREA)
- Bipolar Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56177201A JPS5879752A (ja) | 1981-11-06 | 1981-11-06 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56177201A JPS5879752A (ja) | 1981-11-06 | 1981-11-06 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5879752A JPS5879752A (ja) | 1983-05-13 |
JPH0512863B2 true JPH0512863B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-02-19 |
Family
ID=16026938
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56177201A Granted JPS5879752A (ja) | 1981-11-06 | 1981-11-06 | 半導体装置の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5879752A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60158657A (ja) * | 1984-01-29 | 1985-08-20 | Rohm Co Ltd | 半導体装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS516488A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1974-07-05 | 1976-01-20 | Hitachi Ltd | |
JPS5456357A (en) * | 1977-10-14 | 1979-05-07 | Hitachi Ltd | Production of semiconductor device |
JPS5655060A (en) * | 1979-10-11 | 1981-05-15 | Fujitsu Ltd | Semiconductor integrated circuit device |
-
1981
- 1981-11-06 JP JP56177201A patent/JPS5879752A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5879752A (ja) | 1983-05-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5200348A (en) | Method of manufacturing semiconductor device with constant width deep groove isolation | |
US4962053A (en) | Bipolar transistor fabrication utilizing CMOS techniques | |
US5882966A (en) | BiDMOS semiconductor device and method of fabricating the same | |
US5019523A (en) | Process for making polysilicon contacts to IC mesas | |
JP3014012B2 (ja) | 半導体装置の製造方法 | |
US6218725B1 (en) | Bipolar transistors with isolation trenches to reduce collector resistance | |
US4051506A (en) | Complementary semiconductor device | |
EP0278619B1 (en) | Integrated bipolar and CMOS transistor fabrication process | |
US4988639A (en) | Method of manufacturing semiconductor devices using trench isolation method that forms highly flat buried insulation film | |
JPH0581058B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
US5913114A (en) | Method of manufacturing a semiconductor device | |
US5319235A (en) | Monolithic IC formed of a CCD, CMOS and a bipolar element | |
EP0281235B1 (en) | Bipolar transistor fabrication utilizing cmos techniques | |
JP3074708B2 (ja) | 高出力用集積回路のための半導体構造 | |
US6596600B1 (en) | Integrated injection logic semiconductor device and method of fabricating the same | |
US5065209A (en) | Bipolar transistor fabrication utilizing CMOS techniques | |
JPH0512863B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
JP2840488B2 (ja) | 半導体集積回路とその製造方法 | |
US5693543A (en) | Method of manufacturing a semiconductor IIL device with dielectric and diffusion isolation | |
JPH07130898A (ja) | 半導体装置およびその製造方法 | |
JPH09306924A (ja) | 半導体装置の製造方法 | |
JPS6146062A (ja) | ラテラルトランジスタ半導体装置の製造方法 | |
JPS5915494B2 (ja) | 半導体装置の製造方法 | |
JPH0454984B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
JPS6140140B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |