JPH05126901A - Semiconductor testing device - Google Patents

Semiconductor testing device

Info

Publication number
JPH05126901A
JPH05126901A JP3315540A JP31554091A JPH05126901A JP H05126901 A JPH05126901 A JP H05126901A JP 3315540 A JP3315540 A JP 3315540A JP 31554091 A JP31554091 A JP 31554091A JP H05126901 A JPH05126901 A JP H05126901A
Authority
JP
Japan
Prior art keywords
exhaust
constant temperature
measuring device
air supply
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3315540A
Other languages
Japanese (ja)
Inventor
Teruaki Ogata
照明 尾方
Yuko Sudo
優子 須藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP3315540A priority Critical patent/JPH05126901A/en
Publication of JPH05126901A publication Critical patent/JPH05126901A/en
Pending legal-status Critical Current

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  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To obtain a power-saving type semiconductor testing device by suppressing the noise and room temperature rises caused by direct exhaust from a measuring instrument and, at the same time, using the exhaust heat from the measuring instrument as the auxiliary heat source of a constant temperature oven. CONSTITUTION:The exhaust heat produced from a measuring device 1 is fed to a constant temperature oven 2 through an air supplying/discharging duct 10 connecting the instrument 1 to the oven 2 and used for controlling the temperature of the oven 2.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明は半導体テスト装置にお
いて、特に、半導体集積回路等の電子回路測定装置にお
いて消費電力の低減を図った半導体テスト装置に関する
ものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor test device, and more particularly to a semiconductor test device for reducing power consumption in an electronic circuit measuring device such as a semiconductor integrated circuit.

【0002】[0002]

【従来の技術】従来の半導体テスト装置では、被テスト
半導体のテスト時動作を検出する測定装置と、テスト時
の温度を一定に保つための恒温槽とは独立している。例
えば、高温時の半導体装置をテストするバーンイン装置
において、モニタ用の測定装置とバーンイン炉、あるい
は、測定装置と高温ハンドラは各々電気的信号の接続は
あっても、熱的な結合は考慮されていなかった。
2. Description of the Related Art In a conventional semiconductor test device, a measuring device for detecting a test operation of a semiconductor under test and a constant temperature bath for keeping a constant temperature during the test are independent. For example, in a burn-in device for testing a semiconductor device at a high temperature, the measuring device for monitoring and the burn-in furnace, or the measuring device and the high-temperature handler have electrical signal connections, but thermal coupling is considered. There wasn't.

【0003】[0003]

【発明が解決しようとする課題】従来の半導体テスト装
置は以上のように構成されているので、テスト時の測定
装置が発熱した際、この発熱対策として強制排気を必要
とするが、強制排気された空気の熱、つまり、排気熱に
よる室温の上昇が避けられず、一方、近接した恒温槽で
発熱源を必要としているにもかかわらず、測定装置から
の排気熱は有効利用されることなく排気されるなどの問
題があり、さらに、測定装置より強制排気を行うために
使用されるファンからの騒音の発生などの問題点があっ
た。
Since the conventional semiconductor test device is constructed as described above, when the measuring device generates heat during the test, forced evacuation is required as a countermeasure against this heat generation, but it is forced evacuation. The temperature of the air, that is, the rise in room temperature due to exhaust heat is unavoidable. On the other hand, the exhaust heat from the measurement device is exhausted without being effectively used even though a heat source is required in the adjacent thermostatic chamber. In addition, there is a problem that noise is generated from a fan used for forced exhaust from the measuring device.

【0004】この発明は上記のような問題点を解消する
ためになされたもので、測定装置の排気熱を有効利用す
ることにより、恒温槽の昇温のための消費電力を節約可
能とし、かつ、ファンの騒音を抑制することのできる半
導体テスト装置を得ることを目的とする。
The present invention has been made to solve the above problems, and by effectively utilizing the exhaust heat of the measuring device, it is possible to save the power consumption for raising the temperature of the constant temperature bath, and An object of the present invention is to obtain a semiconductor test device capable of suppressing fan noise.

【0005】[0005]

【課題を解決するための手段】この発明に係る半導体テ
スト装置は、測定装置と恒温槽とを接続する給排気ダク
トを備え、該給排気ダクトを通して測定装置で生じた排
気熱を恒温槽に給気し、恒温槽における温度制御に使用
するものである。
A semiconductor test apparatus according to the present invention comprises a supply / exhaust duct for connecting a measuring device and a constant temperature bath, and supplies exhaust heat generated in the measuring device to the constant temperature bath through the supply / exhaust duct. It is used for temperature control in a constant temperature bath.

【0006】[0006]

【作用】この発明における半導体テストは、測定装置か
らの排気熱の給気により恒温槽が補助的に昇温するの
で、恒温槽の昇温のために使用する電力を節約すること
ができ、また、給排気ダクトで測定装置の排気口と恒温
槽の給気口とを密閉して接続することにより、騒音対策
が可能となる。
In the semiconductor test according to the present invention, the temperature of the constant temperature bath is supplementarily raised by the supply of exhaust heat from the measuring device, so that the electric power used for raising the temperature of the constant temperature bath can be saved. By sealing and connecting the exhaust port of the measuring device and the air supply port of the thermostatic chamber with the supply / exhaust duct, it is possible to take measures against noise.

【0007】[0007]

【実施例】以下、この発明の一実施例を図について説明
する。図1はこの発明の一実施例による半導体テスト装
置の外観を示す図であり、ここでは測定装置と恒温槽を
示している。図において、1はこの半導体テスト装置に
おいて行われるテスト時の動作状況を測定する測定装
置、2は行われるテスト内容に応じた所望の温度を保つ
ための恒温槽、3,7はそれぞれ測定装置1,恒温槽2
の排気ファン、4は測定装置1の排気口、5は恒温槽2
の給気ファン、6は恒温槽2の給気口、8は恒温槽2の
排気ダクト、9は恒温槽2の温度を所望の温度に保つた
めの温度制御ヒータ、10は測定装置1の排気口4と恒
温槽2の給気口6とを接続する給排気ダクトである。
DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram showing the appearance of a semiconductor test apparatus according to an embodiment of the present invention, in which a measuring apparatus and a constant temperature bath are shown. In the figure, 1 is a measuring device for measuring the operating conditions during the test performed in this semiconductor test device, 2 is a thermostatic chamber for maintaining a desired temperature according to the contents of the test being performed, and 3 and 7 are the measuring device 1 respectively. , Constant temperature bath 2
Exhaust fan, 4 is an exhaust port of the measuring device 1, and 5 is a thermostatic chamber 2.
Of the constant temperature tank 2, 6 is an air supply port of the constant temperature tank 2, 8 is an exhaust duct of the constant temperature tank 2, 9 is a temperature control heater for keeping the temperature of the constant temperature tank 2 at a desired temperature, and 10 is exhaust of the measuring device 1. It is an air supply / exhaust duct that connects the port 4 and the air supply port 6 of the constant temperature bath 2.

【0008】次に動作について説明する。テスト中の発
熱により測定装置1より生じる熱された空気は排気ファ
ン3を用いて、排気口4から強制排気される。一方、恒
温槽2は給気口5から給気ファン6を用いて、測定装置
1より排気されてきた熱された排気が強制給気される。
Next, the operation will be described. Air heated by the measuring device 1 due to heat generation during the test is forcedly exhausted from the exhaust port 4 by using the exhaust fan 3. On the other hand, in the constant temperature bath 2, the heated exhaust gas exhausted from the measuring apparatus 1 is forcibly supplied from the air supply port 5 using the air supply fan 6.

【0009】このように、上記実施例では、測定装置1
の排気口4と恒温槽2の給気口6とを給排気ダクト10
で接続することによって、恒温槽2は測定装置1から給
気された排気熱を利用することにより補助的に昇温さ
れ、さらに、温度制御ヒータ9と排気ファン7とを所望
の温度になるよう動作させることにより、恒温槽2を適
温に設定することができる。
As described above, in the above embodiment, the measuring device 1
The exhaust port 4 and the air supply port 6 of the thermostatic chamber 2 to the air supply / exhaust duct 10
The temperature of the temperature control heater 9 and the exhaust fan 7 is set to a desired temperature by connecting the temperature control heater 9 and the exhaust fan 7 to each other by using the exhaust heat supplied from the measuring device 1 to make the temperature of the constant temperature bath 2 auxiliary. By operating it, the constant temperature bath 2 can be set to an appropriate temperature.

【0010】また、測定装置1の排気口4と恒温槽2の
給気口6とを給排気ダクト10より接続することによ
り、排気口4および給気口6が密閉されることとなるの
で、排気ファン3,7の騒音を遮蔽することができ、騒
音が抑制できる。
Further, by connecting the exhaust port 4 of the measuring apparatus 1 and the air supply port 6 of the thermostatic chamber 2 from the air supply / exhaust duct 10, the exhaust port 4 and the air supply port 6 are sealed. The noise of the exhaust fans 3 and 7 can be shielded, and the noise can be suppressed.

【0011】なお、上記実施例では、測定装置1と恒温
槽2を給排気ダクト10により接続することによって、
測定装置1からの排気熱を直接的に利用したが、測定装
置1に冷却設備を設け、その冷却装置稼働時の発熱によ
る排気熱を恒温槽2に給気するようにしても同様の効果
が得られる。
In the above embodiment, the measuring device 1 and the constant temperature bath 2 are connected by the air supply / exhaust duct 10,
Although the exhaust heat from the measuring device 1 was directly used, the same effect can be obtained even if the measuring device 1 is provided with cooling equipment and the exhaust heat due to the heat generated during the operation of the cooling device is supplied to the constant temperature bath 2. can get.

【0012】また、上記実施例における半導体テスト装
置がバーンイン装置である場合、恒温槽2をバーンイン
炉として使用すれば、ウォッチングバーンイン装置とな
すことになり、一体化した装置として構成できる。さら
に、恒温槽2を高温ハンドラにおける予熱装置あるいは
高温ハンドラの恒温槽として使用しても、同様の効果が
得られる。
Further, when the semiconductor test apparatus in the above embodiment is a burn-in apparatus, if the constant temperature bath 2 is used as a burn-in furnace, it becomes a watching burn-in apparatus, which can be constructed as an integrated apparatus. Further, even if the constant temperature bath 2 is used as a preheating device in a high temperature handler or a constant temperature bath of a high temperature handler, the same effect can be obtained.

【0013】[0013]

【発明の効果】以上のように、この発明に係る半導体テ
スト装置によれば、測定装置1の排気口4と恒温槽2の
給気口6とを給排気ダクト10で密閉して接続すること
により、測定装置1から生ずる排気熱を恒温槽2での温
度設定のための昇温に有効利用するように構成したの
で、測定装置1からの排気によるファンの騒音が遮蔽さ
れ、室温の上昇も抑制できるとともに、省電力化が可能
となる効果がある。
As described above, according to the semiconductor test apparatus of the present invention, the exhaust port 4 of the measuring apparatus 1 and the air supply port 6 of the thermostatic chamber 2 are hermetically connected by the air supply / exhaust duct 10. With this configuration, the exhaust heat generated from the measuring device 1 is effectively used to raise the temperature for setting the temperature in the constant temperature bath 2. Therefore, the noise of the fan due to the exhaust gas from the measuring device 1 is shielded and the room temperature rises. There is an effect that the power consumption can be saved as well as being suppressed.

【図面の簡単な説明】[Brief description of drawings]

【図1】この発明の一実施例による半導体テスト装置の
外観を示す図である。
FIG. 1 is a diagram showing an external view of a semiconductor test apparatus according to an embodiment of the present invention.

【符号の説明】 1 測定装置 2 恒温槽 3,7 排気ファン 4 排気口 5 給気ファン 6 給気口 8 排気ダクト 9 温度制御ヒータ 10 給排気ダクト[Explanation of symbols] 1 measuring device 2 constant temperature bath 3, 7 exhaust fan 4 exhaust port 5 air supply fan 6 air supply port 8 exhaust duct 9 temperature control heater 10 supply / exhaust duct

─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───

【手続補正書】[Procedure amendment]

【提出日】平成4年2月13日[Submission date] February 13, 1992

【手続補正1】[Procedure Amendment 1]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0008[Correction target item name] 0008

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0008】次に動作について説明する。テスト中の発
熱により測定装置1より生じる熱された空気は排気ファ
ン3を用いて、排気口4から強制排気される。一方、恒
温槽2は給気口から給気ファンを用いて、測定装置
1より排気されてきた熱された排気が強制給気される。
Next, the operation will be described. Air heated by the measuring device 1 due to heat generation during the test is forcedly exhausted from the exhaust port 4 by using the exhaust fan 3. On the other hand, in the thermostatic chamber 2, the heated exhaust gas exhausted from the measuring device 1 is forcibly supplied from the air supply port 6 using the air supply fan 5 .

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 半導体装置のテスト時の動作を測定する
測定装置と、該測定装置に併設され、テスト時温度を所
定の温度に保つ恒温槽とを有する半導体テスト装置にお
いて、 前記測定装置と恒温槽とを接続する給排気ダクトを備
え、 該給排気ダクトを通して測定装置で生じた排気熱を恒温
槽に給気し、該恒温槽における温度制御に使用すること
を特徴とする半導体テスト装置。
1. A semiconductor test device comprising a measuring device for measuring the operation of a semiconductor device during a test, and a thermostat which is provided in parallel with the measuring device and which keeps a test temperature at a predetermined temperature. A semiconductor test device, comprising: an air supply / exhaust duct for connecting to a tank, wherein exhaust heat generated in a measuring device is supplied to the constant temperature tank through the air supply / exhaust duct and used for temperature control in the constant temperature tank.
JP3315540A 1991-10-31 1991-10-31 Semiconductor testing device Pending JPH05126901A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3315540A JPH05126901A (en) 1991-10-31 1991-10-31 Semiconductor testing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3315540A JPH05126901A (en) 1991-10-31 1991-10-31 Semiconductor testing device

Publications (1)

Publication Number Publication Date
JPH05126901A true JPH05126901A (en) 1993-05-25

Family

ID=18066576

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3315540A Pending JPH05126901A (en) 1991-10-31 1991-10-31 Semiconductor testing device

Country Status (1)

Country Link
JP (1) JPH05126901A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100387998C (en) * 2006-02-06 2008-05-14 友达光电股份有限公司 Burn-in device
JP2009117318A (en) * 2007-11-06 2009-05-28 Powertech Technology Inc Method for raising temperature of chamber and its heating device
JP2010025920A (en) * 2008-06-18 2010-02-04 Espec Corp Environmental testing device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100387998C (en) * 2006-02-06 2008-05-14 友达光电股份有限公司 Burn-in device
JP2009117318A (en) * 2007-11-06 2009-05-28 Powertech Technology Inc Method for raising temperature of chamber and its heating device
JP2010025920A (en) * 2008-06-18 2010-02-04 Espec Corp Environmental testing device

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