JPH0150872B2 - - Google Patents

Info

Publication number
JPH0150872B2
JPH0150872B2 JP59107623A JP10762384A JPH0150872B2 JP H0150872 B2 JPH0150872 B2 JP H0150872B2 JP 59107623 A JP59107623 A JP 59107623A JP 10762384 A JP10762384 A JP 10762384A JP H0150872 B2 JPH0150872 B2 JP H0150872B2
Authority
JP
Japan
Prior art keywords
temperature
measuring device
tester
constant temperature
circuit component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP59107623A
Other languages
Japanese (ja)
Other versions
JPS60252276A (en
Inventor
Katsumi Takami
Jukichi Yamaguchi
Fujio Ozawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
Original Assignee
Hitachi Electronics Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Electronics Engineering Co Ltd filed Critical Hitachi Electronics Engineering Co Ltd
Priority to JP59107623A priority Critical patent/JPS60252276A/en
Publication of JPS60252276A publication Critical patent/JPS60252276A/en
Publication of JPH0150872B2 publication Critical patent/JPH0150872B2/ja
Granted legal-status Critical Current

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  • Testing Of Individual Semiconductor Devices (AREA)

Description

【発明の詳細な説明】 〔発明の利用分野〕 本発明は、半導体素子等の回路部品の電気的特
性を測定するための装置に係り、さらに詳しくは
回路部品を実稼動した状態まで温度条件を変え、
そのときの回路特性を測定すると共に、その測定
器自身の温度上昇をなくすべく冷却できるように
した回路部品の測定装置に関するものである。
[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a device for measuring the electrical characteristics of circuit components such as semiconductor devices, and more specifically, to a device for measuring the electrical characteristics of circuit components such as semiconductor devices, and more specifically, to a device for measuring the electrical characteristics of circuit components such as semiconductor devices, and more particularly, to change,
The present invention relates to a circuit component measuring device that measures the circuit characteristics at that time and is capable of cooling the measuring device itself to prevent a rise in temperature.

〔発明の背景〕[Background of the invention]

半導体素子等(以下ICと称する)は、信頼性
の向上を図る目的等から種々の検査をする必要が
ある。一般にこの種の測定装置はICテスターと
称し、ICの電気的特性を実稼動条件でチエツク
するための測定装置である。このICテスターは、
種々のICを測定することから回路構成は複雑で、
ICの数も多く、発熱量も多い。すなわち、多量
のプリント基板と回路素子を有するICテスター
は内部発熱を著しく大きいため、その発熱部をフ
アンにより強制的に冷却する構成がとられるが、
それでも内部温度上昇は許容範囲を超す場合があ
る。ICテスターに限らず、プリント基板の数は
増大するにもかかわらず、収納部である本体ケー
スは小型化が要求されるが、本体ケースが小型化
されればさらに冷却条件は悪くなり、内部温度は
上昇する一方で、危険範囲に達する。
Semiconductor devices (hereinafter referred to as ICs) need to be subjected to various tests in order to improve their reliability. Generally, this type of measuring device is called an IC tester, and is a measuring device for checking the electrical characteristics of an IC under actual operating conditions. This IC tester is
The circuit configuration is complex because it measures various ICs.
The number of ICs is large, and the amount of heat generated is large. In other words, IC testers that have a large number of printed circuit boards and circuit elements generate a significant amount of internal heat, so a configuration is used in which the heat generating parts are forcibly cooled using a fan.
Even so, the internal temperature rise may exceed the allowable range. Despite the increase in the number of printed circuit boards, not only for IC testers, the housing case, which is the storage part, must be made smaller. However, if the main body case is made smaller, the cooling conditions will become even worse, and the internal temperature will increase. continues to rise, reaching a dangerous range.

そこで、冷却対策として、ICテスターを設置
する部屋全体を冷却するための冷房機を設置する
等の対策がなされるが、ICテスター自身の冷却
効果は上らず、冷房設備に要する費用並びに電気
代も多大なものとななり、得策ではない。
Therefore, as a cooling measure, measures such as installing an air conditioner to cool the entire room where the IC tester is installed are taken, but the cooling effect of the IC tester itself is not improved, and the cost of cooling equipment and electricity costs are increased. It would also be a huge expense, so it's not a good idea.

〔発明の目的〕[Purpose of the invention]

本発明は、前記した従来技術の問題点に鑑みな
されたものであつて、回路部品の測定器の冷却が
高効率に行え、信頼性が高く、安価な回路部品測
定装置を提供することにある。
The present invention has been made in view of the problems of the prior art described above, and it is an object of the present invention to provide a highly reliable and inexpensive circuit component measuring device that can cool a circuit component measuring device with high efficiency. .

〔発明の概要〕[Summary of the invention]

本発明の特徴は、回路部品の特性検査をする
際、温度条件を変えるために恒温槽内に供給する
ために用意した冷却媒体を、回路部品の測定器内
にも供給し、その測定器内を冷却して温度上昇を
防止した点である。
A feature of the present invention is that when testing the characteristics of circuit components, the cooling medium prepared for supplying into the thermostatic chamber to change the temperature conditions is also supplied to the measuring instrument for the circuit components. The point is that the temperature rise was prevented by cooling.

〔発明の実施例〕[Embodiments of the invention]

以下、添付図に従つて本発明の一実施例を詳述
する。第1図は集積回路部品の測定装置の全体的
構成図であつて、図中、1は集積回路部品の特性
を測定するICテスター、2はそのICテスター1
の本体ケース内を冷却するフアン、3は高低温ハ
ンドラーで、内側上方部に恒温槽4を内蔵し、下
方部側方に液体窒素ボンベ5を備えている。6は
切換バルブで、液体窒素ボンベ5からの窒素を恒
温槽4とICテスター1に送給切換えをするため
のものである。7は液体窒素ボンベ5の口部に取
付けた電磁弁、8,9,10,11、はガスパイ
プである。
Hereinafter, one embodiment of the present invention will be described in detail with reference to the accompanying drawings. Figure 1 is an overall configuration diagram of a measuring device for integrated circuit components, in which 1 is an IC tester that measures the characteristics of integrated circuit components, and 2 is the IC tester 1.
A fan 3 for cooling the inside of the main body case is a high-temperature handler, which has a constant temperature bath 4 built into the upper part of the inside, and a liquid nitrogen cylinder 5 on the side of the lower part. A switching valve 6 is used to switch the supply of nitrogen from the liquid nitrogen cylinder 5 to the thermostatic chamber 4 and the IC tester 1. 7 is a solenoid valve attached to the mouth of the liquid nitrogen cylinder 5, and 8, 9, 10, and 11 are gas pipes.

第2図は第1図の要部構成をさらに詳しく示す
と共に、その動作説明をするための構成図であつ
て、第1図と同一符号を付してあるものは同一の
ものを示す。第2図において、12はICテスタ
ー1の本体ケース内に取付けられた温度検出素
子、13は恒温槽4内に取付けられた温度検出素
子、14は恒温槽4内の空気を循環するためのフ
アン、15は恒温槽4内の温度を高めるヒータ
ー、16はIC素子の測定部であつて、図示省略
してあるが、IC素子の入出力端子とICテスター
1とは配線接続してあり、所定の特性測定ができ
るものである。17は恒温槽4内の温度を調節す
るための温度調節器であつて、温度検出素子1
2,13よりの温度検出信号を入力とし、ヒータ
ー15をオン、オフおよび電磁弁7をオン、オフ
制御して、恒温槽4内の温度を変え得るように構
成してある。
FIG. 2 is a block diagram showing the main structure of FIG. 1 in more detail and for explaining its operation, and the same reference numerals as in FIG. 1 indicate the same parts. In FIG. 2, 12 is a temperature detection element installed inside the main body case of the IC tester 1, 13 is a temperature detection element installed inside the thermostatic oven 4, and 14 is a fan for circulating the air inside the thermostatic oven 4. , 15 is a heater that raises the temperature inside the thermostatic chamber 4, and 16 is a measuring section for the IC element. Although not shown, the input/output terminals of the IC element and the IC tester 1 are connected by wiring, and It is possible to measure the characteristics of 17 is a temperature controller for adjusting the temperature inside the constant temperature bath 4, and the temperature detecting element 1
The temperature detection signal from 2 and 13 is inputted, and the heater 15 is turned on and off, and the electromagnetic valve 7 is controlled on and off, so that the temperature inside the thermostatic oven 4 can be changed.

第1図、第2図に示す如く構成された装置によ
れば、まず、ハンドラーである測定部16に配置
されたIC素子を低温状態で試験する場合は、温
度調節器17の出力信号により電磁弁7が開か
れ、液体窒素が送給される。その液体窒素は、実
線状態に切換えられた切換バルブ6を介して恒温
槽4へ送給され、気化すると共にフアン14によ
り循環される。その窒素ガスにより測定部16に
あるIC素子は冷却され、図示されていない配線
経路を介してICテスター1により適宜の測定が
なされる。
According to the apparatus configured as shown in FIGS. 1 and 2, when testing an IC element placed in the measuring section 16, which is a handler, in a low temperature state, an output signal from the temperature controller 17 is used to conduct an electromagnetic test. Valve 7 is opened and liquid nitrogen is supplied. The liquid nitrogen is fed to the constant temperature bath 4 via the switching valve 6 which is switched to the solid line state, and is circulated by the fan 14 while being vaporized. The nitrogen gas cools the IC element in the measuring section 16, and appropriate measurements are performed by the IC tester 1 via a wiring path (not shown).

それと同時に、フアン14により循環された窒
素ガスは、ICテスター1内のフアン2により吸
引され、パイプ11、切換バルブ6、パイプ8を
介してICテスター1に導かれ、ICテスター1内
を窒素ガスにより冷却する。なお、温度検出素子
12,13並びに温度調節器17により、電磁バ
ルブ7は開閉制御され、恒温槽4内の測定部は所
定の低温度に保たれるようにしてある。そしてま
た、恒温槽4のパイプ11との接続部分は所定の
長さ以上に採りICテスター1側へ窒素ガスが送
給されたとき、過冷却のためにその部分に水蒸気
(露状気体)が併発しないように形成してある。
At the same time, the nitrogen gas circulated by the fan 14 is suctioned by the fan 2 inside the IC tester 1 and guided to the IC tester 1 via the pipe 11, the switching valve 6, and the pipe 8, and the nitrogen gas circulates inside the IC tester 1. Cool down. The electromagnetic valve 7 is controlled to open and close by the temperature detecting elements 12 and 13 and the temperature regulator 17, so that the measuring section in the thermostatic chamber 4 is maintained at a predetermined low temperature. Furthermore, the connecting part of the thermostatic chamber 4 to the pipe 11 is longer than a predetermined length, so that when nitrogen gas is supplied to the IC tester 1 side, water vapor (dew gas) is generated in that part due to supercooling. It is designed so that they do not occur together.

これによつて、恒温槽4内を試験目的のために
冷却できると共に、ICテスター内をその冷気を
使つて冷却でき、ICテスター内の回路素子を高
温破壊等から保護できる。
As a result, the inside of the constant temperature chamber 4 can be cooled for testing purposes, and the inside of the IC tester can be cooled using the cold air, thereby protecting the circuit elements inside the IC tester from high temperature damage.

また、恒温槽4を高温度化して、測定部16に
あるIC素子を高温度状態で試験する場合は、切
換バルブ6を回動し、パイプ8,9を破線の如く
接続すると共に、温度調節器17よりの出力信号
でもつてヒーター15の電源回路を閉成し、その
ヒータ15に電源供給する。それによつて、恒温
槽4内は高温度となり、測定部16にあるIC素
子は加熱され、やはり図示さていない配線経路を
介して適宜の試験がなされる。そして、その場合
は、温度調節器17よりの信号でもつて電磁弁7
は開路され液体窒素は送出されるが、切換バルブ
6でもつて破線で示す経路で供給され、ICテス
ター1側のみが冷却され、ICテスター1内の回
路素子を高温破壊から保護する。そして、また、
ICテスター1内の温度検出素子により内部温度
を検知し、温度調節器17にその検知信号を送出
し、電磁弁7を適宜開口制御することによつて、
ICテスター1内において、窒素ガス導入によつ
て水蒸気を発生することはない。
In addition, when increasing the temperature of the constant temperature chamber 4 to test the IC element in the measuring section 16 in a high temperature state, rotate the switching valve 6, connect the pipes 8 and 9 as shown in the broken line, and adjust the temperature. The output signal from the heater 17 closes the power supply circuit of the heater 15 and supplies power to the heater 15. As a result, the temperature inside the thermostatic chamber 4 becomes high, and the IC element in the measuring section 16 is heated, and an appropriate test is performed via a wiring path (not shown). In that case, the signal from the temperature controller 17 also causes the solenoid valve 7 to
is opened and liquid nitrogen is sent out, but it is also supplied through the switching valve 6 through the path shown by the broken line, and only the IC tester 1 side is cooled to protect the circuit elements inside the IC tester 1 from being damaged by high temperatures. and again,
By detecting the internal temperature with the temperature detection element in the IC tester 1, sending the detection signal to the temperature controller 17, and controlling the opening of the solenoid valve 7 as appropriate,
In the IC tester 1, no water vapor is generated by introducing nitrogen gas.

なお、切換バルブ6の回動制御は手動制御の
他、恒温槽内の温度制御に応じて、駆動するソレ
ノイドによつて自動的に回転駆動することもでき
る。
In addition to manual control, the rotation of the switching valve 6 can also be controlled automatically by a solenoid driven according to the temperature control in the thermostatic chamber.

〔発明の効果〕 上述の実施例からも明らかなように本発明によ
れば、恒温槽内を低温化するための媒体を利用し
て、被測定部品の特性を検査する測定装置内を冷
却するように構成したものであるから、測定装置
を構成する集積回路素子等の回路部品を高温破壊
から保護できると共に、冷気を有効利用でき省エ
ネルギー化にも寄与できるものである。
[Effects of the Invention] As is clear from the above-mentioned embodiments, according to the present invention, a medium for lowering the temperature of the inside of a thermostatic chamber is used to cool the inside of a measuring device for testing the characteristics of a part to be measured. With this configuration, circuit components such as integrated circuit elements constituting the measuring device can be protected from high-temperature damage, and cold air can be used effectively, contributing to energy saving.

【図面の簡単な説明】[Brief explanation of drawings]

添付図は本発明の一実施例を説明するための図
であつて、第1図は集積回路部品の測定装置の全
体的構成図、第2図は第1図の要部をさらに詳し
く示した構成図である。 1……ICテスター、2,14……フアン、3
……高低温ハンドラー、4……恒温槽、5……液
体窒素ボンベ、6……切換バルブ、7……電磁
弁、8〜11……パイプ、12,13……温度検
出素子、15……ヒーター、16……測定部。
The attached drawings are diagrams for explaining one embodiment of the present invention, in which Fig. 1 is an overall configuration diagram of a measuring device for integrated circuit components, and Fig. 2 shows the main parts of Fig. 1 in more detail. FIG. 1... IC tester, 2, 14... Juan, 3
...High temperature and low temperature handler, 4 ... Constant temperature bath, 5 ... Liquid nitrogen cylinder, 6 ... Switching valve, 7 ... Solenoid valve, 8 to 11 ... Pipe, 12, 13 ... Temperature detection element, 15 ... Heater, 16...Measurement section.

Claims (1)

【特許請求の範囲】[Claims] 1 半導体素子等の回路部品を被測定部品として
収容し、ヒーター並びに冷却媒体により該被測定
部品を高低温化状態とする恒温槽と、該恒温槽内
の被測定部品と電気的接続がなされ、高低温各々
の条件で被測定部品の特性検査をするための回路
部品の測定器とを有して成る回路部品の測定装置
であつて、前記恒温槽に供給される冷却媒体を、
該恒温槽より排出させ、恒温槽内を高低温化する
際に冷却媒体送給経路を切換えるバルブを介して
回路部品の測定器に供給するように構成したこと
を特徴とする回路部品の測定装置。
1. A constant temperature chamber that accommodates circuit components such as semiconductor elements as components to be measured and keeps the components to be measured at a high temperature using a heater and a cooling medium, and electrically connected to the components to be measured within the constant temperature chamber; A circuit component measuring device comprising a circuit component measuring device for inspecting the characteristics of the component to be measured under high and low temperature conditions, the cooling medium being supplied to the constant temperature oven,
A circuit component measuring device characterized in that the circuit component measuring device is configured to discharge the coolant from the constant temperature chamber and supply the coolant to a circuit component measuring device via a valve that switches the cooling medium supply route when the temperature inside the constant temperature chamber is raised to a high temperature. .
JP59107623A 1984-05-29 1984-05-29 Measuring instrument of circuit component Granted JPS60252276A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59107623A JPS60252276A (en) 1984-05-29 1984-05-29 Measuring instrument of circuit component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59107623A JPS60252276A (en) 1984-05-29 1984-05-29 Measuring instrument of circuit component

Publications (2)

Publication Number Publication Date
JPS60252276A JPS60252276A (en) 1985-12-12
JPH0150872B2 true JPH0150872B2 (en) 1989-10-31

Family

ID=14463874

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59107623A Granted JPS60252276A (en) 1984-05-29 1984-05-29 Measuring instrument of circuit component

Country Status (1)

Country Link
JP (1) JPS60252276A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2520558Y2 (en) * 1990-06-29 1996-12-18 日立電子エンジニアリング株式会社 Low temperature handler
JP2757609B2 (en) * 1991-07-31 1998-05-25 日立電子エンジニアリング株式会社 IC handler temperature control method
JP2705420B2 (en) * 1991-12-27 1998-01-28 日立電子エンジニアリング株式会社 Temperature control method of low temperature handler

Also Published As

Publication number Publication date
JPS60252276A (en) 1985-12-12

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