GB2604985A - The temperature-vacuum impacting device - Google Patents

The temperature-vacuum impacting device Download PDF

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Publication number
GB2604985A
GB2604985A GB2118558.2A GB202118558A GB2604985A GB 2604985 A GB2604985 A GB 2604985A GB 202118558 A GB202118558 A GB 202118558A GB 2604985 A GB2604985 A GB 2604985A
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GB
United Kingdom
Prior art keywords
under test
vacuum
samples under
peltier element
air cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB2118558.2A
Other versions
GB2604985B (en
Inventor
Aleksandrovich Likii Arsenij
Iurevich Nasonov Andrei
Salakhdinovich Sheikho Anton
Petrovich Shukhtin Kondratii
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Ostec Electro Ltd
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Ostec Electro Ltd
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Filing date
Publication date
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Publication of GB2604985A publication Critical patent/GB2604985A/en
Application granted granted Critical
Publication of GB2604985B publication Critical patent/GB2604985B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/72—Investigating presence of flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2862—Chambers or ovens; Tanks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2868—Complete testing stations; systems; procedures; software aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2877—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to cooling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/021—Control thereof
    • F25B2321/0212—Control thereof of electric power, current or voltage
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/023—Mounting details thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025—Removal of heat
    • F25B2321/0251—Removal of heat by a gas

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Resistance To Weather, Investigating Materials By Mechanical Methods (AREA)

Abstract

Equipment for testing and measuring an electronic component base (ECB) incorporates a hermetically sealed framework housing or platform 2 with measurement channels tipped with pogo pins 5, connected by a sealed connector 7, as the interface for connecting the samples under test. A thermal group 6 for heating and cooling the samples under test contains a Peltier element, a contact surface 4 for the heat exchange with the samples under test, and an air cooling system to absorb heat generated by the Peltier element. The air cooling system contains a cooler, water pump, and a liquid-flow air cooling radiator with fans. A raisable hood 1 can be opened to place and connect the sample under test. A vacuum system consisting of a vacuum pump, switching solenoid, electronic vacuum meter and connecting tubes is provided. The Peltier element and air cooler provide quick temperature setting for the test and the vacuum system prevents ice formation and short circuits at low temperatures.

Description

The temperature-vacuum impacting device
Technical field of the invention
The invention relates to the equipment for testing and measuring the technical parameters of electronic component base (ECB).
Background art
According to GOST 16504-81, the testing means determining experimentally the products specifications and quality parameters while in operation or under a simulation of operational conditions.
The devices operational instability is caused by the environmental impact and the devices internal changes. The electronic devices operation is significantly impacted by climatic factors: temperature, moisture, atmospheric pressure, sun radiation, wind loading.
The modern technical equipment is operated in widely varying climatic environment. The impact of high or low temperature is one of the main factors causing instability and parameters degradation of any device. The equipment operating temperature range is determined by the external climatic impact, and the device internal heat sources.
The majority of the modern ECB thermal testing systems are heating cabinets (ovens) and cooling chambers (refrigerators).
There exist thermoelectric heating and cooling installations for the equipment testing in the air environment, for example according to the patent RU 2129745 Cl, published on Apr. 27, 1999, according to the patent RU 2400723 Cl, published on Sep. 27, 2010. The existing test installations incorporate thermally insulated chamber of constant volume for housing of the device under test, where cooling and heating systems and the fan are installed, along with the chamber air environment parameters sensors The existing solutions drawbacks are: - icing, occurring at the negative temperatures, due to the ECB testing performed in the air environment in the closed volume at normal atmospheric pressure, causing icing at the negative temperatures, leading to possible short circuiting of the tested samples leads; - long time for attaining of the required temperature; -uneven temperature distribution in the whole testing volume, leading to unequal samples testing conditions.
Existing state of the art includes thermoelements based on the Peltier effect. Such equipment can operate to provide both cooling and heating without using additional means in their construction.
The Peltier effect consists in releasing or absorbing heat when the electric current flows through the contact of two different conductors. The term "Peltier element-is used for a thermoelectric converter (TEM, MT, TES), which operates using the Peltier effect -creation of the temperature difference while electric current flows. Operation of the Peltier elements is based on the contact of two electrically conducting materials having different electron energy levels in the conduction zone. When electrical current flows through the contact of such materials, an electron must get the energy for transiting into higher energy conduction zone of other semiconductor.
The advantages of the Peltier elements are compact design, absence of any moving parts, as well as of gases and liquids. When changing the current direction, both the element cooling and heating are possible.
Existing state of the art includes different solutions allowing to implement electronic component testing, which operate utilizing the Peltier elements.
The nearest to the suggested technical solution, by its technical nature, is the testing device which implements the electronic components testing method described in the patent RU 2643239 Cl published on Jan. 31, 2018.
The testing device incorporates a hermetically sealed framework housing with measurement channels passed inside it, which serve for connecting the samples under test; thermal group, intended for heating and cooling the samples under test, which contains a Peltier element and a contact surface providing for heat exchange between the Peltier element and the samples under test,heat sink; raisable hood, with the possibility of opening, placing and connecting the sample under test; electronic units for control, switching and communication with external computer; power supplies; external protection casing.
The drawbacks of the existing solution are: -icing, occurring at the negative temperatures, due to the ECB testing performed in the air environment in the closed volume at normal atmospheric pressure, causing icing at the negative temperatures, leading to possible short circuiting of the tested samples leads; -absence of rigid electrical contacts inside the device working volume, which provide for the connection of the samples under test and do not disrupt the sealing of the working volume, leading to absence of secure contact of the device and the sample under test during testing.
Disclosure of the invention
Temperature-vacuum impacting device for testing and measuring the technical parameters of electronic component base (ECB) contains: a hermetically sealed framework housing with measurement channels tipped with pogo pins passed inside it through sealed connector, which serve as the interface for connecting the samples under test; thermal group, intended for heating and cooling the samples under test, which contains a Peltier element and a contact surface providing for heat exchange between the Peltier element and the samples under test; air cooling system, intended for the absorption of heat generated by the Peltier elements, that contains: cooler, water pump, liquid-flow air cooling radiator with fans and connecting tubes; raisable hood, with the possibility of opening, placing and connecting the sample under test; vacuum system, consisting of vacuum pump, switching solenoid, electronic vacuum-meter and connecting tubes; electronic units for control, switching and communication with external computer; power supplies and PID controller; external protection casing.
The usage of air cooling system provides for speedily attaining of the required temperature. C\I
C\i The usage of the vacuum system prevents icing at the negative temperatures, and as a result, the possible short circuiting of the tested samples leads is excluded CD The usage of pogo pins for connecting the samples under test provides for
CO
C\I quick and fast electrical contact of the device and the sample under test.
Thus, the technical results, which are targeted by the claimed invention, are the provision of quick and fast electrical contact of the device and the sample under test, exclusion of the possibility of short circuiting of the tested samples leads at the negative temperatures.
Brief description of the drawings Fig. 1 depicts the device drawing.
Fig. 2 depicts the vertical cross section of the device.
The invention implementation The temperature-vacuum impacting device is a table-top instrument, having a working zone, located at the top, which contains: a hermetically sealed framework housing 2 with measurement channels tipped with pogo pins 5 passed inside it through sealed connector 7, which serve as the interface for connecting the samples under test; thermal group 6, intended for heating and cooling the samples under test, which contains a Peltier element and a contact surface 4 providing for heat exchange between the Peltier element and the samples under test; air cooling system, intended for the absorption of heat generated by the Peltier elements, that contains: cooler 3, water pump, liquid-flow air cooling radiator with fans and connecting tubes; raisable hood 1, with the possibility of opening, placing and connecting the sample under test; vacuum system, consisting of: vacuum pump, switching solenoid, electronic vacuum-meter and connecting tubes electronic units for control, switching and communication with external computer; power supplies and PID controller; external protection casing.
The device features are: attaining the required temperatures under low vacuum; transfer of the temperature impact to the sample under test by way of direct contact with heat transmitter, i.e. "physical body -physical body"; small working volume for placing the sample under test; the functions of both heating and cooling are performed by a single Peltier element; connection of the sample under test in the working volume by pogo pins.
The device has hermetically sealed internal volume, which contains the 4-stage Peltier module, printed circuit board with pogo pins 5, heat transmitter with internal temperature sensor.
To provide for the sealed volume after opening the hood 1 and placing the sample under test, closing and tight contact with the platform 2, there is a sealing ring, as well as a clamp that fixes the hood. The hermetically sealed platform 2 itself is composed of two sheets: the upper one of polyoxymethylene POM-C, with low thermal conductivity, and the lower of aluminum alloy, that participates in the heat exchange as the "frame" In the middle of the two sheets tightly bolted one to another, with a sealing ring between them, there is an empty space, where the following is located: 4-stage Peltier element, printed circuit board with pogo pins 5, and copper heat transmitter, which is a contact surface providing for the heat exchange between the Peltier element and the samples under test. Inside the heat transmitter there is a platinum temperature sensor Pt-100, separated from the surface of the sample by the distance not exceeding 1 mm. On the lower aluminum sheet of the platform there also are: sealed connector of the measurement channels, sealed connector of power supply, pass through vacuum fitting, and also the cooler 3, mounting brackets of water pump and air cooling radiator.
The main element of heat removal is the cooler 3, which is located right underneath the Peltier element. The liquid, circulating through closed circuit, dissipates excess heat by means of the liquid-flow air cooling radiator. The distilled water is used as the working fluid.
Control, switching, and precision temperature regulation are provided by the external computer commands, sent to the PID controller and electronic switching units.
The set temperatures range is from 65°C below zero to 125°C above zero. The setting precision is ±0,5°C. The time of attaining the required temperature does not exceed 10 minutes.
The temperature-vacuum impacting device operation is based on the application of the 4-stage Peltier element that has large cooling capacity margin. The required temperature is attained by supplying power to the Peltier element by means of the electronic switch, controlled by PID controller, and changing the supplied power polarity.
The compact working zone for placing and connecting the sample under test using low themial conductivity materials provide for low magnitude of spurious incoming heat flows.
After creation of low vacuum in the working volume, icing is not present upon attaining the low temperatures. The temperature impact is transferred to the sample under test by means of a contact method through the heat exchanger.
Temperature control is provided by the use of temperature sensor, connected to the electronic switch and mounted in close proximity to the surface of the sample under test, directly in the body of the heat exchanger.
The switching on and off of the vacuum system and the air cooling system is done by the electronic switch by means of the automation when setting the temperature and starting the cooling or heating the sample under test. For this purpose, the said automation could be either an external computer, or the simplest analogue unit, providing the on and off switching of the vacuum system and the air cooling system at the on and off switching of the device. Besides, a possible implementation option could be the switching on and off the vacuum system and the air cooling system by the P1D controller upon the attaining the required temperature.

Claims (1)

  1. Claims of the invention The temperature-vacuum impacting device for testing and measuring the technical parameters of electronic component base (ECB), incorporating a hermetically sealed framework housing with measurement channels passed inside it, which serve for connecting the samples under test, thermal group, intended for heating and cooling the samples under test, which contains a Peltier element and a contact surface providing for heat exchange between the Peltier element and the samples under test, heat sink, raisable hood, with the possibility of opening, placing and connecting the sample under test, electronic units for control, switching and communication with external computer, power supplies, external protection casing, differing by additionally having air cooling system, intended for the absorption of heat generated by the Peltier elements, and containing the cooler, water pump, liquid-flow air cooling radiator with fans and connecting tubes, vacuum system, consisting of vacuum pump, switching solenoid, electronic vacuum-meter and connecting tubes, PID controller, while the measurement channels are passed inside the hermetically sealed framework housing through sealed connector and are tipped with pogo pins, which serve as the interface for connecting the samples under test.
GB2118558.2A 2021-03-19 2021-12-20 The temperature-vacuum impacting device Active GB2604985B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
RU2021107328A RU2756337C1 (en) 2021-03-19 2021-03-19 Device for temperature and vacuum exposure

Publications (2)

Publication Number Publication Date
GB2604985A true GB2604985A (en) 2022-09-21
GB2604985B GB2604985B (en) 2023-07-26

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CH (1) CH718448A2 (en)
DE (1) DE102021215119A1 (en)
FR (1) FR3120943A1 (en)
GB (1) GB2604985B (en)
NL (1) NL2030144B1 (en)
RU (1) RU2756337C1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114216924B (en) * 2021-12-06 2023-08-25 中船九江大正科技有限公司 Temperature simulation test box based on incremental PID algorithm

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS639945A (en) * 1986-07-01 1988-01-16 Fujitsu Ltd Measuring method of electrical characteristic in vacuum
US20160025801A1 (en) * 2014-07-25 2016-01-28 Korea University Research And Business Foundation Probe station for the simultaneous measurement of thermal and electrical characteristics of thermoelectric module
RU2643239C1 (en) * 2017-01-20 2018-01-31 Общество с ограниченной ответственностью "Тау Индастриз" Method of testing electronic components

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2129745A1 (en) 1970-06-19 1971-12-30 Hauni Werke Koerber & Co Kg Method and device for producing a tube from packaging material
US4848090A (en) * 1988-01-27 1989-07-18 Texas Instruments Incorporated Apparatus for controlling the temperature of an integrated circuit package
RU2129745C1 (en) 1997-02-28 1999-04-27 Институт химических проблем микроэлектроники Thermoelectric cooler for chromatograph
DE102005001163B3 (en) * 2005-01-10 2006-05-18 Erich Reitinger Semiconductor wafers` testing method, involves testing wafer by probes, and reducing heating energy with constant cooling efficiency, under consideration of detected increase of temperature of fluids flowing via tempered chuck device
US7457117B2 (en) * 2006-08-16 2008-11-25 Rambus Inc. System for controlling the temperature of electronic devices
US7663388B2 (en) * 2007-03-30 2010-02-16 Essai, Inc. Active thermal control unit for maintaining the set point temperature of a DUT
RU2400723C1 (en) 2009-06-15 2010-09-27 Федеральное государственное унитарное предприятие Ордена Трудового Красного Знамени научно-исследовательский институт радио Test chamber
ITMI20121157A1 (en) * 2012-06-29 2013-12-30 Eles Semiconductor Equipment S P A TESTING OF ELECTRONIC DEVICES WITH HEATERS AVAILABLE BETWEEN TEST CARDS AND ELECTRONIC DEVICES TO TEST
KR101923635B1 (en) * 2018-02-23 2019-02-27 주식회사 비티시스템 Camera Module Test Socket with Heat Control Function
KR102141803B1 (en) * 2019-05-28 2020-08-06 주식회사 에스에이티 test device for semiconductor package

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS639945A (en) * 1986-07-01 1988-01-16 Fujitsu Ltd Measuring method of electrical characteristic in vacuum
US20160025801A1 (en) * 2014-07-25 2016-01-28 Korea University Research And Business Foundation Probe station for the simultaneous measurement of thermal and electrical characteristics of thermoelectric module
RU2643239C1 (en) * 2017-01-20 2018-01-31 Общество с ограниченной ответственностью "Тау Индастриз" Method of testing electronic components

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RU2756337C1 (en) 2021-09-29
GB2604985B (en) 2023-07-26
NL2030144A (en) 2022-09-27
NL2030144B1 (en) 2023-05-19
FR3120943A1 (en) 2022-09-23
DE102021215119A1 (en) 2022-09-22
CH718448A2 (en) 2022-09-30

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