CN218003305U - Seebeck coefficient testing device for thermoelectric material - Google Patents
Seebeck coefficient testing device for thermoelectric material Download PDFInfo
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- CN218003305U CN218003305U CN202222199597.XU CN202222199597U CN218003305U CN 218003305 U CN218003305 U CN 218003305U CN 202222199597 U CN202222199597 U CN 202222199597U CN 218003305 U CN218003305 U CN 218003305U
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Abstract
The utility model relates to the technical field of thermoelectric material Seebeck coefficient testing, in particular to a thermoelectric material Seebeck coefficient testing device, which comprises a testing box provided with a sealed cavity, an air supply system used for conveying dry air into the sealed cavity and an air supply system used for conveying moisture into the sealed cavity; a humidity sensor, a test sample piece and a Seebeck coefficient test module are arranged in the sealed cavity; air supply system, supply vapour system and humidity transducer all are connected with the controller electricity, and humidity transducer sends the air humidity information of sealed intracavity to the controller, and the controller is opened according to air humidity information control air supply system or supply vapour system to adjust sealed intracavity humidity, consequently, the utility model discloses an air humidity in the sealed chamber can be adjusted to seebeck coefficient testing arrangement to the realization is to the humidity control of seebeck coefficient test module environment of locating.
Description
Technical Field
The utility model relates to a thermoelectric material seebeck coefficient test technical field especially relates to a thermoelectric material seebeck coefficient testing arrangement.
Background
The thermoelectric device is an energy conversion device that converts thermal energy into electrical energy based on the seebeck and soret effects. Electronic equipment and biomedical equipment provided with the flexible wearable thermoelectric device can reduce or eliminate the dependence on the daily life of people on batteries, and therefore, the thermoelectric device has a great market prospect.
When a thermoelectric device made of thermoelectric materials is used as an output power supply, in addition to the fact that high output voltage and output power density are important for meeting the requirements of various flexible sensors, the stability of the thermoelectric materials in a specific environment is a key for judging whether the thermoelectric device can be commercialized or not. The core of the thermoelectric device is a thermoelectric material, and the thermoelectric material has high sensitivity to the humidity and temperature of the environment in the process of converting thermal energy into electric energy.
The seebeck coefficient is an important parameter for measuring the thermoelectric conversion performance of the thermoelectric material. The method can be used for quickly, accurately and conveniently measuring the Seebeck coefficient of the thermoelectric material, and has important application value in the research and development processes of the thermoelectric material. However, the conventional device for testing the seebeck coefficient of the thermoelectric material cannot adjust humidity, and it is difficult to evaluate the influence of humidity on the seebeck coefficient of the thermoelectric material.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the technical problem that will solve is: the existing device for testing the Seebeck coefficient of the thermoelectric material cannot adjust the humidity.
In order to solve the technical problem, the utility model aims to provide a device for testing the seebeck coefficient of a thermoelectric material, which comprises a controller, a test box provided with a sealed cavity, a gas supply system used for conveying dry gas into the sealed cavity and a gas supply system used for conveying moisture into the sealed cavity;
a humidity sensor, a Seebeck coefficient testing module and a testing sample piece supported by thermoelectric materials are arranged in the sealed cavity; the air supply system, the steam supply system and the humidity sensor are all electrically connected with the controller.
As a preferred scheme, the gas supply system comprises a gas supply pipe, one end of the gas supply pipe is communicated with the sealed cavity, the other end of the gas supply pipe is connected with a gas source, and a first flow regulating valve is arranged on the gas supply pipe;
the steam supply system comprises a steam supply pipe, one end of the steam supply pipe is communicated with the sealing cavity, the other end of the steam supply pipe is connected with a steam source, and the steam supply pipe is provided with a second flow regulating valve;
the first flow regulating valve and the second flow regulating valve are both electrically connected with the controller.
Preferably, a spray head is arranged in the sealed cavity, and the end of the air supply pipe penetrates through the cavity wall of the sealed cavity in a sealed mode and is connected with the spray head.
Preferably, the bottom of the test box is provided with an exhaust pipe, and the exhaust pipe is provided with a control valve electrically connected with the controller.
Preferably, the drying gas is an inert gas.
As a preferred scheme, the seebeck coefficient testing module comprises a first temperature detecting piece, a second temperature detecting piece, a first semiconductor refrigerating piece and a second semiconductor refrigerating piece, and the testing sample piece is plate-shaped;
first semiconductor refrigeration piece with interval arrangement about the second semiconductor refrigeration piece, the left end subsides of test sample piece are established on the first semiconductor refrigeration piece, the right-hand member subsides of test sample piece are established on the second semiconductor refrigeration piece, the test end of first temperature detection piece with the left end butt of test sample piece, the test end of second temperature detection piece with the right-hand member butt of test sample piece.
According to a preferable scheme, a first thermistor is attached to the upper end of the first semiconductor refrigeration piece, a second thermistor is attached to the upper end of the second semiconductor refrigeration piece, and the first thermistor, the second thermistor, the first temperature detection piece, the second temperature detection piece, the first semiconductor refrigeration piece and the second semiconductor refrigeration piece are all electrically connected with the controller.
As a preferred scheme, a first heat conduction device is arranged at the lower end of the first semiconductor refrigeration piece, and the first heat conduction device is used for guiding cold or heat generated by the lower end of the first semiconductor refrigeration piece out of the sealed cavity;
and a second heat conduction device is arranged at the lower end of the second semiconductor refrigeration piece and used for guiding cold or heat generated by the lower end of the second semiconductor refrigeration piece out of the sealed cavity.
As a preferred scheme, the seebeck coefficient testing module comprises a first conductive probe and a second conductive probe, wherein the testing end of the first conductive probe is abutted with the left end of the testing sample piece, and the testing end of the second conductive probe is abutted with the right end of the testing sample piece;
an electrochemical workstation is arranged outside the test box, and the first conductive probe and the second conductive probe are electrically connected with the electrochemical workstation.
Preferably, a supporting column is arranged in the sealing cavity, the lower end of the supporting column is fixedly connected with the bottom wall of the sealing cavity, the upper part of the supporting column is connected with an installation seat in a vertical sliding manner, and the first temperature detection piece, the second temperature detection piece, the first conductive probe and the second conductive probe are all arranged on the lower part of one end, far away from the supporting column, of the installation seat;
and a locking mechanism is arranged between the mounting seat and the supporting column and used for fixing the mounting seat on the supporting column.
Compared with the prior art, the beneficial effects of the utility model reside in that:
the device for testing the Seebeck coefficient of the thermoelectric material comprises a testing box provided with a sealed cavity, an air supply system used for conveying dry air into the sealed cavity and an air supply system used for conveying moisture into the sealed cavity; a humidity sensor, a test sample piece and a Seebeck coefficient test module are arranged in the sealed cavity; air supply system, steam supply system and humidity transducer all are connected with the controller electricity, and humidity transducer sends the air humidity information of sealed intracavity to the controller, and the controller is opened according to air humidity information control air supply system or steam supply system to adjust sealed intracavity humidity, consequently, the utility model discloses a seebeck coefficient testing arrangement can adjust the air humidity in the sealed chamber, thereby realizes the humidity control to the environment that seebeck coefficient test module located.
Drawings
Fig. 1 is a schematic structural diagram of a seebeck coefficient testing device for thermoelectric materials according to the present invention;
FIG. 2 is an exploded view of various components within the test chamber;
in the figure, 1, test box; 11. sealing the cavity; 2. a first temperature detection member; 3. a second temperature detection member; 4. a first conductive probe; 5. a second conductive probe; 6. a first semiconductor refrigeration chip; 7. a second semiconductor refrigeration chip; 8. testing a sample piece; 9. a support frame; 91. a support pillar; 92. a mounting seat; 20. a first heat conducting device; 30. a second heat conducting device; 40. a first thermistor; 50. a second thermistor.
Detailed Description
The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "left", "right", "top", "bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention. It should be understood that the terms "first", "second", etc. are used herein to describe various information, but the information should not be limited to these terms, and these terms are only used to distinguish one type of information from another. For example, "first" information may also be referred to as "second" information, and similarly, "second" information may also be referred to as "first" information, without departing from the scope of the present invention.
As shown in fig. 1 and fig. 2, the preferred embodiment of the seebeck coefficient testing device for thermoelectric material of the present invention comprises a testing box 1 provided with a sealed cavity 11, a gas supply system for supplying dry gas into the sealed cavity 11, and a gas supply system for supplying moisture into the sealed cavity 11; a humidity sensor, a Seebeck coefficient testing module and a testing sample piece 8 supported by thermoelectric materials are arranged in the sealed cavity; the air supply system, the steam supply system and the humidity sensor are electrically connected with the controller, the humidity sensor sends air humidity information in the sealed cavity to the controller, and the controller controls the air supply system or the steam supply system to be started according to the air humidity information; thereby adjust sealed intracavity humidity, consequently, the utility model discloses a seebeck coefficient testing arrangement can adjust the air humidity in the sealed chamber.
The gas supply system comprises a gas supply pipe, one end of the gas supply pipe is communicated with the sealed cavity, the other end of the gas supply pipe is connected with a gas source, and a first flow regulating valve is arranged on the gas supply pipe; the steam supply system comprises a steam supply pipe, one end of the steam supply pipe is communicated with the sealing cavity, the other end of the steam supply pipe is connected with a steam source, and the steam supply pipe is provided with a second flow regulating valve; the first flow regulating valve and the second flow regulating valve are electrically connected with the controller; the air humidity in the sealed chamber 11 is adjusted by the first flow regulating valve and the second flow regulating valve.
Further, a spray head is provided in the sealed chamber 11, and an end of the steam supply pipe is connected to a steam inlet end of the spray head, so that moisture is uniformly distributed in the sealed chamber 11. The bottom of the test box 1 is provided with an exhaust pipe, and the exhaust pipe is provided with a control valve electrically connected with the controller. The opening and closing and the size of the first flow regulating valve and the second flow regulating valve are regulated by the controller, so that the air humidity in the sealed cavity 11 can be regulated.
In this embodiment, in order to avoid the influence of oxygen present in the dry gas on the thermosensitive material, the dry gas is an inert gas.
In this embodiment, the seebeck coefficient test module includes a first temperature detection piece 2, a second temperature detection piece 3, a first semiconductor refrigeration piece 6 and a second semiconductor refrigeration piece 7, and the test sample piece is shaped like a plate; interval arrangement about first semiconductor refrigeration piece 6 and the second semiconductor refrigeration piece 7, the left end subsides of test sample 8 are established on first semiconductor refrigeration piece 6, and the right-hand member subsides of test sample 8 are established on second semiconductor refrigeration piece 7, the left end butt of the test end of first temperature detection piece 2 and test sample 8, the test end of second temperature detection piece 3 and the right-hand member butt of test sample 8. The temperature of the first semiconductor refrigerating piece 6 and the temperature of the second semiconductor refrigerating piece 7 can be controlled by adjusting the output power of the power supply of the first semiconductor refrigerating piece 6 and the output power of the power supply of the second semiconductor refrigerating piece 7, and the temperature of the upper end face of the first semiconductor refrigerating piece 6 and the temperature of the upper end face of the second semiconductor refrigerating piece 7 can be controlled between 0 and 200 ℃ by changing the positive and negative electrode wiring modes of the first semiconductor refrigerating piece 6 and the second semiconductor refrigerating piece 7.
The upper end of the first semiconductor refrigeration piece 6 is provided with a first thermistor 40 in an attaching mode, the upper end of the second semiconductor refrigeration piece 7 is provided with a second thermistor 50 in an attaching mode, and the first thermistor 40, the second thermistor 50, the first temperature detection piece 2, the second temperature detection piece 3, the first semiconductor refrigeration piece 6 and the second semiconductor refrigeration piece 7 are all electrically connected with the controller. The temperature of the upper ends of the first semiconductor chilling plate 6 and the second semiconductor chilling plate 6 is measured through the first thermistor 40 and the second thermistor 50, and the temperature of the upper ends of the first semiconductor chilling plate 6 and the second semiconductor chilling plate 6 can be kept constant by controlling the working power of the first semiconductor chilling plate 6 and the second semiconductor chilling plate 7 through the controller.
Further, a first heat conduction device 20 is arranged at the lower end of the first semiconductor refrigeration piece 6, and the first heat conduction device 20 is used for guiding out cold or heat generated by the lower end of the first semiconductor refrigeration piece 6 to the outside of the sealed cavity 11; the lower end of the second semiconductor refrigerating sheet 7 is provided with a second heat conducting device 30, and the second heat conducting device 30 is used for guiding cold or heat generated by the lower end of the second semiconductor refrigerating sheet 7 out of the sealed cavity. Specifically, first heat-transfer device 20 includes heat conduction copper pipe, circulating water pump and heat exchange pond, and circulating water pump drive heat transfer liquid circulates in heat conduction copper pipe and flows for heat or the cold volume of first semiconductor refrigeration piece 6 lower extreme can in time be derived to the heat exchange pond in, thereby guarantee first semiconductor refrigeration piece 6 steady operation.
In this embodiment, the seebeck coefficient test module includes a first conductive probe 4 and a second conductive probe 5, a test end of the first conductive probe 4 abuts against a left end of the test sample 8, and a test end of the second conductive probe 5 abuts against a right end of the test sample 8; an electrochemical workstation is arranged outside the test box 1, and the first conductive probe 4 and the second conductive probe 5 are electrically connected with the electrochemical workstation. The ionic conductivity or the electronic conductivity of the material at different temperatures under specific humidity can be obtained through an EIS impedance spectrum test. The output power of the material can be obtained by testing in combination with a Seebeck coefficient test under a specific humidity condition.
In this embodiment, a supporting column 91 is arranged in the sealed cavity 11, the lower end of the supporting column 91 is fixedly connected with the bottom wall of the sealed cavity 11, the upper part of the supporting column 91 is connected with an installation seat 92 in a vertical sliding manner, and the first temperature detection piece 2, the second temperature detection piece 3, the first conductive probe 4 and the second conductive probe 5 are all arranged at the lower part of one end, far away from the supporting column 91, of the installation seat 92; a locking mechanism is arranged between the mounting seat 92 and the supporting column 91, and the locking mechanism is used for fixing the mounting seat 92 on the supporting column 91.
Specifically, the lower extreme of support column 91 and the diapire fixed connection of sealed chamber 11, mount pad 92 slide from top to bottom and set up on support column 91, and first temperature detect spare 2, second temperature detect spare 3, first conductive probe 4 and second conductive probe 5 all set up the lower part of keeping away from the one end of support column 91 at mount pad 92. The locking mechanism may be disposed in various ways, such as a clamp disposed at an end of the mounting base 92, the clamp being sleeved on the supporting column 91, or a mounting hole for allowing an upper end of the supporting column 91 to pass through being disposed at an end of the mounting base 92, and a fastening screw extending in a radial direction of the mounting hole being disposed on a side wall of the mounting hole.
Furthermore, the lower end of the supporting frame is fixedly connected with a first elastic clamp, a second elastic clamp, a third elastic clamp and a fourth elastic clamp, the upper end of the first temperature detection piece 2 is clamped in the first elastic clamp, the second temperature detection piece 3 is clamped in the second elastic clamp, the first conductive probe 4 is clamped in the third elastic clamp, and the second conductive probe 5 is clamped in the fourth elastic clamp.
When the humidity sensor is used, the humidity of air in the sealed cavity 11 can be detected through the humidity sensor, the air humidity information is sent to the controller, and the controller sends electric signals to the air supply system and the steam supply system according to the air humidity information, so that the humidity in the sealed cavity 11 is adjusted; the temperature difference exists at the left end and the right end of the test sample piece 8 through the first semiconductor refrigerating piece 6 and the second semiconductor refrigerating piece 7, and the temperature difference at the left end and the right end of the test sample piece 8 can be detected through the first temperature detection piece 2 and the second temperature detection piece 3.
When the air humidity in the sealed cavity 11 needs to be controlled at 100%, first the first flow regulating valve is closed by the controller, and the second flow regulating valve is adjusted by the controller to be large, moisture is introduced into the sealed cavity 11, when the humidity sensor detects that the humidity in the sealed cavity 11 reaches 100%, the controller sends an electric signal to the second flow regulating valve, so that the second flow regulating valve is closed, at the moment, the temperature difference between the left end and the right end of the test sample piece 8 is detected by the first temperature detection piece 2 and the second temperature detection piece 3, the voltage difference between the left end and the right end of the test sample piece 8 is detected by the first conductive probe 4 and the second conductive probe 5, and therefore multiple groups of data of which the humidity is 100% are obtained. In this embodiment, a temperature sensor for detecting the temperature of the air in the sealed cavity 11 is further disposed in the sealed cavity 11, when the humidity of the air in the sealed cavity 11 needs to be controlled to be 10%, because the humidity of the air changes greatly with the temperature, the temperature of the air in the sealed cavity 11 is controlled to be 25 ℃, then the control valve and the first flow regulating valve are opened through the controller, the dry gas is introduced into the sealed cavity 11, when the humidity sensor detects that the humidity in the sealed cavity 11 reaches 10%, the controller sends an electric signal to the first flow regulating valve, and the first flow regulating valve is closed, at this time, the temperature difference between the left end and the right end of the test sample piece 8 is detected by using the first temperature detection piece 2 and the second temperature detection piece 3, and the voltage difference between the left end and the right end of the test sample piece 8 is detected by using the first conductive probe 4 and the second conductive probe 5, so that multiple sets of data with the humidity of 10% are obtained. Specifically, in this embodiment, a hot runner is provided in the wall of the seal box, and the temperature of the air in the seal cavity is controlled by introducing the heat exchange liquid into the hot runner.
To sum up, the seebeck coefficient testing device for thermoelectric materials of the present invention can detect the air humidity in the sealed cavity 11 through the humidity sensor, and send the air humidity information to the controller, and the controller sends electrical signals to the air supply system and the steam supply system according to the air humidity information, so as to adjust the humidity in the sealed cavity 11; the temperature difference exists at the left end and the right end of a test sample piece 8 through a first semiconductor refrigerating piece 6 and a second semiconductor refrigerating piece 7, the temperature difference at the left end and the right end of the test sample piece 8 can be detected through a first temperature detection piece 2 and a second temperature detection piece 3, the voltage difference at the left end and the right end of a test sample can be detected through a first conductive probe 4 and a second conductive probe 5, and therefore the Seebeck coefficient of the thermoelectric material under specific humidity is obtained.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and replacements can be made without departing from the technical principle of the present invention, and these modifications and replacements should also be regarded as the protection scope of the present invention.
Claims (10)
1. The device for testing the Seebeck coefficient of the thermoelectric material is characterized by comprising a controller, a test box (1) provided with a sealed cavity (11), a gas supply system for conveying dry gas into the sealed cavity (11) and a gas supply system for conveying moisture into the sealed cavity (11);
a humidity sensor, a Seebeck coefficient testing module and a testing sample piece (8) supported by a thermoelectric material are arranged in the sealed cavity; the air supply system, the steam supply system and the humidity sensor are all electrically connected with the controller.
2. The Seebeck coefficient testing device according to claim 1, wherein the gas supply system comprises a gas supply pipe, one end of the gas supply pipe is communicated with the sealed cavity (11), the other end of the gas supply pipe is connected with a gas source, and a first flow regulating valve is arranged on the gas supply pipe;
the steam supply system comprises a steam supply pipe, one end of the steam supply pipe is communicated with the sealing cavity (11), the other end of the steam supply pipe is connected with a steam source, and the steam supply pipe is provided with a second flow regulating valve;
the first flow regulating valve and the second flow regulating valve are both electrically connected with the controller.
3. The seebeck coefficient testing device according to claim 2, characterized in that a spray head is arranged in the sealed chamber (11), and the end of the gas supply pipe is sealed through the wall of the sealed chamber (11) and connected to the spray head.
4. The Seebeck coefficient testing device according to claim 1, wherein an exhaust pipe is provided at the bottom of the testing box (1), and a control valve electrically connected to the controller is provided on the exhaust pipe.
5. The seebeck coefficient testing device according to claim 1, wherein the dry gas is an inert gas.
6. The Seebeck coefficient testing device according to any one of claims 1 to 5, wherein the Seebeck coefficient testing module comprises a first temperature detecting member (2), a second temperature detecting member (3), a first semiconductor chilling plate (6) and a second semiconductor chilling plate (7), and the testing sample member is plate-shaped;
first semiconductor refrigeration piece (6) with interval arrangement about second semiconductor refrigeration piece (7), the left end subsides of test sample spare (8) are established on first semiconductor refrigeration piece (6), the right-hand member subsides of test sample spare (8) are established on second semiconductor refrigeration piece (7), the test end of first temperature detection piece (2) with the left end butt of test sample spare (8), the test end of second temperature detection piece (3) with the right-hand member butt of test sample spare (8).
7. The Seebeck coefficient testing device according to claim 6, wherein a first thermistor (40) is attached to the upper end of the first semiconductor chilling plate (6), a second thermistor (50) is attached to the upper end of the second semiconductor chilling plate (7), and the first thermistor (40), the second thermistor (50), the first temperature detecting member (2), the second temperature detecting member (3), the first semiconductor chilling plate (6) and the second semiconductor chilling plate (7) are electrically connected to the controller.
8. The Seebeck coefficient testing device according to claim 7, characterized in that a first heat conducting device (20) is arranged at the lower end of the first semiconductor chilling plate (6), and the first heat conducting device (20) is used for guiding out the cold or heat generated at the lower end of the first semiconductor chilling plate (6) to the outside of the sealed cavity (11);
and a second heat conduction device (30) is arranged at the lower end of the second semiconductor refrigerating sheet (7), and the second heat conduction device (30) is used for guiding cold or heat generated by the lower end of the second semiconductor refrigerating sheet (7) out of the sealed cavity.
9. The Seebeck coefficient testing apparatus according to claim 6, wherein the Seebeck coefficient testing module comprises a first conductive probe (4) and a second conductive probe (5), a testing end of the first conductive probe (4) abuts against a left end of the test sample piece (8), and a testing end of the second conductive probe (5) abuts against a right end of the test sample piece (8);
an electrochemical workstation is arranged outside the test box (1), and the first conductive probe (4) and the second conductive probe (5) are electrically connected with the electrochemical workstation.
10. The Seebeck coefficient testing device according to claim 9, wherein a supporting column (91) is arranged in the sealed cavity (11), the lower end of the supporting column (91) is fixedly connected with the bottom wall of the sealed cavity (11), a mounting seat (92) is connected to the upper portion of the supporting column (91) in a vertical sliding manner, and the first temperature detecting element (2), the second temperature detecting element (3), the first conductive probe (4) and the second conductive probe (5) are all arranged at the lower portion of one end, away from the supporting column (91), of the mounting seat (92);
and a locking mechanism is arranged between the mounting seat (92) and the supporting column (91), and is used for fixing the mounting seat (92) on the supporting column (91).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222199597.XU CN218003305U (en) | 2022-08-19 | 2022-08-19 | Seebeck coefficient testing device for thermoelectric material |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222199597.XU CN218003305U (en) | 2022-08-19 | 2022-08-19 | Seebeck coefficient testing device for thermoelectric material |
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| CN218003305U true CN218003305U (en) | 2022-12-09 |
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| CN202222199597.XU Active CN218003305U (en) | 2022-08-19 | 2022-08-19 | Seebeck coefficient testing device for thermoelectric material |
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