JPH051235U - Semiconductor element inspection equipment - Google Patents

Abstract

(57) [Summary] [Purpose] Check whether the probe card is securely attached to the probe socket to prevent damage to the probe card during inspection, and to ensure that the probe card is compatible with the type of semiconductor device. Automatically check whether it is installed in. [Structure] Since the semiconductor element inspection device 10 is provided with the limit switch 24, it is possible to detect whether or not the probe card 20 is properly attached to the semiconductor element inspection device 10. In addition, the probe card 20 is provided with the bar code 26A and the semiconductor device inspection apparatus 1
The bar code reading unit 26 is provided at 0. Therefore, when the probe card 20 is attached to the semiconductor device inspecting apparatus 10, the bar code reading unit 26 reads the bar code 26A.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

  The present invention relates to a semiconductor device inspection apparatus, and in particular, a large number of semiconductor devices are formed on a semiconductor wafer. The present invention relates to a semiconductor element inspection device for inspecting the electrical performance of a semiconductor element circuit.

[0002]

[Prior art]

  Semiconductor devices are arranged vertically and horizontally on a disk-shaped thin plate of a predetermined size called a wafer. Then, it is manufactured by forming a large number of the same electric element circuits required for each. It   Then, these manufactured wafers are processed before the device is divided into individual chips. With a semiconductor device inspection device called a wafer prober to inspect the formation quality of the child circuit Each element is judged whether it is good or bad. This semiconductor element inspection device is a tape And a device control section, a determination section, etc. Horizontal movement in the X and Y directions and vertical movement in the Z direction are performed according to the element arrangement. And dress The placement control unit determination unit is disposed above the table and is provided for each element to be inspected. A probe card that holds and holds a probe as a contact needle provided at a position corresponding to the electrode. The circuit of each element is sequentially inspected and determined through.

[0003]   By the way, there are several types of probe cards that correspond to the types of semiconductor elements. And will be replaced if necessary. This probe card is dedicated to each type of element to be measured. There is a probe card available, and the dedicated probe card is related to the element to be measured. ・ Symbols are specified, and the probe that contacts the element electrode is each electrode of the semiconductor element It is in an arrangement state corresponding to. Therefore, every time the type of element to be inspected is changed, It is necessary to attach a special probe card to the socket of the placement control unit determination unit.

[0004]

[Problems to be solved by the device]

  However, when the probe card is attached to the socket, it cannot be attached securely. In some cases, it may be mounted slightly displaced, and in this state the probe is When the semiconductor element is inspected by touching each electrode, the probe card is damaged and rubbed. There is.

[0005]   On the other hand, the probe card attached to the socket corresponds to the type of semiconductor device. Since it is checked by the operator whether it is necessary or not, time is required for the inspection. There is a problem that productivity cannot be improved.   The present invention has been made in view of such circumstances, and the probe card is inserted in the socket. It was confirmed whether it was actually installed, and it was adapted to the type of semiconductor device. Semiconductor that can check whether the probe card is attached to the socket An object is to provide an element inspection device.

[0006]

[Means for Solving the Problems]

  According to the present invention, the contact needle of the probe card attached to the semiconductor element inspection device is used as a semiconductor element. In a semiconductor inspection device that inspects the quality of the semiconductor element by contacting the electrode of the child, When the card is attached to the semiconductor element inspection device, the means for detecting the probe card is half It is provided in a conductor element inspection device.

[0007]

[Action]

  According to the present invention, the semiconductor element inspection device is provided with the probe card detecting means. , Check whether the probe card is properly attached to the semiconductor device inspection device. I can know.

[0008]

【Example】

  Hereinafter, a semiconductor device inspection apparatus according to the present invention will be described in detail with reference to the accompanying drawings.   FIG. 1 is a schematic view of a semiconductor device inspection apparatus 10 according to the present invention. Semi-conductor The body element inspection apparatus 10 includes a test head 12, and the test head 12 has a head A tage 14 is provided. The head stage 14 has a probe socket 16 The flange portion 16A is placed. In this case, the pogo pin 12 of the test head 12 A, 12A ... Are fitted into the terminals 16A, 16A. Head 12 and probe socket 16 are electrically connected.

[0009]   Further, the head stage 14 is provided with a fixing ring 18, and the fixing ring 1 8 is a probe card arranged under the probe socket 16, that is, a probe card. Fix the card 20. In this case, the pogo pins 16B and 16B of the probe socket 16 ... is inserted into the terminals 20A, 20A of the probe card 20, and the probe socket 16 and the probe card 20 are electrically connected. And probe socket 16 terminals 16A, 16A ... and pogo pins 16B, 16B of the probe socket 16 ... is electrically connected via the cords 22, 22, ... 12 and the probe card 20 are electrically connected.

[0010]   On the other hand, the probe socket 16 is provided with a limit switch 24. Re The mitt switch 24 attaches the probe card 20 to the probe socket 16 and It is arranged so that it will come into contact with the probe card 20 to operate when When the switch 24 operates, the limit switch 24 outputs a signal. This Check that the probe card 20 is attached to the probe socket 16. You can Further, when a signal is output from the limit switch 24, the next step () Can be set to be executed.

[0011]   Further, the probe socket 16 is provided with a bar code reading sensor 26. There is. In the bar code reading sensor 26, the probe card 20 is the probe socket 1 The barcode 26A provided on the probe card 20 when attached to the probe card 6 Read the signal and input the signal to the tester 28. And whether or not the probe card 20 is a desired probe card by comparing It

[0012]   The operation of the semiconductor device inspection apparatus according to the present invention constructed as above will be described. It   First of all, the probe socket 16 is adapted to the semiconductor device to be inspected next. The probe socket 16 and the probe card 20 are positioned above the card 20. Abut. Next, the probe card 20 is attached to the probe socket 1 with the fixing ring 18. Fix at 6. In this case, the probe card 20 is fixed to the probe socket 16. Then, the upper surface of the probe card 20 contacts the limit switch 24. This , The limit switch 24 is activated and a signal is output from the limit switch 24 It is confirmed that the probe card 20 is attached to the probe socket 16.

[0013]   Also, when the probe card 20 is fixed to the probe socket 16, a barcode is displayed. The reading sensor 26 reads the barcode 26A provided on the probe card 20. Output a sampled signal. The output signal is sent to the probe socket 16 and the test head. It is input to the tester 28 via the mode 12.   On the other hand, the tester 28 receives a probe socket from a master computer (not shown). A signal indicating the probe card 20 attached to the printer 16 is input. Therefore, the table of the probe card 20 input from the master computer by the tester 28 is displayed. Display signal and a table of the probe card 20 input from the bar code reading sensor 26. The probe signal is compared to determine whether the probe card 20 is the desired probe card. Confirm.

[0014]   After the confirmation is completed, move the table on which the semiconductor element is attached in the X, Y, Z directions. Are moved to position the semiconductor element, and the contact needles 34, 34 ... Apply to the electrodes of the semiconductor element. The semiconductor element is inspected in contact with it.   In the above embodiment, the probe card 20 was attached to the probe socket 16. The limit switch 24 is used to check whether or not it is not limited to this. Other sensors such as sensors or proximity sensors may be used. And use an optical sensor In this case, a reflection plate is provided at a position facing the optical sensor of the probe card 20. .

[0015]   Incidentally, reference numeral 36 in FIG. 1 denotes a base on which the probe card 20 is placed.

[0016]

[Effect of device]

  As described above, according to the semiconductor device inspection apparatus of the present invention, the probe card is Detects whether the conductor element inspection device is installed in the proper condition, and You can check whether the card is securely attached to the socket. Obey It is possible to prevent damage to the probe card that occurs during the inspection.

[0017]   Moreover, according to the semiconductor device inspection apparatus of the present invention, You can automatically check whether the probe card is installed in the socket. Therefore, it is possible to improve productivity because time for inspection is unnecessary.

[Brief description of drawings]

FIG. 1 is a schematic diagram showing a configuration of a semiconductor device inspection apparatus according to an embodiment of the present invention.

[Explanation of symbols]

10 ... Semiconductor element inspection device 24 ... Limit switch 26 ... Bar code reader 26A ... bar code 20 ... probe card 34 ... Contact needle

Claims (2)

[Scope of utility model registration request] 1. A semiconductor inspection device for inspecting the quality of a semiconductor element by contacting a contact needle of a probe card attached to the semiconductor element inspection device with an electrode of the semiconductor element, wherein the probe card is attached to the semiconductor element inspection device. A semiconductor element inspecting device, wherein a means for detecting a probe card is provided in the semiconductor element inspecting device. 2. A bar code is provided on the measuring element card and a bar code reading section is provided on the semiconductor element inspecting device, and when the measuring element card is attached to the semiconductor element inspecting apparatus, the bar code reading section reads the bar code. The semiconductor inspection apparatus according to claim 1, which is read.