JPH05121470A - Die bonder apparatus - Google Patents

Abstract

PURPOSE:To provide a die bonder apparatus wherein its maintenance control is made easy by improving the wear-resistant property of a collet holder, it is made lightweight and it can cope with the high speed of a die chucking operation and a die bonding operation. CONSTITUTION:In a die bonder apparatus, an operation in which a semiconductor pellet 1 is held by air-suction by the tip of die collets 4, 6 held by a collet holder 11a and an operation in which the semiconductor pellet 1 held is transferred and pressed to the surface of a lead frame 5 are repeated, and the semiconductor pellet 1 is bonded continuously to the lead frame 5. In the die bonder apparatus,, the collet holder 11a is made of a ceramic material.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a die bonder device for joining a semiconductor pellet to a lead frame, and particularly to improve the wear resistance strength of components to prolong the service life and simplify the maintenance. The present invention relates to a die bonder device that is lightweight and enables high-speed operation.

[0002]

2. Description of the Related Art A die bonder device as shown in FIG. 2, for example, is used in a manufacturing process of semiconductor parts such as LSI, IC and transistors. This die bonder device
A wafer cassette ring 2 on which a large number of rectangular semiconductor pellets 1 formed by cutting a wafer are placed, and only semiconductor pellets 1 that are on the wafer cassette ring 2 and have passed the standards are adsorbed one by one, and then pre-aligned 3. It comprises a die suction collet 4 to be conveyed, and a die bonding collet 6 for sucking the semiconductor pellet 1 positioned by the pre-alignment 3 and pressing the sucked semiconductor pellet 1 to a predetermined position on the lead frame 5. ..

The die suction collet 4 and the die bonding collet 6 are mounted on a head 7 shown in FIG. The head 7 is provided with a bush 9 at the tip of an arm 8 that is vertically moved by a link mechanism or a cam mechanism.
The bush 9 is provided with a collet holder 11 which can be moved up and down via a slide ball 10, and the die collets 4 and 6 are inserted and fixed in a hole having a diameter of about 3 mm formed in the lower end axial direction of the collet holder 11. .. The upper end of the collet holder 11 has a hose port 12 for connecting to a vacuum source.
And a detent 13 for preventing the collet holder 11 from rotating.

Conventionally, since the collet holder 11 is in sliding contact with the bush 9 via the slide ball 10 at a high speed, the collet holder 11 is conventionally formed into a cylindrical shape from an alloy tool steel such as SKS3, and then, from the viewpoint of enhancing the wear resistance strength. It is manufactured by soft nitriding the surface of the outer cylinder and finishing it to a hardness of about 52-55H _RC .

The die suction collet 4 and the die bonding collet 6 are incorporated in heads 7 and 7, respectively, and are configured to move up and down by a link that moves up and down by a cam device (not shown) and to pivot horizontally. Has been done.

As shown in FIG. 2, the die suction collet 4 optically detects only the inspection-acceptable products among the plurality of semiconductor pellets 1, 1 ... It is vacuum-sucked and sequentially conveyed to the pre-alignment 3. The pre-alignment 3 positions the conveyed semiconductor pellet 1. The positioned semiconductor pellet 1 is conveyed in a state of being vacuum-sucked by the tip of the die-bonding collet 6 and placed on a predetermined position of the lead frame 5. The collet 6 adds a scrub motion to the semiconductor pellet 1, so that the semiconductor pellet 1
Receives a strong pressing force. N on the back surface of the semiconductor pellet 1.
While the i-Au plating is applied, the surface of the lead frame 5 is Ag plated to improve the wettability with respect to solder. Then, the semiconductor pellet 1 is integrally joined to a predetermined position on the lead frame 5 with Pb-Sn solder.

[0007]

However, in the die bonder device using the collet holder formed of the conventional alloy tool steel, the wear resistance of the collet holder against the slide balls and bushes is still low, so that the mounting position of the semiconductor pellets is low. There are drawbacks in that the accuracy decreases and maintenance of the device becomes complicated.

That is, if the gap between the holder and the bush is widened due to the abrasion of the collet holder due to the slide balls, the suction position of the semiconductor pellet is displaced, and the number of defective products increases rapidly.

On the other hand, if the gap between the collet holder and the bush is set to be small, the raising and lowering operation of the collet holder will not be performed smoothly, and the sliding portions of both will be insufficiently lubricated and seizure will easily occur. Therefore, it was necessary to replace the collet holder frequently. As described above, since the die bonder device is stopped every time the collet holder is replaced, continuous operation over a long period of time is difficult, and the labor required for maintenance and management of the device increases.

Further, since the collet holder is mainly made of a high specific gravity alloy tool steel, there is a problem that the weight of the head as a whole becomes large and it becomes difficult to speed up die suction and die bonding. That is, a head mounted with a heavy weight collet holder has a large inertial force, and when mounted on a bonding device, vibration may increase, resulting in an increase in displacement of the semiconductor pellet placement position.

The present invention has been made to solve the above-mentioned problems, and improves wear resistance to facilitate maintenance and weight reduction, and to speed up die suction operation and die bonding operation. It is an object of the present invention to provide a die bonder device capable of coping with the above.

[0012]

To achieve the above object, a die bonder device according to the present invention comprises an operation of vacuum-sucking a semiconductor pellet on the tip of a die collet held by a collet holder, and the sucked semiconductor pellet on an upper surface of a lead frame. In the die bonder device for continuously joining the semiconductor pellet and the lead frame by repeating the operation of transferring and pressing, the collet holder is made of a ceramic material.

The ceramic material is silicon nitride (S
i ₃ N ₄ ), sialon (Si—Al—O—N), zirconia (ZrO ₂ ) and silicon carbide (SiC).

All of the above ceramic varnish materials have excellent wear resistance, and even when the collet holder made of this ceramic material is insufficiently lubricated,
It is unlikely that a seizure accident will occur. Further, the ceramic material is lighter in weight than the conventional metal material, and the total weight of the die suction head and the die bonding head can be reduced. Further, when listed in order specific gravity lower _{Si 3 N 4, SiC, Si} -Al-O-N, ZrO 2
Therefore, Si ₃ N ₄ or SiC is suitable for the purpose of weight reduction. Further, although ZrO ₂ has a relatively large specific gravity, it has a high fracture toughness value and is particularly excellent in impact resistance.

[0015]

According to the die bonder device having the above structure, since the collet holder for holding the die collet is made of a ceramic material which is lightweight and has excellent wear resistance, the life of the device can be extended. In addition, since the seizure accident of the collet holder is reduced, the maintenance and management of the device becomes extremely simple.

Further, the collet holder is made of a ceramic material such as Si ₃ N ₄ , sialon, ZrO ₂ and SiC, which has a lower specific gravity than that of the conventional alloy tool steel, thereby reducing the weight of the entire head including the collet holder. It is possible to contribute to speeding up the die suction operation and the die bonding operation.

[0017]

An embodiment of the present invention will be described with reference to the accompanying drawings. The die bonder device according to the present invention is characterized by the material of the collet holder, and other configurations are the same as those of the conventional device shown in FIGS. 2 and 3. A configuration example of the collet holder 11a is shown in FIG.

That is, the die bonder apparatus according to the present embodiment has the die collet 4 held by the collet holder 11a.
6 The semiconductor pellet 1 and the lead frame 5 are continuously connected by repeating the operation of adsorbing the semiconductor pellet 1 at the tip and the operation of transferring the adsorbed semiconductor pellet 1 to the pre-alignment 3 or the upper surface of the lead frame 5 for pressing. In the die bonder device for mechanically joining, the collet holder 11a is made of Si ₃ N ₄ , Sialon, ZrO ₂ , SiC.
It is formed of a ceramic material such as.

In the insertion hole 14 formed at the lower end of the collet holder 11a shown in FIG.
6 is attached. As shown in FIG. 3, the collet holder 11a having the die collets 4 and 6 mounted therein is arranged in a bush 9 provided at the tip of the arm 8 so as to be movable up and down via a slide ball 10 to form a head 7.

As the material for forming the collet holder 11a, if the material has sufficient toughness to withstand the impact force applied during the die suction operation and the die bonding operation, and is lightweight and excellent in wear resistance, It is not limited in any way. However, the various ceramic materials described above are suitable for satisfying both the lightness and the wear resistance at the same time.

As described above, according to the die bonder apparatus of the present embodiment, the collet holder 11a for holding the die collets 4 and 6 is made of a ceramic material which is lightweight and has excellent wear resistance. Since it is possible to reduce the number of accidents and seizure of the collet holder, the maintenance and management of the device becomes extremely simple.

Further, by forming the holder 11a with a ceramic material having a lower specific gravity than alloy tool steel such as Si ₃ N ₄ , sialon, ZrO ₂ and SiC, the weight of the entire head 7 including the collet holder is further increased. It can be reduced, and it is possible to sufficiently cope with the speedup of the die suction operation and the die bonding operation.

Next, the effect of the die bonder apparatus according to this embodiment will be described more specifically.

As Example 1, 4% by weight of Al ₂ O ₃ , A
1N 3% by weight, Y ₂ O ₃ 5% by weight, balance Si ₃ N
_A Si ₃ N ₄ raw material mixture composed of
P), and then a hole is formed along the axial center of the obtained molded body, and further heated at 700 ° C. for 3 hours to degrease, and then baked at a temperature of 1750 ° C. for 4 hours to obtain the obtained sintered body. The body was ground to prepare 10 collet holders having the dimensions and shapes shown in FIG.

Further, as Example 2, except that a partially stabilized zirconia raw material powder containing 3% by weight of Y ₂ O ₃ was used, the process was performed in the same manner as in Example 1, and 10 collet holders made of ZrO ₂ were used. Manufactured.

As a comparative example, alloy tool steel (SKS3), which is a conventional material, was mechanically ground to prepare 10 collet holders having the same dimensions as the holder shown in FIG. Each holder was further subjected to a soft nitriding treatment to adjust its surface hardness to 52 to 55H _RC .

The weights of the obtained collet holders were compared and the results shown in Table 1 were obtained.

[0028] Examples 1 to 10 thus prepared
The collet holders of No. 2 and Comparative Example were mounted one by one as the collet holder of the die bonder device shown in FIG. 2, and the joining work between the Si pellet having one side of 0.35 mm and the lead frame was continuously performed for 6 months. After that, the wear depth of the outer surface of the collet holder was measured, and the results shown in Table 1 below were obtained. Numerical values for each measurement item are for each collet holder 1
The measurement was performed for each of 0 lines, and the average value of each data is shown.

The weight is shown as a relative value with the weight of the collet holder of the comparative example, which is a conventional material, as 100.

[0030]

[Table 1]

As is clear from the results shown in Table 1, according to the die bonder device equipped with the collet holders according to the first and second embodiments, the bushes and the slide balls which are slid at high speed with the collet holder are lightweight and wear-resistant. Since it is made of a ceramic material (Si ₃ N ₄ , ZrO ₂ ) with excellent properties, the amount of wear is extremely small compared to the collet holder of the comparative example using the conventional material, and the life of the die bonder device is greatly extended. can do.

Therefore, it is not necessary to stop the die bonder device frequently to replace the collet holder,
The device can be continuously operated for a long period of time, the maintenance and management of the device can be greatly simplified, and the manufacturing efficiency of semiconductors and the like can be significantly improved.

Further, according to the apparatus using the collet holders of Examples 1 and 2, since the collet holder is made of a lightweight ceramic material, it is compared with the conventional alloy tool steel collet holder (Comparative Example 1). And weigh 30-60%
It is possible to reduce the amount, and it is possible to sufficiently cope with high speed operation of the die bonder device.

In the case where die-bonding was performed using the collet holders of Examples 1 and 2 and the comparative example to form a joined body, it was determined whether or not the joined Si pellets and the lead frame were well joined. When each of the bonded bodies was inspected as appropriate, peeling of Si pellets hardly occurred, and no significant difference was found between the collet holders in terms of bondability.

[0035]

As described above, according to the die bonder device of the present invention, since the collet holder for holding the die collet is made of a ceramic material which is lightweight and has excellent wear resistance, the device has a long life. Since it is possible to reduce the risk of seizing of the collet holder, maintenance and management of the device becomes extremely simple.

The collet holder is made of a ceramic material such as Si ₃ N ₄ , sialon, ZrO ₂ , SiC, etc., which has a lower specific gravity than conventional alloy tool steel, so that the entire head with the collet holder attached is lightweight. It is possible to improve the speed of die suction operation and die bonding operation.

[Brief description of drawings]

FIG. 1 is a sectional view showing an embodiment of a collet holder attached to a die bonder device according to the present invention.

FIG. 2 is a perspective view showing a configuration example of a die bonding apparatus.

FIG. 3 is a sectional view showing a configuration example of a die bonding head and a die suction head.

[Explanation of symbols]

 1 Semiconductor Pellet 2 Wafer Cassette Ring 3 Pre-alignment 4 Die Adsorption Collet 5 Lead Frame 6 Die Bonding Collet 7 Head 8 Arm 9 Bushing 10 Slide Ball 11, 11a Collet Holder 12 Hose Port 13 Whirl-stop 14 Insertion Hole

Claims (2)

[Claims] 1. A semiconductor pellet and a lead frame are continuously connected by repeating an operation of vacuum-adsorbing a semiconductor pellet on a tip of a die collet held by a collet holder and an operation of transferring the adsorbed semiconductor pellet to an upper surface of a lead frame and pressing the same. In a die bonder device for mechanically joining, the collet holder is formed of a ceramic material. 2. The ceramic material is silicon nitride (Si ₃
N _4), sialon (Si-Al-O-N ), zirconia (ZrO ₂₎ and die bonder according to claim 1, characterized in that it consists of at least one silicon carbide (SiC).