JPH05121469A - Die bonder apparatus - Google Patents

Abstract

PURPOSE:To obtain an apparatus wherein the wear-resistant strength of a suction board is improved, the yield of products is enhanced and the maintenance control effort of the apparatus can be reduced by a method wherein at least the contact part with a film of the vacuum-chuck board is made of a black ceramic. CONSTITUTION:In a state that a vacuum-chuck board 13A has been brought into contact with the back of a film 8 on which a plurality of semiconductor pellets 1 have been pasted and that the film 8 has been sucked and fixed, a pushing-up pin 7 is pierced into the film 8 form the back direction of the film 8. Thereby, the semiconductor pellets 1 are stripped from the surface of the film 8. The stripped semiconductor pellets 1 are attracted by the tip part of a collet 4 for die vacuum-chuck use; the chucked semiconductor pellets 1 are conveyed sequentially to the definite positions on the surface of a lead frame and bonded. In such a die bonder apparatus, at least the contact part with the film 8 of the vacuum-chuck board 13A is made of a black ceramic. For example, silicon nitride, silicon carbide or sialon is used for the black ceramic.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a die bonder device for joining semiconductor pellets to a lead frame, and in particular, it improves the abrasion resistance of a suction plate for sucking and fixing a film on which semiconductor pellets are stuck during a die sucking operation, and is defective. The present invention relates to a die bonder device that can improve the identification accuracy of semiconductor pellets to improve the product yield and reduce the maintenance work of the device.

[0002]

2. Description of the Related Art For example, a die bonder device as shown in FIG. 3 is used in a manufacturing process of semiconductor parts such as LSI, IC and transistors. This die bonder device
A wafer cassette ring 2 that holds a large number of semiconductor pellets 1 formed by cutting a wafer attached to a transparent film, and a position (not shown) of each semiconductor pellet 1 to monitor the position and shape of the semiconductor pellets 1
Monitor device such as V camera and wafer cassette ring 2
Only the semiconductor pellets 1 of the above standard-compliant product are adsorbed one by one, and the die adsorption collet 4 that conveys them to the pre-alignment 3 and the semiconductor pellets 1 positioned by the pre-alignment 3 are adsorbed and the adsorbed semiconductor pellets 1
And a die-bonding collet 6 for pressing the lead frame 5 at a predetermined position on the lead frame 5.

A suction plate 13 is arranged so as to face the die suction collet 4 with the wafer cassette ring 2 interposed therebetween. As shown in an enlarged scale in FIG.
For example, it is formed into a cylindrical cap shape by using a steel material such as carbon steel for machine structure (S45C), and the semiconductor pellet 1
On the surface of the pellet adhesive film 8 on which
It is manufactured by applying black zinc plating having a thickness of about 2 to 15 μm.

A pin insertion hole 14 for inserting a push-up pin 7, which will be described later, is formed in the center of the suction plate 13, and a suction hole for vacuum suction of the film 8 is provided around the pin insertion hole 14. Many 15 are perforated. The suction plate 13 is used by being fitted into a sleeve 16 made of steel.

The reason why black zinc plating is applied to the contact surface of the suction disk 13 with the film 8 is as follows. That is, when the position and shape of each semiconductor pellet 1 attached on the film 8 is monitored by the monitor device, the background of the semiconductor pellet 1 that is relatively brightly photographed is darkened to thereby make the semiconductor pellet 1 and the background visible. Suction cup 13
This is to increase the contrast with and to make it easier to determine the position and shape of the semiconductor pellet 1.

Further, as shown in FIG. 4, a push-up pin 7 is arranged so as to be vertically movable in the axial direction so as to face the die suction collet 4 with the film 8 interposed therebetween. This push-up pin 7
The film 8 is planted on a mandrel 17 that is vertically movable in the direction of the central axis of the suction plate 13, and passes through a pin insertion hole 14 of the suction plate 13 from the back side of the film 8 on which a plurality of semiconductor pellets 1 are adhered. It has a function of moving so as to pierce 8 and peeling off the semiconductor pellet 1 attached to the upper surface of the film 8 and moving the semiconductor pellet 1 toward the tip of the die suction collet 4.

The die bonding collet 6 and the die suction collet 4 are generally formed of a cemented carbide containing tungsten (W), cobalt (Co) or the like in a cylindrical shape in order to secure wear resistance. It has a quadrangular truncated pyramid-shaped recess 9 into which the semiconductor pellet 1 is added. Further, a suction hole 1 for communicating with the recess 9 and connecting the semiconductor pellet 1 to a vacuum source for vacuum suction.
0 is provided. Further, since the push-up pin 7 arranged so as to face the die suction collet 4 repeatedly contacts the pellet 1 at a high speed, it is formed into a cylindrical needle shape by the above-mentioned cemented carbide having excellent wear resistance.

[0008] Such suction plate 13, push-up pin 7,
The die suction collet 4 and the die bonding collet 6 are configured to move up and down in a vertical direction and to pivot in a horizontal direction by a link that moves up and down by a cam device (not shown).

When performing the die suction operation, the suction plate 1
The position and the shape of each semiconductor pellet 1 are checked by the monitor device while 3 is in contact with the back surface of the film 8. Since the surface of the suction cup 13 is plated with black zinc, the contrast between the semiconductor pellet 1 and the suction cup 13 that is the background thereof is high, and the contour of the semiconductor pellet 1 is clearly recognized by the monitor device. Then, a semiconductor pellet having a defect such as a chip or an abnormal shape is determined as a rejected product and excluded from the objects of die bonding.

The suction plate 13 containing the die suction collet 4 and the push-up pin 7 has a plurality of pellets 1, 1 ... Adhered to the upper surface of the film 8 on the wafer cassette ring 2.
Among them, only the products that have passed the inspection are optically detected and moved to the upper and lower parts thereof. Then, the internal space of the suction plate 13 that is in contact with the back surface of the film 8 is connected to a vacuum source, and the air staying between the film 8 and the suction plate 13 is removed through the suction holes 15. Therefore, the film 8 is adsorbed and fixed on the outer surface of the adsorption disk 13. Next, the push-up pin 7 rises up through the pin insertion hole 14 of the suction plate 13 to break through the film 8 and push up the semiconductor pellet 1 in contact with the pin tip to separate it from the upper surface of the film 8. At the same time, the tip portion (recessed portion) of the die suction collet 4 is deposited on the semiconductor pellet 1. Then, the die suction collet 4 vacuum-sucks the semiconductor pellets 1 one by one into the concave portion 9 and sequentially conveys them to the pre-alignment 3 shown in FIG.

The pre-alignment 3 positions the conveyed semiconductor pellet 1. The positioned semiconductor pellet 1 is conveyed in a state of being vacuum-sucked by the tip of the die-bonding collet 6 and placed on a predetermined position of the lead frame 5. Since the collet 6 applies the scrub motion to the semiconductor pellet 1, the semiconductor pellet 1 receives a strong pressing force. Since solder for bonding is applied to the surface of the lead frame 5 in advance, the semiconductor pellet 1 is integrally bonded onto the lead frame 5.

[0012]

However, in a die bonder device equipped with a suction plate made of conventional carbon steel for machine structure (S45C) and having a surface coated with black zinc plating, the wear resistance of the suction plate is high. Since it is low, there are drawbacks that the product yield of the semiconductor pellet bonded body is reduced and the maintenance and management of the device is complicated.

That is, every time the die bonding operation is repeated at a high speed, the film on which the pellets are adhered slides on the upper surface of the suction plate, so that the black zinc plating on the surface of the suction plate is easily worn or peeled off. The background cannot be obtained. As a result, when the position and shape of the semiconductor pellet are confirmed by the monitor device, a recognition error is likely to occur and the defective rate of the product may increase rapidly. Therefore, it was necessary to replace the suction cup with high frequency during a short operation period. Since the die bonder device is stopped each time the suction plate is replaced, continuous operation over a long period of time is difficult, and the labor required for maintenance and management of the device increases.

The present invention has been made to solve the above-mentioned problems, and it is possible to significantly improve the abrasion resistance strength of the suction cup, improve the product yield, and reduce the maintenance labor of the apparatus. An object is to provide a possible die bonder device.

[0015]

In order to achieve the above object, a die bonder device according to the present invention is a film in which a suction plate is brought into contact with the back surface of a film having a plurality of semiconductor pellets adhered thereto, and the film is adsorbed and fixed. The semiconductor pellet is peeled from the upper surface of the film by inserting the push-up pin into the film from the back direction, and the peeled semiconductor pellet is adsorbed to the tip of the die adsorption collet, and the adsorbed semiconductor pellet is placed in a fixed position on the upper surface of the lead frame. In a die bonder device for sequentially carrying and joining, at least a contact portion of the suction plate with respect to the film is formed of black ceramics.

The black ceramics is at least one selected from silicon nitride (Si ₃ N ₄ ), silicon carbide (SiC) and sialon (Si-Al-O-N).
It is good to compose from seeds.

Further, it is preferable that the film contact surface of the suction disk is matted.

Since all of the above-mentioned ceramics sintered bodies have excellent wear resistance and exhibit a black or dark gray color, a suction plate made of this ceramic material is brought into contact with the back surface of the film to form semiconductor pellets. When you monitor
The contrast between the semiconductor pellet and the suction cup is high,
The position and shape of the semiconductor pellet can be clearly discriminated. The black ceramics can be manufactured by adding a blackening material such as Ti powder to a non-black ceramic material such as alumina (Al ₂ O ₃ ) as well as the above black ceramic material.

By matting the film contact surface of the suction disk by blasting or the like, light reflection on the contact surface is reduced, and the position and shape of the semiconductor pellet due to the monitor light from the monitor device is less likely to be erroneously recognized. It can be reduced.

[0020]

According to the die bonder device having the above structure, at least the abutting portion of the suction plate that abuts the film on which the semiconductor pellets are adhered is made of black ceramics, so that the wear resistance is dramatically improved. However, the life of the suction cup can be greatly extended. Further, even after the operation for a long period of time, the black color of the suction plate does not disappear or peel off, so that the contrast between the semiconductor pellet and the suction plate is always kept high. The rate of erroneous recognition of position and shape is significantly reduced, and product yield can be significantly improved.

Further, it is not necessary to stop the die bonder device frequently for exchanging the suction plate, it becomes possible to continuously operate the device for a long period of time, greatly simplifying the maintenance management of the device, As a result, the manufacturing efficiency of the semiconductor device can be significantly improved.

[0022]

An embodiment of the present invention will now be described with reference to the accompanying drawings. The die bonder device according to the present invention has a structural feature in the material of its suction plate, and the other components are the same as those of the conventional device shown in FIG. FIG. 1 is a sectional view showing an embodiment of a die bonder device according to the present invention, and is an enlarged view showing only a die suction portion which is a main portion. 2 is shown in FIG.
FIG. 3 is a plan view of the suction plate shown in FIG.

That is, in the die bonder apparatus according to this embodiment, the suction plate 13A is brought into contact with the back surface of the film 8 having the plurality of semiconductor pellets 1, 1 ... The semiconductor pellet 1 is peeled from the upper surface of the film 8 by inserting the push-up pin 7 into the film 8 from the upper surface, the peeled semiconductor pellet 1 is sucked to the tip of the die suction collet 4, and the sucked semiconductor pellet 1 is attached to the lead frame. In the die bonder device that sequentially conveys and joins to a fixed position on the upper surface of the No. 5, the contact portion of the suction plate 13A that contacts the film 8 is formed of black ceramics.

As shown in FIGS. 1 and 2, a pin insertion hole 14 having a diameter of 0.6 mm for inserting the push-up pin 7 is formed in the center of the suction plate 13A. Twenty-four suction holes 15 having a diameter of 0.3 mm for vacuum suction of the film 8 are formed in the periphery.

Here, the suction plate 13A of the die bonder apparatus according to the present embodiment is made of Si ₃ N ₄ , SiC, Si-Al-O-.
After the ceramic raw material containing at least one type of black ceramics selected from the N group as the main component and various sintering aids is molded by the cold isostatic pressing (CIP), green processing is carried out and predetermined. Heating at temperature to degrease and sinter,
Further, it was formed through grinding and polishing.

Among the adsorption plates made of the above-mentioned ceramics, particularly 0.5 to 5% by weight of Al ₂ O ₃ and 0.
5 to 5% by weight, Y ₂ O ₃ to 1 to 7% by weight, and TiO.
The ceramic adsorption board containing 5 to 2% by weight and the rest being Si ₃ N ₄ had particularly excellent wear resistance and exhibited good life characteristics. Further, all of these ceramics have a mechanical strength of about 60 to 100 kg / mm ² in bending strength, and when used as a material for a suction cup, they can sufficiently withstand a high-speed contact or sliding operation.

Next, the effect of the die bonder apparatus according to this embodiment will be described more specifically.

As Example 1, 4% by weight of Al ₂ O ₃ and A
1N 3% by weight, Y ₂ O ₃ 5% by weight, TiO ₂ 1.
A suction plate 13 made of a Si ₃ N ₄ sintered body composed of 5% by weight and the balance Si ₃ N ₄ and having dimensions shown in FIGS. 1 and 2.
Five a were prepared.

The suction plate 13a forms a suction plate 13A in a state where it is integrally joined to an end of a cylindrical collar 13b made of carbon steel (S45C) for machine structure with an epoxy adhesive. And the cylindrical sleeve 16A made of S45C
Is fitted into the upper opening of the.

By thus forming the suction plate 13A in a composite structure, the positional accuracy of the pin insertion hole 14 with respect to the collar 13b can be improved. That is, it is easy to set the position of the pin insertion hole 14 of the suction cup body with high accuracy with respect to the inner peripheral surface of the collar 13b serving as the reference surface by precisely adjusting the dimension of the steel collar 13b which is easy to process. You can

In addition, as the second embodiment, the suction plate of the first embodiment and the S45C collar are used in the first embodiment of Si ₃
Five N ₄ sintered bodies were integrally formed and five suction cups of the same size were manufactured.

Further, as a third embodiment, Si _{3 of the} second embodiment is used.
Using a SiC sintered body instead of the N ₄ sintered body, five SiC suction disks of the same size were manufactured.

On the other hand, as a comparative example, carbon steel for mechanical structure (S45C), which is a conventional material, is mechanically ground to form a cylindrical cap-shaped suction cup element body having the same dimensions as in Example 2, and the element body A 10 μm thick black zinc plating was applied to the film contact side surface to prepare a large number of S45C suction plates.

Then, each suction plate prepared in Examples 1 to 3 and Comparative Example was mounted as a suction plate 13A of the die bonder apparatus shown in FIG. 3, and the work of joining the Si pellet having one side of 0.35 mm to the lead frame was performed. The average wear amount due to the sliding of the film abutting portion of each suction disc after continuously performing 1,000,000 times was measured, and the proportion of the semiconductor pellets that were rejected during the above joining operation was joined to the lead frame. That is, the incidence of recognition errors in the monitor device (TV camera) was investigated, and the results shown in Table 1 below were obtained.

[0035]

[Table 1]

As is clear from the results shown in Table 1, the suction cups of the die bonding apparatuses according to Examples 1 to 3 have a wear amount 1 / th that of the suction cups of the comparative examples using the conventional materials. It is improved to about 10, the life is greatly extended, and the occurrence rate of semiconductor pellet recognition errors in the monitor device is significantly reduced, so that the product yield can be significantly improved.

Further, according to the suction cup of Example 1 in which only the abutting portion to the film is made of black ceramics, the pin insertion hole is smaller than that of the suction cup of Example 2 in which the whole is made of black ceramics. It is easy to set the forming position with high accuracy.

Further, it is not necessary to stop the die bonder device frequently for exchanging the suction plate, and it becomes possible to continuously operate the device for a long period of time, which greatly simplifies maintenance and management of the device, semiconductors, etc. The manufacturing efficiency of can be greatly improved.

When each of the suction cups of Examples 1 to 3 and Comparative Example was used, the quality of the bondability between the bonded semiconductor pellets and the lead frame was properly inspected. Almost no occurrence occurred, and no significant difference was found between the two in terms of zygosity.

[0040]

As described above, according to the die bonder device of the present invention, since at least the abutting portion of the suction plate that abuts the film on which the semiconductor pellets are adhered is made of black ceramics, wear resistance is improved. The strength is dramatically improved,
The life of the suction cup can be greatly extended. Also,
Even after the operation for a long period of time, the black of the suction cup disappears or there is no risk of peeling, so that the contrast between the semiconductor pellets and the suction cup is always kept high,
The rate of erroneous recognition of the position and shape of the semiconductor pellet by the monitor device is significantly reduced, and the product yield can be significantly improved.

Further, it is not necessary to stop the die bonder device frequently for exchanging the suction plate, the device can be continuously operated for a long period of time, and the maintenance management of the device is greatly simplified. As a result, the manufacturing efficiency of the semiconductor device can be significantly improved.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an embodiment of a die bonder device according to the present invention in an enlarged manner, showing only a die suction portion which is a main part.

FIG. 2 is a plan view of the suction plate in FIG.

FIG. 3 is a perspective view showing a configuration example of a die bonder device.

FIG. 4 is an enlarged sectional view showing a die suction portion of a conventional die bonder device.

[Explanation of symbols]

 1 semiconductor pellet 2 wafer cassette ring 3 pre-alignment 4 die suction collet 5 lead frame 6 die bonding collet 7 push-up pin 8 film 9 recess 10 suction hole 13, 13A suction plate 13a suction plate 13b steel collar 14 pin insertion hole 15 Suction hole 16, 16A Sleeve 17 Mandrel

Claims (3)

[Claims] 1. A semiconductor pellet from the top surface of the film by adhering a suction plate to the back surface of the film to which a plurality of semiconductor pellets are adhered, and sticking a push-up pin into the film from the back surface direction of the film with the film fixed by suction. In the die bonder device for adsorbing the exfoliated semiconductor pellets to the tip of the die adsorption collet and adhering the adsorbed semiconductor pellets sequentially to a fixed position on the upper surface of the lead frame by bonding, at least the film of the adsorption plate A die bonder device characterized in that the contact portion is formed of black ceramics. 2. The black ceramic is silicon nitride (S
The die bonder device according to claim 1, wherein the die bonder device comprises at least one selected from i ₃ N ₄ ), silicon carbide (SiC), and sialon (Si—Al—O—N). 3. The die bonder device according to claim 1, wherein the film contact surface of the suction plate is matt-treated.