JPH051147U - Temperature fuse - Google Patents
Temperature fuseInfo
- Publication number
- JPH051147U JPH051147U JP1154691U JP1154691U JPH051147U JP H051147 U JPH051147 U JP H051147U JP 1154691 U JP1154691 U JP 1154691U JP 1154691 U JP1154691 U JP 1154691U JP H051147 U JPH051147 U JP H051147U
- Authority
- JP
- Japan
- Prior art keywords
- melting point
- circuit board
- point metal
- coil spring
- thermal fuse
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Fuses (AREA)
Abstract
(57)【要約】
【目的】 各種機器に対して取付けが容易な温度ヒュー
ズをうること。
【構成】 長さ方向に収縮するコイルバネ1の一端を回
路板2の他端に接合し、このコイルバネ1の他端は、回
路板2の他端に低融点金属5を介して取付ける。低融点
金属5が熱によってとけると、コイルバネ1が低融点金
属5とはなれ回路が遮断される。
(57) [Abstract] [Purpose] To obtain a thermal fuse that can be easily attached to various devices. [Structure] One end of a coil spring 1 that contracts in the length direction is joined to the other end of a circuit board 2, and the other end of the coil spring 1 is attached to the other end of the circuit board 2 via a low melting point metal 5. When the low melting point metal 5 is melted by heat, the coil spring 1 separates from the low melting point metal 5 and the circuit is cut off.
Description
【0001】[0001]
本考案は温度ヒューズに関する。 電気、電子機器、例えば充電器やヒータを内蔵する部品の異常、誤操作、機器 の周囲の異常等による発熱発火の可能性がある機器の異常を未然に防ぐ部品に関 する。 The present invention relates to a thermal fuse. The present invention relates to components that prevent anomalies in electrical and electronic equipment, such as those that have a built-in charger or heater, malfunctions, malfunctions, and equipment that may cause heat generation due to abnormalities around the equipment.
【0002】[0002]
従来の温度ヒューズは図5に示すようにセラミックケース10に低融点金属1 1を封入し、両端に端子12,13を設けた構成であった。従ってこの温度ヒュ ーズでは他の電子部品とともに回路板に取り付けることは不可能である。なぜな ら、通常部品の取り付けははんだを使用しはんだの温度で低融点合金は溶融して しまうためである。 As shown in FIG. 5, a conventional thermal fuse has a structure in which a low melting point metal 11 is enclosed in a ceramic case 10 and terminals 12 and 13 are provided at both ends. Therefore, this temperature fuse cannot be mounted on a circuit board together with other electronic components. This is because solder is usually used to attach components, and the low melting point alloy melts at the solder temperature.
【0003】 したがって、温度ヒューズは別の場所または、回路板より距離をとり、取り付 けなければならない。 そのため、機器のスペースを大きくとり、最近求められる小型化の要求に応じ られない欠点を有している。Therefore, the thermal fuse must be installed elsewhere or at a distance from the circuit board. Therefore, it has a drawback that it requires a large space of equipment and cannot meet the recent demand for miniaturization.
【0004】[0004]
本考案は上記の欠点を改善するために提案されたもので、その目的は電気・電 子機器の異常を未然に防ぐ温度ヒューズを回路板と一体化し、容易に取り付ける 方法を提供することにある。 The present invention has been proposed in order to improve the above-mentioned drawbacks, and an object thereof is to provide a method of integrating a thermal fuse for preventing an abnormality of an electric / electronic device in advance with a circuit board and easily mounting it. ..
【0005】[0005]
上記の目的を達成するため本考案は導電性のコイルの一端は回路板に接続され 、前記コイルバネの他端は前記の回路板上に設けられた低融点金属に接合され、 前記コイルバネは低融点金属を接合した部分と反対方向への復帰力を持たせ、異 常時には、前記の低融点金属が溶融し、コイルバネが低融点合金からはずれ、回 路遮断が行われることを特徴とする温度ヒューズを特徴とするものである。 According to the present invention, one end of a conductive coil is connected to a circuit board, and the other end of the coil spring is bonded to a low melting point metal provided on the circuit board. A thermal fuse characterized in that it has a restoring force in the opposite direction to the part where the metal is joined, and the low melting point metal melts in the abnormal state, the coil spring comes off from the low melting point alloy, and the circuit is cut off. It is characterized by.
【0006】[0006]
本考案の温度ヒューズは機器・部品等の異常時により過電流が流れたり発熱発 火が発生した場合に回路を低融点金属が溶融しコイルバネが接続端子からはずれ ることで遮断するものであり、回路板上に設けられているので、機器に対する取 付が容易である作用を有する。 The thermal fuse of the present invention cuts off the circuit when an overcurrent flows or an exothermic ignition occurs due to an abnormality of equipment or parts by melting the low melting point metal and separating the coil spring from the connection terminal. Since it is provided on the circuit board, it has the function of being easily attached to equipment.
【0007】 本考案では温度ヒューズを回路板に容易に取り付けうる構成を提案する。 回路板の材料は積層板・セラミック板等特に限定はしない。回路板では機器の 通常の部品と同じ回路板上に本発明の温度ヒューズを取り付ける。取り付け方法 を次に示す。The present invention proposes a structure in which the thermal fuse can be easily attached to the circuit board. The material of the circuit board is not particularly limited, such as a laminated board and a ceramic board. On the circuit board, the thermal fuse of the present invention is mounted on the same circuit board as the normal parts of the equipment. The mounting method is shown below.
【0008】 ここで使用するバネは図1(a)のコイルバネ1、または、図1(b)の様な 形状をした板バネ1a等の長手方向に平行に伸縮するものを用いる。ただし、両 端は接合しやすくするため、面状とする。このバネ1のA端を回路板2上に配線 パターン3を介してハンダ1等の従来の接合方法で接続する。The spring used here is a coil spring 1 shown in FIG. 1A, a leaf spring 1a having a shape as shown in FIG. 1B, or the like that expands and contracts in parallel with the longitudinal direction. However, both ends should be planar to facilitate joining. The A end of the spring 1 is connected to the circuit board 2 via the wiring pattern 3 by a conventional joining method such as soldering 1.
【0009】 図2に取り付けた状態を示す。コイルバネの材料は電気伝導性が高く、バネ性 がある材料とし、特に材料を限定するものではない。次にコイルバネ1のB端は 回路板2の他の部品と取り付け後に低融点金属5(融点が50〜300℃の合金 )で回路板2と接合する。これにより温度ヒューズとして組み上げられたことと なる。FIG. 2 shows the attached state. The material of the coil spring has a high electric conductivity and a spring property, and the material is not particularly limited. Next, the B end of the coil spring 1 is attached to other parts of the circuit board 2 and then joined to the circuit board 2 with a low melting point metal 5 (alloy having a melting point of 50 to 300 ° C.). As a result, it was assembled as a thermal fuse.
【0010】 図3に組上がった温度ヒューズを示す。この温度ヒューズは過電流または、温 度上昇により低融点金属が溶融し、回路を遮断することとなる。図4に遮断した 温度ヒューズの外観を示す。FIG. 3 shows the assembled thermal fuse. In this thermal fuse, the low melting point metal melts due to overcurrent or temperature rise, and the circuit is cut off. Fig. 4 shows the external appearance of the interrupted thermal fuse.
【0011】[0011]
次に本考案の実施例を示すが、この考案は実施例に限定されるものではない。 Next, examples of the present invention will be shown, but the present invention is not limited to the examples.
【0012】 紙フェノール積層板にバネ鋼で外径3mm、長さ10mm、バネ定数100g /mmのコイルバネを用いて、はんだで一端を接続し、他端を97℃の融点を持 つ低融点金属(Sn−Pb−Bi合金)で固定した。このコイルバネは遮断する 方向即ち回路板と反対側への反力を持ち、低融点金属が溶融すれば遮断するよう に固定した。この回路板の温度ヒューズに電流を流し、温度ヒューズ周辺に熱電 対を取り付けオーブンにいれ徐々に温度を上昇させた。温度ヒューズに流れる電 流とそのときの温度と測定し、回路が遮断される温度を求めた。その結果、±1 ℃以内で遮断が行なわれ、温度ヒューズとして正確に動作していることが確かめ られた。A low melting point metal having a phenolic paper laminated sheet made of spring steel and having an outer diameter of 3 mm, a length of 10 mm and a spring constant of 100 g / mm, one end connected with solder and the other end having a melting point of 97 ° C. It was fixed with (Sn-Pb-Bi alloy). This coil spring has a blocking direction, that is, a reaction force to the side opposite to the circuit board, and is fixed so as to block when the low melting point metal melts. An electric current was passed through the thermal fuse of this circuit board, a thermocouple was attached around the thermal fuse, and it was placed in an oven to gradually raise the temperature. The current flowing through the thermal fuse and the temperature at that time were measured, and the temperature at which the circuit was interrupted was determined. As a result, it was confirmed that the circuit was cut off within ± 1 ° C and that it was operating correctly as a thermal fuse.
【0013】[0013]
叙上のように、本考案によれば電気・電子機器用の温度ヒューズとして回路板 と一体化し、容易に取り付けができ正確な遮断をする温度ヒューズが得られる効 果を有する。 As described above, according to the present invention, a thermal fuse for electric and electronic equipment is integrated with a circuit board, and can be easily attached and can be accurately cut off.
【図1】本考案に使用されるバネの形状を示すもので
(a)はコイルバネ、(b)は板バネを示す。FIG. 1 shows the shape of a spring used in the present invention. (A) shows a coil spring and (b) shows a leaf spring.
【図2】回路板にコイルバネを取り付けた形状を示す。FIG. 2 shows a shape in which a coil spring is attached to a circuit board.
【図3】温度ヒューズとしてセットした状態を示す。FIG. 3 shows a state set as a thermal fuse.
【図4】遮断した温度ヒューズを示す。FIG. 4 shows an interrupted thermal fuse.
【図5】従来の温度ヒューズを示す。FIG. 5 shows a conventional thermal fuse.
1 コイルバネ 1a 板バネ 2 回路板 3 配線パタン 4 はんだ 5 低融点金属 10 セラミックスケース 11 低融点金属 12,13 端子 1 Coil spring 1a Leaf spring 2 Circuit board 3 Wiring pattern 4 Solder 5 Low melting point metal 10 Ceramics case 11 Low melting point metal 12, 13 Terminal
Claims (1)
れ、前記コイルバネの他端は前記の回路板上に設けられ
た低融点金属に接合され、前記コイルバネは低融点金属
を接合した部分と反対方向への復帰力を持たせ、異常時
には、前記の低融点金属が溶融し、コイルバネが低融点
合金からはずれ、回路遮断が行われることを特徴とする
温度ヒューズ。Claims for utility model registration: 1. One end of a conductive coil is connected to a circuit board, and the other end of the coil spring is joined to a low melting point metal provided on the circuit board. Has a restoring force in the direction opposite to the part where the low-melting point metal is joined, and when abnormal, the low-melting point metal melts and the coil spring comes out of the low-melting point alloy, causing a circuit break. fuse.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1154691U JPH051147U (en) | 1991-02-08 | 1991-02-08 | Temperature fuse |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1154691U JPH051147U (en) | 1991-02-08 | 1991-02-08 | Temperature fuse |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH051147U true JPH051147U (en) | 1993-01-08 |
Family
ID=11780963
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1154691U Pending JPH051147U (en) | 1991-02-08 | 1991-02-08 | Temperature fuse |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH051147U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51144843U (en) * | 1975-12-29 | 1976-11-20 |
-
1991
- 1991-02-08 JP JP1154691U patent/JPH051147U/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51144843U (en) * | 1975-12-29 | 1976-11-20 | ||
JPS5417133Y2 (en) * | 1975-12-29 | 1979-07-03 |
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