JPH0511472U - Flexible board with electronic components - Google Patents

Abstract

(57) [Abstract] [Purpose] An electronic component that prevents disconnection of electronic components without increasing costs by increasing the peel strength of the conductive adhesive and making the flexible substrate difficult to bend in the area where electronic components are mounted. Providing flexible boards with parts. A plurality of through holes 9 are provided around a region of the flexible substrate 1 on which the electronic component 4 is mounted, and the through holes 9 are provided.
The resin 10 for reinforcing the flexible substrate 1 and the conductive adhesive 6 for mounting electronic components are adhered to each other via the.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

  The present invention is equipped with electronic components that prevent disconnection of electronic components mounted on a flexible substrate. For flexible substrates.

[0002]

[Prior art]

  Flexible boards with electronic components mounted are reinforced and difficult to bend. Otherwise, the electronic components under bending stress will peel off from the flexible substrate. It is easy to cause a wire break. Therefore, conventionally, for example, a reinforcing structure as shown in FIG. Adopted to prevent disconnection of electronic parts.

[0003]   In FIG. 3, the flexible substrate 1 has a copper foil pattern on the surface of the base film 2. And is mounted at a predetermined position on the flexible substrate 1. The electronic component 4 is connected to the copper foil pattern 3 and the conductive adhesive 6 via the connection terminal 5. Therefore, the flexible substrate 1 is bent in the area where the electronic components 4 are mounted. In order to make it difficult, an adhesive agent is previously attached to the back surface of the base film 2 in the mounting area. A reinforcing plate 8 made of glass epoxy or the like is adhered to the reinforcing plate 8 through 7. The rigidity of the flexible substrate 1 is used to reduce the potential of electric shock when bending stress is applied to the flexible substrate 1. The child parts 4 and the conductive adhesive 6 are prevented from peeling off.

[0004]   In addition, copper foil patterns are formed on both sides of the flexible substrate base film. This increases the rigidity of the flexible board itself in the area where electronic components are mounted. A reinforced structure called "Oku" is also proposed.

[0005]

[Problems to be solved by the device]

  However, in the former reinforcing structure described above, the reinforcing plate 8 is prepared and Since the adhesive 7 is applied to the sible substrate 1, the material cost and the number of processes are increased. There is a problem that the cost will be increased due to Since the adhesive 7 is softened by the heat at the time of adhesion, the adhesiveness of the reinforcing plate 8 to the base film 2 There was a problem that was inferior.

[0006]   In addition, the latter reinforcement structure described above is also provided with a copper foil pattern for reinforcement. Therefore, there is a problem that the cost is greatly increased.

[0007]   The present invention has been made in view of such circumstances, and its purpose is to improve cost. Providing a flexible board with electronic components that can prevent disconnection of electronic components without disconnection To serve.

[0008]

[Means for Solving the Problems]

  In order to achieve the above-mentioned object of the present invention, the first invention is to provide a flexible substrate. The second invention is to apply a reinforcing resin to the back surface of the electronic component mounting area. A through hole is provided around the electronic component mounting area of the flexible substrate, and the through hole is formed. Conductive adhesive for mounting electronic components on the surface of flexible substrate and reinforcement for the back side via It is made by adhering with the resin of.

[0009]

[Action]

  According to the first invention, the back surface of the electronic component mounting area of the flexible substrate is supplemented. Since the rigidity has been increased to the minimum necessary with a strong resin, a flexible substrate Almost no flexibility is lost. Also, in the area where the resin is applied, The flexible substrate is less likely to bend, and peeling of electronic components and their connecting parts can be prevented.

[0010]   Further, according to the second invention, the periphery of the electronic part mounting area of the flexible board is A through hole is provided in the through hole, and a conductive adhesive for mounting electronic components on the front surface and a back surface supplement are provided through the through hole. Since the strong resin is adhered, the adhesive strength of the conductive adhesive is improved.

[0011]

【Example】

  An embodiment of the present invention will be described below with reference to the drawings.

[0012]   1 and 2 are explanatory views of a flexible board with electronic parts according to the present invention. 1 is a sectional view of the first embodiment, FIG. 2 is a sectional view of the second embodiment, and FIG. Corresponding parts are designated by the same reference numerals.

[0013]   As shown in FIG. 1, in this embodiment, the electronic component 4 on the surface of the flexible substrate 1 is used. A plurality of through holes 9 are formed around the mounting area of the A reinforcing resin 10 is applied so that the resin 10 is exposed on the surface of the through hole 9. Then, the connection terminal 5 of the electronic component 4 is attached to the surface of the flexible substrate 1 with the conductive adhesive 6. When adhering onto the copper foil pattern 3, the conductive adhesive 6 is exposed from the through hole 9 of the resin 10. It is applied so that it overlaps the surface.

[0014]   In other words, the conductive adhesive 6 and the reinforcing resin 10 surround the area where the electronic component 4 is mounted. It is bonded to both sides of the flexible substrate 1 by being bonded through the through holes 9 formed in the enclosure. As described above, the conductive contact fixed on both surfaces of the flexible substrate 1 is performed. The peel strength of the adhesive 6 and the resin 10 is extremely high. Therefore, depending on the rigidity of the resin 10, , The flexible substrate 1 is considerably difficult to bend in the area coated with the resin 10. Therefore, even when bending stress is applied to the flexible substrate 1, the electronic component 4 It is unlikely that each of the connection terminals 5 will peel, and the mounted electronic component 4 will be disconnected. It is a structure that is difficult to do. Moreover, since only the reinforcing resin 10 is used, Compared to conventional products, there is no increase in material costs and the number of processes, and there is no concern about cost increase. There are advantages. Also, the back surface of the mounting area of the electronic component 3 of the flexible substrate 1 is for reinforcement. Since the resin 10 has increased the rigidity within the minimum necessary range, the flexible substrate The flexibility of 1 is hardly lost.

[0015]   The main component resin of the conductive adhesive 6 and the reinforcing resin 10 are made of the same material. As a result, the adhesive force at the joint between the conductive adhesive 6 and the resin 10 is improved, The adhesive strength is further improved.

[0016]   Next, the embodiment shown in FIG. 2 is arranged in the electronic component mounting area of the flexible substrate 1. The flexible substrate 1 is coated with a reinforcing resin 10 on the back surface of the flexible substrate 1. Although the peel strength of the flexible adhesive 6 is slightly inferior to that of the above-described embodiment, the rigidity of the resin 10 causes The flexible substrate 1 becomes considerably difficult to bend in the region where the resin 10 is applied. Therefore, bending stress is applied to the flexible substrate 1 as in the previous embodiments. Even if a load is applied, the connection terminals 5 of the electronic component 4 are less likely to peel off, and are mounted. The electronic parts 4 that have been cut off are unlikely to cause disconnection, and there is no concern about cost increase. There are some points, and the flexible substrate 1 is made rigid by the resin 10 in the minimum necessary range. Since the property is enhanced, the flexibility is not lost.

[0017]   In addition, in bonding by connecting wire such as bare chip mounting, The present invention is realized by replacing the connection terminal 5 with a connection wire and the electronic component 4 with a bare chip. Can be implemented.

[0018]

[Effect of device]

  As described above, according to the present invention, the reinforcement for coating the flexible substrate Due to the rigidity of the resin in the Since the flexible board is hard to bend, the flexible board has almost no flexibility. Electrons that are not lost and are worried when bending stress is applied to the flexible substrate It is possible to prevent disconnection of parts, and moreover, because only the resin for reinforcement is used, the cost is improved. It has the effect of not being accompanied by a boost.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a flexible board with an electronic component according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of a flexible board with electronic components according to another embodiment of the present invention.

FIG. 3 is a cross-sectional view of a conventional flexible board with electronic components.

[Explanation of symbols]

1 Flexible substrate 4 electronic components 6 Conductive adhesive 9 through holes 10 Reinforcing resin

Claims (2)

[Scope of utility model registration request] 1. An electronic component-equipped flexible substrate having electronic components mounted on one surface thereof, wherein a resin for reinforcing the flexible substrate is applied to the other surface of the flexible substrate in the electronic component mounting area. Flexible board with parts. 2. A flexible board with electronic components, having electronic components mounted on one surface thereof, wherein a through hole is provided around an electronic component mounting area of the flexible substrate, and the flexible substrate is coated on one surface through the through hole. A flexible board with an electronic component, characterized in that a conductive adhesive for mounting an electronic component and a reinforcing resin coated on the other surface of the flexible substrate in the electronic component mounting area are bonded together.