JPH0511445U - Hybrid integrated circuit - Google Patents
Hybrid integrated circuitInfo
- Publication number
- JPH0511445U JPH0511445U JP058170U JP5817091U JPH0511445U JP H0511445 U JPH0511445 U JP H0511445U JP 058170 U JP058170 U JP 058170U JP 5817091 U JP5817091 U JP 5817091U JP H0511445 U JPH0511445 U JP H0511445U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- integrated circuit
- hybrid integrated
- fixing pad
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/183—Connection portion, e.g. seal
- H01L2924/18301—Connection portion, e.g. seal being an anchoring portion, i.e. mechanical interlocking between the encapsulation resin and another package part
Abstract
(57)【要約】
【目的】 ヒートシンク固着時に発生する余剰半田によ
る短絡等の弊害を防止する。
【構成】 基板（１）上に形成された固着パッド（３）
上に超音波振動を加えて固着されるヒートシンク（１
０）の固着底面部の周囲領域を部分的あるいは連続的に
窪ませる。
(57) [Summary] [Purpose] To prevent the adverse effects such as short circuit due to excess solder that occurs when the heat sink is fixed. [Structure] Fixed pad (3) formed on substrate (1)
A heat sink (1
The peripheral area of the fixed bottom surface of (0) is partially or continuously recessed.
Description
【０００１】[0001]
本考案は混成集積回路に関し、特に固着パッドに超音波振動を加えて固着され るヒートシンク構造に関する。 The present invention relates to a hybrid integrated circuit, and in particular, it is fixed by applying ultrasonic vibration to a fixing pad. Heat sink structure.
【０００２】[0002]
従来の混成集積回路は図５に示す如く、表面を絶縁処理したアルミニウム板の 如き良熱伝導性混成集積回路基板（２１）上に銅箔をエッチングして形成した所 望の導電路（２２）を有し、この導電路（２２）の一部に固着パッド（２３）も 同時に形成する。固着パッド（２３）はこれに固着するヒートシンク（２４）と 略同一形状に形成され、固着パッド（２３）には銅片等より成るヒートシンク（ ２４）を半田付けし、更にヒートシンク（２４）にはパワー半導体素子（２５） を固着している。 As shown in FIG. 5, the conventional hybrid integrated circuit is made of an aluminum plate whose surface is insulation-treated. Formed by etching a copper foil on a good thermal conductive hybrid integrated circuit board (21) such as The desired conductive path (22) is provided, and the fixing pad (23) is also provided in a part of this conductive path (22). Form at the same time. The fixing pad (23) has a heat sink (24) fixed thereto. The fixing pad (23) is formed in substantially the same shape, and the fixing pad (23) has a heat sink (copper piece) ( 24) is soldered, and the power semiconductor element (25) is further attached to the heat sink (24). Is stuck.
【０００３】 斯上した構造に於いて固着パッド（２３）に隣接して他の導電路（２２）が配 置されていると、固着パッド（２３）にヒートシンク（２４）を超音波振動を加 えて半田付けする際にはみ出した半田が基板（２１）表面の樹脂層上で球状とな り隣接する他の導電路（２２）と短絡するおそれがあった。上記した問題は半田 クリームの量を比較的少なく設定すれば容易に解決できるものであるが、ヒート シンクと固着パッドとを確実に固着させ且つ熱抵抗をある程度低くするためには 、半田クリーム量をどうしても若干多めに印刷しなければならないという解決で きない問題があった。[0003] In the above structure, another conductive path (22) is arranged adjacent to the fixing pad (23). When placed, the heat sink (24) is subjected to ultrasonic vibration to the fixing pad (23). When soldering, the protruding solder becomes spherical on the resin layer on the surface of the substrate (21). There was a risk of short-circuiting with another adjacent conductive path (22). The above problems are solder It can be easily solved by setting a relatively small amount of cream, but heat In order to securely fix the sink and the fixing pad and to reduce the thermal resistance to some extent, The solution is that you have to print a little larger amount of solder cream. There was a problem that I could not.
【０００４】 かかる問題を解決するために種々の提案がなされている。先ず、第１に、図５ に示す如く、固着パッド（２３）の少なくとも一側辺に拡張部（２６）を設け、 超音波振動印加時に生ずる余剰半田を拡張部（２６）で吸収する。第２に、図６ に示す如く、ヒートシンク（３０）の側面に溝（３１）を設け、超音波振動印加 時に生ずる余剰半田を溝（３１）を通じてせり上げて吸収する。というような提 案が既に為されている。[0004] Various proposals have been made to solve such problems. First, as shown in FIG. As shown in FIG. 3, an expansion portion (26) is provided on at least one side of the fixing pad (23), Excessive solder generated when ultrasonic vibration is applied is absorbed by the expansion portion (26). Second, FIG. As shown in, a groove (31) is provided on the side surface of the heat sink (30) to apply ultrasonic vibration. Excessive solder that sometimes occurs is raised through the groove (31) and absorbed. Such as The plan has already been made.
【０００５】[0005]
上述した提案は、超音波振動による余剰半田による問題点を防止することがで きるものの新たな問題が発生する。 即ち、図５に示す如き、固着パッド（２３）に拡張部（２６）を設ける構造に おいては、固着パッド（２３）に必らず余剰半田を確実に吸収することができる 比較的大きめの拡張部（２６）を形成しなければならず実装面積が低下し混成集 積回路の小型化の防げとなる。 The above-mentioned proposal can prevent problems due to excess solder due to ultrasonic vibration. However, new problems will occur. That is, as shown in FIG. 5, the fixing pad (23) is provided with the expansion portion (26). In this case, the excess solder can be surely absorbed by the fixing pad (23). A relatively large extension (26) must be formed, reducing the mounting area This prevents the miniaturization of the product circuit.
【０００６】 また、図６に示す如き構造では、ヒートシンク（３０）の溝（３１）でせり上 り現像で半田を吸収させなければならず、ヒートシンク（３０）の肉厚をある程 度厚く形成しないとせり上り半田がヒートシンク上に固着された半導体チップま でせり上り不良となる恐れがある。さらに図６に示す構造ではヒートシンク（３ ０）に側面に溝を形成しなければならず、かかる溝を形成するため専用のプレス 打抜き工程が必要である。[0006] Further, in the structure as shown in FIG. 6, the groove (31) of the heat sink (30) is lifted up. It is necessary to absorb the solder during development, and the thicker the heat sink (30) If it is not thick enough, the rising solder or the semiconductor chip fixed on the heat sink There is a risk that it will rise and become defective. Further, in the structure shown in FIG. 6, a heat sink (3 It is necessary to form a groove on the side surface in 0), and a dedicated press for forming such a groove. A punching process is required.
【０００７】[0007]
本考案は上述した課題に鑑みて為されたものであり、固着パッド上に固着され るヒートシンクの底面部の周囲領域を窪ませたことを特徴とする。 また、本考案の混成集積回路のヒートシンクは銅、インバー、銅のクラッド材 あるいは銅材により構成したことを特徴とする。 The present invention has been made in view of the above problems, and is fixed on the fixing pad. It is characterized in that the peripheral area of the bottom surface of the heat sink is recessed. In addition, the heat sink of the hybrid integrated circuit of the present invention is made of copper, invar, copper clad material. Alternatively, it is characterized by being made of a copper material.
【０００８】[0008]
以上に述べたように本考案の混成集積回路にあっては、ヒートシンクを固着パ ッドに半田付けする際に超音波振動による余剰半田をヒートシンクの底面の周囲 領域に形成された窪部で吸収することができる。その結果、余剰半田のはみ出し が発生せず隣接する導電路と短絡することを防止することができる。 As described above, in the hybrid integrated circuit of the present invention, the heat sink is fixed to the pad. Excess solder due to ultrasonic vibration when soldering to the It can be absorbed by the recess formed in the region. As a result, excess solder squeezes out It is possible to prevent the occurrence of short circuit and short circuit with the adjacent conductive path.
【０００９】 また、本考案の混成集積回路では固着パッドの大きさをヒートシンクと略同一 として余剰半田を吸収できるため小型化に寄与することができる。[0009] Also, in the hybrid integrated circuit of the present invention, the size of the fixing pad is almost the same as that of the heat sink. As a result, excess solder can be absorbed, which can contribute to downsizing.
【００１０】[0010]
以下に図１乃至図３に示した実施例に基づいて本考案を説明する。 混成集積回路基板（１）としては熱抵抗の低い表面をアルマイト処理したアル ミニウム板あるいは表面に絶縁被覆を貼ったアルミニウム板を用いる。 導電路（２）は基板（１）の全面に銅箔を貼った後、所望の形状にエッチング して形成される。 The present invention will be described below based on the embodiment shown in FIGS. As the hybrid integrated circuit board (1), the surface with low thermal resistance is anodized Use a minium plate or an aluminum plate with an insulating coating on the surface. The conductive path (2) is etched into a desired shape after applying a copper foil on the entire surface of the substrate (1). Formed.
【００１１】 固着パッド（３）はヒートシンク（１０）を固着するためのもので、それと略 同一に形状され、上述した導電路（２）の形成時に同時に形成される。 ヒートシンク（１０）は例えば銅材により形成され、その一主面上にはトラン ジスタ等の発熱を伴うパワー半導体素子（６）が溝（１０Ａ）に囲まれた略中央 部の領域上に半田等を用いて固着されている。かかるパワー半導体素子（６）は エポキシ樹脂等の封止樹脂（１１）によって完全に封止されている。[0011] The fixing pad (3) is for fixing the heat sink (10), and is substantially the same as that. They have the same shape and are formed at the same time when the above-mentioned conductive path (2) is formed. The heat sink (10) is made of, for example, a copper material and has a transformer on one main surface thereof. Power semiconductor element (6) with heat generation, such as a transistor, is surrounded by a groove (10A) in the approximate center It is fixed to the region of the portion by using solder or the like. The power semiconductor element (6) is It is completely sealed with a sealing resin (11) such as an epoxy resin.
【００１２】 本考案の特徴とするところはヒートシンク（１０）の底面部（１０Ｂ）の周囲 領域を部分的あるいは連続的に底面部（１０Ｂ）より窪ませ、窪部（１０Ｃ）を 構成させたところにある。この窪部（１０Ｃ）は半田クリームの余剰量を吸収す るためのものであるが、窪部（１０Ｃ）形状があまり深すぎるとヒートシンク（ １０）の側面から半田層が窪部（１０Ｃ）内にえぐれてしまい熱抵抗が悪くなる ため、窪部（１０Ｃ）の深さはヒートシンク（１０）の大きさにかかわらず約０ ．０５ｍｍ〜０．２ｍｍ程度あればよい。[0012] The feature of the present invention is that the heat sink (10) surrounds the bottom surface (10B). The area is partially or continuously recessed from the bottom surface portion (10B), and the recessed portion (10C) is formed. It is in the place where it was made to structure. This recess (10C) absorbs the excess amount of solder cream. However, if the shape of the recess (10C) is too deep, the heat sink ( The solder layer is dug into the recess (10C) from the side surface of 10) and the thermal resistance deteriorates. Therefore, the depth of the recess (10C) is about 0 regardless of the size of the heat sink (10). ． It may be about 05 mm to 0.2 mm.
【００１３】 ところで、この窪部（１０Ｃ）はヒートシンク（１０）上面に形成した溝（１ ０Ａ）を形成する工程に同時形成することができる。即ち、図２に示す如く、ヒ ートシンク（１０）となる銅材（１０）を下金型（１２）上に載置し、かかる下 金型（１２）上には窪を形成するような凹部（１２Ａ）が形成されており、溝（ （１０Ａ）となる突部（１３Ａ）を有した上金型（１３）を降下させて銅材（１ ０Ｘ）を下金型（１２）と上金型（１３）とを挾持するようにプレスするだけで 銅材（１２Ｘ）の一主面には溝（１０Ａ）が形成され、反主面には窪（１０Ｃ） が形成されることになる。かかるプレス工程後に所望の大きさのヒートシンクと なるように銅材をプレス打抜きして銀等のメッキ処理が施されヒートシンク（１ ０）が形成される。[0013] By the way, the recess (10C) is formed in the groove (1) formed on the upper surface of the heat sink (10). It can be formed simultaneously with the step of forming 0A). That is, as shown in FIG. Place the copper material (10) that will become the sink (10) on the lower die (12), A recess (12A) that forms a recess is formed on the mold (12), and a groove ( The upper die (13) having the protrusion (13A) to be (10A) is lowered to lower the copper material (1 Just press (0X) so as to hold the lower mold (12) and the upper mold (13). A groove (10A) is formed on one main surface of the copper material (12X), and a recess (10C) is formed on the opposite main surface. Will be formed. After such a pressing process, a heat sink of a desired size and Copper material is press-punched so that it is plated with silver or other heat sink (1 0) is formed.
【００１４】 ヒートシンク（１０）上には上述したようにパワー半導体素子（６）が固着さ れ、ヒートシンク（１０）が固着パッド（３）上に固着される。従来技術でも述 べたように固着パッド（３）には若干多めの半田クリームが印刷され、基板（１ ）を加熱し半田クリームを溶融させ、かかる半田クリーム上にヒートシンク（１ ０）を載置させ図３に示す如く、ヒートシンク（１０）に超音波振動を印加させ る治具（１４）を当させて超音波振動を印加する。すると半田（１５）は一旦窪 部（１０Ｃ）と固着パッド（３）で形成される空間領域内に収納され、超音波振 動印加停止後、窪部（１０Ｃ）内に収納された半田が表面張力によりヒートシン ク（１０）の底面中央部に流れ込み図１に示す如く、半田層（１５Ａ）が形成さ れることになる。窪部（１０Ｃ）内に一旦半田が収納されるときに本来生ずる余 剰な半田も吸収されており、固着パッド（３）に隣接して導電路（２）を形成し ても従来の如き問題は発生しない。[0014] The power semiconductor element (6) is fixed on the heat sink (10) as described above. Then, the heat sink (10) is fixed on the fixing pad (3). Described in the prior art The sticky pad (3) was printed with a slightly larger amount of solder cream like a solid, and ) Is heated to melt the solder cream, and a heat sink (1 0) is placed and ultrasonic vibration is applied to the heat sink (10) as shown in FIG. The jig (14) is applied to apply ultrasonic vibration. Then, the solder (15) is once depressed It is housed in the space area formed by the portion (10C) and the fixing pad (3), and ultrasonic vibration is applied. After the dynamic application is stopped, the solder contained in the recess (10C) is heated by the surface tension and the heat sink (10) flows into the center of the bottom surface of the solder (10) to form a solder layer (15A) as shown in FIG. Will be done. Extra space originally generated when the solder is once stored in the recess (10C) Excess solder is also absorbed, forming a conductive path (2) adjacent to the fixed pad (3). However, the problem as in the past does not occur.
【００１５】 ところで、ヒートシンク（１０）は銅材に限られるものではなく、例えば、図 ４に示す如く、銅（４）、インバー（５）、銅（４）のクラッド材からなる金属 片を用いても本発明と同様の作用効果が期待できる。[0015] By the way, the heat sink (10) is not limited to the copper material. As shown in 4, a metal made of a clad material of copper (4), invar (5), and copper (4) Even if one piece is used, the same effect as the present invention can be expected.
【００１６】[0016]
以上に詳述した如く、本考案に依れば、ヒートシンク（１０）の底面部の周囲 部を窪ませ窪部（１０Ｃ）を形成することにより、従来発生していた超音波振動 印加に生ずる余剰半田を確実に窪部（１０Ｃ）で形成される。空間で吸収するこ とができるので固着パッド（３）から余剰半田のはみ出しを防止することができ る。また、その結果、ヒートシンク（１０）に加える固着時の超音波エネルギー が少々異なっても工程の自動化に寄与できる。 As described in detail above, according to the present invention, the periphery of the bottom surface of the heat sink (10) is Vibrations that have been generated in the past by forming recesses (10C) Excess solder generated by the application is surely formed in the recess (10C). Can be absorbed in space It is possible to prevent the excess solder from squeezing out from the fixing pad (3). It Also, as a result, ultrasonic energy applied to the heat sink (10) at the time of fixation Even if it is slightly different, it can contribute to the automation of the process.
【図面の簡単な説明】[Brief description of drawings]
【図１】図１は本考案の混成集積回路を示す断面図であ
る。FIG. 1 is a sectional view showing a hybrid integrated circuit of the present invention.
【図２】図２はヒートシンクの製造を示す断面図であ
る。FIG. 2 is a cross-sectional view showing manufacturing of a heat sink.
【図３】図３はヒートシンクを基板上に固着するときの
断面図である。FIG. 3 is a cross-sectional view when a heat sink is fixed on a substrate.
【図４】図４は他の実施例を説明する断面図である。FIG. 4 is a sectional view illustrating another embodiment.
【図５】図５は従来例を示す上面図である。FIG. 5 is a top view showing a conventional example.
【図６】図６は従来例を示す斜視図である。FIG. 6 is a perspective view showing a conventional example.
（１） 基板 （２） 導電路 （３） 固着パッド （１０） ヒートシンク （１０Ｃ） 窪部 (1) Substrate (2) Conductive path (3) Fixed pad (10) Heat sink (10C) Recess
Claims (3)
板上に設けた所望の導電路と前記導電路の一部に設けた
ヒートシンクと略同一形状の固着パッドと前記固着パッ
ドに超音波振動を加えて半田付けしたヒートシンクと前
記ヒートシンク上に固着したパワー半導体素子とを具備
し、前記固着パッドに固着されるヒートシンク底面部の
周囲領域を部分的あるいは連続的に前記底面部より窪ま
せたことを特徴とする混成集積回路。1. A fixing pad having substantially the same shape as a hybrid integrated circuit board having good thermal conductivity, a desired conductive path provided on the board, and a heat sink provided on a part of the conductive path, and ultrasonic waves applied to the fixing pad. A heatsink soldered by applying vibration and a power semiconductor element fixed on the heatsink are provided, and a peripheral region of the bottom surface of the heatsink fixed to the fixing pad is partially or continuously recessed from the bottom surface. A hybrid integrated circuit characterized by the above.
シンク固着時に生ずる余剰半田が吸収されることを特徴
とする請求項１記載の混成集積回路。2. The hybrid integrated circuit according to claim 1, wherein excess solder produced when the heat sink is fixed is absorbed by the recess formed in the peripheral region.
クラッド材あるいは銅材により構成されることを特徴と
する請求項１記載の混成集積回路。3. The hybrid integrated circuit according to claim 1, wherein the heat sink is made of copper, Invar, a copper clad material, or a copper material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991058170U JP2521286Y2 (en) | 1991-07-24 | 1991-07-24 | Hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991058170U JP2521286Y2 (en) | 1991-07-24 | 1991-07-24 | Hybrid integrated circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0511445U true JPH0511445U (en) | 1993-02-12 |
| JP2521286Y2 JP2521286Y2 (en) | 1996-12-25 |
Family
ID=13076527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1991058170U Expired - Lifetime JP2521286Y2 (en) | 1991-07-24 | 1991-07-24 | Hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2521286Y2 (en) |
-
1991
- 1991-07-24 JP JP1991058170U patent/JP2521286Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2521286Y2 (en) | 1996-12-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |