JPH05110294A - Position correction method for electronic part inserting machine - Google Patents

Abstract

PURPOSE:To make it possible to perform part inserting work smoothly by correcting angle position of electronic part without damaging lead wires even for an electronic part having no adequate relative positional relation between the external shape and the lead wires. CONSTITUTION:Under the state of holding an electronic part having a plurality of lead wires 5 with a chuck, light is applied from one direction and lead wires 5 are detected, then angle position correction of the electronic part 1 is made based on the detected information so that the angle between the irradiated light direction and the lead wire line is a predetermined one.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a position correcting method for performing positioning with high accuracy when automatically inserting an electronic component having a plurality of lead wires into a circuit board.

[0002]

2. Description of the Related Art As a device for automatically inserting an electronic component having a plurality of lead wires into a circuit board, a device shown in FIGS. 2 and 3 is used. This automatic insertion device is configured to separate the electronic components 1 one by one, chuck the positioned electronic components 1 with a chuck 2 of a robot 8, and then insert the electronic components 1 into a predetermined position of a circuit board 3. There is.

The conventional positioning method for electronic parts is
As shown in FIG. 7, the electronic component 1 is chucked by the chuck 2 on the basis of its outer shape, and the lead wire 5 is positioned.

[0004]

As shown in FIG. 7, when the correlation position between the outer shape of the electronic component 1 and the lead wire 5 is correct, the lead wire 5 is positioned at the correct position by using the outer shape as a reference. You can set and perform automatic insertion work smoothly. However, as shown in FIG. 8, when the outer shape of the electronic component 1 is distorted, the lead wire
If the positioning is performed, the lead wire 5 will not be set in the correct position, and it will be difficult to smoothly perform the automatic insertion work.

[0005]

According to a first aspect of the present invention, in the state where an electronic component having a plurality of lead wires is held on a chuck, the lead wires are detected by irradiating light from one direction, and the detection information is obtained. On the basis of the above, the angular position of the electronic component is corrected so that the angle formed by the lead wire array and the light irradiation direction becomes a predetermined angle.

In the second invention of the present application, after the angular position correction in the first invention is performed, light is irradiated again from one direction to detect the lead wire, and whether the lead wire array is within a predetermined angle range or not. Is determined and the electronic component determined to be within the predetermined angle range is inserted into the circuit board.

According to a third aspect of the present invention, in the angular position correcting step of the first aspect of the present invention, the electronic component having a plurality of lead wires is held on a chuck, and the lead wire array and the light irradiation direction are in the same direction. The step of irradiating light from one direction to detect the lead wire and correcting the position of the electronic component in the X direction based on the detection information and the lead wire array of the electronic component and the light irradiation direction are at right angles. In this state, the lead wire is detected by irradiating light from one direction, and the Y of the electronic component is detected based on this detection information.
And a step of performing directional position correction.

[0008]

According to the first invention of the present application, when the outer shape of the electronic component 1 is distorted as shown in FIG. 8 and an appropriate correlation positional relationship is not established between the outer shape and the lead wire array L of the lead wire 5. However, the light measuring means 9 such as a laser measuring device directly detects the lead wire, and the angle of the electronic component 1 is adjusted so that the angle formed by the lead wire array L and the light irradiation direction becomes a predetermined angle based on the detected information. Position correction can be performed. Therefore, as shown in FIG. 9, it is possible to perform the component insertion work while holding the electronic component 1 in which the lead wire array L is set at the correct angular position on the chuck 2.

Further, according to the first invention of the present application, since the lead wire 5 is measured in a non-contact manner, the component inserting work can be performed without damaging the lead wire (foot) 5 of the electronic component 1.

According to the second invention of the present application, after the angular position correction of the electronic component is performed as described above, it is determined again whether or not the angular position is correct. Will be possible.

According to the third invention of the present application, by detecting the lead wire array L, all of the angular position, the X-direction position, and the Y-direction position can be corrected to correct positions, so that the outer shape and the lead wire array L are corrected. Even with respect to the electronic component 1 for which an appropriate correlation positional relationship is not established between and, the component insertion work can be performed with high accuracy without damaging the lead wire array 5.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to the drawings.

2 and 3 show an electronic component automatic inserting machine. This automatic insertion machine is a component supply for supplying an electronic component 1 having a conveyor 4 for conveying the circuit board 3, a positioning unit 6 for positioning the circuit board 3, and a plurality of lead wires (feet) 5 as shown in FIG. A device 7 and a robot 8 for transferring and inserting the electronic component 1 supplied from the component supply device 7 to a predetermined position on the circuit board 3 are provided. The robot 8 is shown in FIG.
4 is a four-axis robot that can move in four directions of X, Y, Z, and α, and has a chuck 2 that detachably holds an electronic component 1 at its tip. The chucking method of the chuck 2 includes a suction method and a clamping method.

A laser measuring device 9 for measuring the lead wire 5 of the electronic component 1 is arranged between the component supplying position of the component supplying device 7 and the setting position of the circuit board 3. The laser measuring device 9 irradiates the lead wire 5 with laser light from a light emitting portion 9a and detects a shadow of the laser light by a light receiving portion 9b. The data detected by the laser measuring device 9 is input to the control device 10. As shown in FIG. 3, the control device 10 includes a measurement unit 10a, a calculation correction unit 10b, and an NC program device 10c, and controls the robot 8.

Next, an automatic insertion method and a position correction method for the electronic component 1 will be described with reference to FIG.

The robot 8 moves from the origin position to the component supply device 7
To the component supply position (step # 1) and chuck 2
Then, the electronic component 1 is chucked (step # 2).
At this time, if the electronic component 1 is not in the component supply position,
The chucking operation is repeated again (step # 3). When the chuck 2 chucks the electronic component 1, the robot 8 moves to move the electronic component 1 to the measurement position of the laser measuring instrument 9 (step # 4).

Here, as shown in FIG. 4, in order to obtain the angle θ of the lead wire array L, the illustrated value e is measured (step # 5). A value E as a master dimension is registered in advance in the control device 10, and the angle θ can be obtained by calculating the difference between the measured value e and the master value E. Then, based on the obtained angle θ, the angular position of the electronic component 1 is determined (at this time, the angle of the lead wire array L becomes the determined angle).

(Step # 6). Specifically, the robot 8 rotates in the α direction by a predetermined angle based on a correction command from the control device 10.

With the angular position thus corrected, the value e is measured again as shown in FIG. Then, it is determined whether the measured value e matches the master value E within a predetermined range (step # 7). If they do not match, the electronic component 1 is regarded as a defective angle and the discharge box 1
1 (see FIG. 2) (step # 18).

When it is determined that the angle is proper, the robot 8 rotates in the α direction by a predetermined angle to bring the electronic component 1 into a state in which its thickness direction can be measured. That is, as shown in FIG. 5, the attitude of the electronic component 1 is adjusted in the direction in which the laser beam and the direction of the lead wire array L match.

In this state, the laser measuring device 9
In order to obtain the thickness dimension, the illustrated value f is measured (step # 8). Next, it is determined whether or not the measured value f matches the master value F within a predetermined range (step # 9). If they do not match, the electronic component 1 is discarded in the discharge box 11 as a dimension defect in the thickness direction (step # 18).

When it is judged that the dimension in the thickness direction is appropriate, then the dimension g in the X direction between the reference pin 12 and the lead wire array L is measured and compared with the master value G to correct in the X direction. A value is obtained, and the robot 8 moves in the X direction to perform the X direction correction (step # 10).

Next, the robot 8 rotates 90 ° in the α direction,
The electronic component 1 is put in a state in which measurement in the width direction is possible. That is, as shown in FIG. 6, the attitude of the electronic component 1 is adjusted so that the laser light and the direction of the lead wire array L are orthogonal to each other. In this state, the laser measuring instrument 9 measures the illustrated value h to obtain the width dimension (step # 11). Next, it is determined whether the measured value h matches the master value H within a predetermined range (step # 12). If they do not match, the electronic component 1 is discarded in the discharge box 11 as a dimension defect in the width direction (step # 1).
8).

When it is determined that the dimension in the width direction is appropriate, the dimension i between the reference pin 12 and the end of the lead wire array L is then measured and compared with the master value I to obtain a correction value in the Y direction. Ask for. Based on this correction value, the robot 8 moves 90 °
By performing reverse rotation to return to the original rotational position and movement in the Y direction, Y direction correction is performed (step # 13).

As described above, after the lead wire 5 of the electronic component 1 is measured by the laser measuring device 9 to correct the position of the lead wire 5 in the α, X, and Y directions, the robot 8 is moved.
Transports the electronic component 1 toward the component insertion position (step # 14). At this time, the circuit board 3 is conveyed by the conveyor 4 and positioned by the positioning unit 6. After confirming that the circuit board 3 is positioned (step # 15), the robot 8 inserts the electronic component 1 into the circuit board 3 (step # 16). If the insertion is unsuccessful, the floating sensor mounted on the chuck 2 operates, and the electronic component 1 is discarded as an insertion failure and is discarded in the discharge box 11 (step # 17 # 18).

In the above embodiment, the chuck 2 of the robot 8 is used.
Is rotated in the α direction and the lead wire 5 is measured by the laser measuring device 9 at each predetermined angular position of the electronic component 1. However, the chuck 2 is not rotating and the light of the laser measuring device 9 or the like is measured. It is also possible to configure the measuring device to rotate to each predetermined angular position to perform the measurement.

[0027]

According to the first invention of the present application, the angular position of an electronic component can be corrected without damaging the lead even for an electronic component in which a proper correlation positional relationship between the outer shape and the lead wire array is not established. Therefore, the component insertion work can be smoothly performed.

According to the second invention of the present application, in addition to the effect of the first invention, the angular position of the electronic component can be corrected with higher accuracy.

According to the third invention of the present application, even for an electronic component in which a proper correlation positional relationship is not established between the outer shape and the lead wire array, the angular position and the X-direction position of the electronic component can be obtained without damaging the lead wire. Also, the Y-direction position can be corrected smoothly, and the component insertion work can be smoothly performed.

[Brief description of drawings]

FIG. 1 is a flowchart showing a position correction method according to an embodiment of the present invention.

FIG. 2 is a schematic plan view showing an example of an electronic component insertion device.

FIG. 3 is a perspective view of a main part thereof.

FIG. 4 is a plan view showing a position measuring method.

FIG. 5 is a plan view showing a position measuring method.

FIG. 6 is a plan view showing a position measuring method.

FIG. 7 is a diagram showing a relationship between an electronic component and a chuck.

FIG. 8 is a diagram showing a relationship between an electronic component and a chuck.

FIG. 9 is a diagram showing a relationship between an electronic component and a chuck.

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Ippei Akagi 840 Chiyoda-cho, Himeji-shi, Hyogo Mitsubishi Electric Corporation Himeji Works (72) Inventor Yoshinori Osaka 840 Chiyoda-cho, Himeji-shi Hyogo Mitsubishi Electric Himeji Manufacturing Co., Ltd. (72) Inventor Koichi Minamiya 840 Chiyoda-cho, Himeji City, Hyogo Prefecture Mitsubishi Electric Corporation Himeji Works

Claims (3)

[Claims] 1. An electronic component having a plurality of lead wires is held on a chuck, and the lead wires are detected by irradiating light from one direction, and the lead wire array and the light irradiation direction are detected based on the detection information. A position correction method in an electronic component insertion device, characterized in that an angular position of an electronic component is corrected so that an angle formed by is equal to a predetermined angle. 2. After performing the angular position correction according to claim 1, light is emitted from one direction again to detect the lead wire, and it is determined whether or not the lead wire array is within a predetermined angular range, A position correction method in an electronic component insertion device, characterized in that an electronic component determined to be within the angular range is inserted into a circuit board. 3. The step of correcting the angular position according to claim 1, wherein an electronic component having a plurality of lead wires is held on a chuck, and the lead wire array and the light irradiation direction are in the same direction. In the step of irradiating light from the direction to detect the lead wire and correcting the position of the electronic component in the X direction based on the detection information, and in the state where the lead wire row of the electronic component and the light irradiation direction are at right angles A position correction method in an electronic component insertion apparatus, which comprises irradiating light from one direction to detect the lead wire and correcting the position of the electronic component in the Y direction based on the detection information.