JPH05110281A - High-frequency electronic device - Google Patents

Abstract

PURPOSE:To bring a shielding-case parting plate, a shield-case top plate and a shield-case bottom plate into contact with one another sufficiently grounding them, and to improve sealing properties in a shield case. CONSTITUTION:Lined projections 15a, 15b, 16a, 16b are formed around the slits 15A, 15B, 16A, 16B of shield cases 15, 16, and parts of shield-case partitioning plates 13, 14 are inserted into the slits 15A, 15B, 16A, 16B and the contacting state of the shield-case partitioning plates 13, 14 and the shield- case intermediate plates 15, 16 is improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high frequency electronic device such as a tuner used in a television receiver or a VTR.

[0002]

2. Description of the Related Art In recent years, high-frequency electronic devices having a built-in printed circuit board with a high-frequency circuit are housed in a metal shield case or the like and hermetically sealed to prevent interference from external electronic circuits or to prevent external electronic circuits from being disturbed. The structure is such that interference is prevented. For example, FIG. 5 is an assembly configuration diagram of a conventional high frequency electronic device. A conventional high frequency electronic device will be described with reference to FIG.

In FIG. 5, 1 is a printed circuit board for a high frequency electronic circuit, 1A and 1B are slits 1a, 1b and 1c provided on the printed circuit board 1, respectively, which are chip parts constituting the high frequency electronic circuit, and 2 and 3 are made of metal. Shield case side plates, 4 and 5 are metal shield case partition plates that penetrate the printed circuit board 1, 6 and 7 are metal shield case middle plates, 8 is a shield case top plate, and 9 is a shield case bottom plate. is there.

A plurality of chip parts 1a, 1b, 1c for mounting a high frequency electronic circuit are mounted on the printed circuit board 1 and are surrounded by metal shield case side plates 2 and 3. Further, the chip component 1a on the printed circuit board 1 is another component on the printed circuit board 1,
For example, in order to prevent the chip component 1b from being adversely affected and, conversely, being affected by the chip component 1-b, the slits 1-A and 1-B of the printed circuit board 1 are made of metal that penetrates the printed circuit board. Shield case partition plates 4 and 5 are provided to separate the chip components.
Further, shield case middle plates 6 and 7 are provided between the printed circuit board 1 provided with the shield case partition plates 4 and 5, and the shield case top plate 8 and the shield case bottom plate 9, respectively, and the shield case partition plate 4 and By penetrating and connecting 5 therethrough, a structure close to a hermetic structure is formed to prevent adverse effects due to interference between chip components inside the high frequency device. The printed circuit board 1, the shield case side plates 2 and 3, and the shield case partition plates 4 and 5 are arranged so that the ground of the printed circuit board 1 having such a structure can be taken from the shield case top plate 8 or the shield case bottom plate 9 by contact.
Are conducted by soldering, and the shield case middle plates 6 and 7 are also made of a conductive material, for example, a phosphor bronze plate having a thickness of about 0.1 mm, or an iron plate plated with electric tin.

[0005]

However, in the above-described conventional structure, the shield case side plates 2 and 3 and the shield case partition plates 4 and 5 have a small portion where the shield case top plate 8 and the shield case bottom plate 9 contact each other, which is sufficient. In addition, it is difficult to establish a ground, and the inside of the high-frequency electronic device does not have a structure close to a hermetically sealed state, so that interference between chip components cannot be reliably prevented, which adversely affects.

The present invention has been made to solve the above-mentioned conventional problems. The shield case side plate, the shield case partition plate, the shield case top plate, and the shield case bottom plate can be sufficiently brought into contact with each other for grounding. , The purpose is to enhance the airtightness of the space created by the shield case partition plate and the shield case middle plate.

[0007]

In order to achieve this object, in the high-frequency electronic device of the present invention, instead of the conventional shield case middle plate, a row of protrusions, for example, in a staggered arrangement, is used as a shield case partition. The shield case middle plate provided near the slit through which the plate penetrates is provided between the printed circuit board and the shield case top plate and between the printed circuit board and the shield case bottom plate.

[0008]

With this configuration, it is possible to sufficiently ground the shield case side plate and the shield case partition plate to the shield case top plate or the shield case bottom plate, and the shield case partition plate and the shield case middle plate. The hermeticity of the space created by the shield case partition plate and the shield case middle plate can be improved.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to FIGS. FIG. 1 shows an assembly structure of the high frequency electronic device of the present invention. 1 to 4, 10 is a printed circuit board on which a high-frequency electronic circuit is mounted, 10A, 10
B is a slit, 10a, 1 provided on the printed circuit board 10.
Reference numerals 0b and 10c respectively denote chip components constituting a high-frequency electronic circuit, 11 and 12 denote metal shield case side plates, 1
3 and 14 are metal shield case partition plates that penetrate the printed circuit board 10, 15 is a metal first shield case middle plate, and 15A and 15B are slits in the first shield case middle plate 15, and 15a and 15b. Is a projection row of the first shield case middle plate 15, 16 is a second shield case middle plate made of metal, 16A and 16B are slits of the second shield case middle plate 16, and 16a and 16b are second shield cases. The first shield case middle plate 15 is formed by the projection row of the middle plate 16.
Each of the slits 16A, 1 as well as the protrusion rows 15a, 15b of
6B is provided around 6B, 17 is a top plate of the shield case, and 18 is a bottom plate of the shield case.

The operation of the high-frequency electronic device configured as described above will be described below. First, a plurality of chip components are mounted on the printed circuit board 10 to form a high-frequency electronic circuit, and here, for example, a first chip component 10a, a second chip component 10b, and a third chip component 10c. .. The printed circuit board 10 is surrounded by metal shield case side plates 11 and 12. The first chip component 10a on the printed circuit board 10 is another component on the same printed circuit board 1,
For example, interference with the second chip component 10b or the third chip component 10c, and the second chip component 1
0b or the slits 1 on the printed circuit board 10 in order to prevent interference from the third chip component 10c.
0A and 10B are provided, a part of the first shield case partition plate 13 made of metal penetrates through the slit 10A, and a part of the second shield case partition plate 14 made of metal passes through the slit 10B. It penetrates and prevents mutual interference between chip parts. Part of the first and second shield case partition plates 13 and 14 is also the shield case middle plate 1.
5 and 16 slits 15A, 15B, 16 respectively
Although passing through A and 16B, each slit 15A and 15B16 of these shield case middle plates 15 and 16
There are 15 staggered rows of protrusions around A and 16B.
a, 15b, 16a, 16b are provided and the slit is
The surface area in contact with the shield case middle plate 15 penetrating A, 15B, 16A, 16B and the shield case partition plates 13, 14 penetrating the shield case middle plate 16 is increased. Therefore, the contact state between the shield case middle plates 15 and 16 and the shield case partition plate is improved.

[0011]

As described above, in the high frequency electronic device of the present invention, since the shield case partition plate and the shield case middle plate are sufficiently in contact with each other, the conduction between the printed circuit board and the shield case middle plate is ensured, and the shield case is secured. The ground can be taken from the top plate or the bottom plate of the shield case. In addition, the airtightness inside the shield case can be improved.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of a high frequency electronic device showing an embodiment of the present invention.

FIG. 2 is a plan view of a first shield case middle plate of the high-frequency electronic device according to the first embodiment of the present invention.

FIG. 3 is a side view of the first shield case middle plate of the high-frequency electronic device according to the first embodiment of the present invention.

FIG. 4 is an enlarged plan view of the first shield case middle plate of the high-frequency electronic device according to the first embodiment of the present invention.

FIG. 5 is an exploded perspective view of a conventional high frequency electronic device.

[Explanation of symbols]

 10 Printed Circuit Board 10A First Slit 10B Second Slit 10a First Chip Component 10b Second Chip Component 10c Third Chip Component 11 First Shield Case Side Plate 12 Second Shield Case Side Plate 13 First Shield Case partition plate 14 Second shield case partition plate 15 First shield case middle plate 15A First middle plate slit 15B First middle plate slit 15a First middle plate projection row 15b First middle plate 16 Second shield case middle plate 16A Second middle plate slit 16B Second middle plate slit 16a Second middle plate protrusion row 16b Second middle plate protrusion row 17 Shield case top plate 18 Shield case bottom plate

Claims (1)

[Claims] 1. A printed circuit board on which a high frequency electronic circuit is mounted, a metallic shield side plate surrounding the printed circuit board, a metallic shield case partition plate penetrating the printed circuit board, and the partition plate penetrating. A high-frequency electronic device comprising a metal shield case middle plate having a plurality of protrusions arranged in a row near the slit, a metal top plate, and a bottom plate.