JPH0510391Y2 - - Google Patents
Info
- Publication number
- JPH0510391Y2 JPH0510391Y2 JP18425687U JP18425687U JPH0510391Y2 JP H0510391 Y2 JPH0510391 Y2 JP H0510391Y2 JP 18425687 U JP18425687 U JP 18425687U JP 18425687 U JP18425687 U JP 18425687U JP H0510391 Y2 JPH0510391 Y2 JP H0510391Y2
- Authority
- JP
- Japan
- Prior art keywords
- mic
- metallized layer
- board
- die
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 10
- 238000001465 metallisation Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 229910015320 MoMn Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Waveguides (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18425687U JPH0510391Y2 (ko) | 1987-12-01 | 1987-12-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18425687U JPH0510391Y2 (ko) | 1987-12-01 | 1987-12-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0187588U JPH0187588U (ko) | 1989-06-09 |
| JPH0510391Y2 true JPH0510391Y2 (ko) | 1993-03-15 |
Family
ID=31475629
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18425687U Expired - Lifetime JPH0510391Y2 (ko) | 1987-12-01 | 1987-12-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0510391Y2 (ko) |
-
1987
- 1987-12-01 JP JP18425687U patent/JPH0510391Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0187588U (ko) | 1989-06-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH11265765A (ja) | コネクタ実装基板およびその組立方法 | |
| JPH0510391Y2 (ko) | ||
| JPH02148878A (ja) | スルホール端子 | |
| JPH0349415Y2 (ko) | ||
| JPH05315721A (ja) | プリント配線板およびそのコネクタ | |
| JPS6314474Y2 (ko) | ||
| JPH02106087A (ja) | 混成集積回路装置 | |
| JPH01135663U (ko) | ||
| JPH0726862Y2 (ja) | 混成集積回路基板モジュール | |
| JPH0752790B2 (ja) | 親子基板の実装方法 | |
| JPH0448124Y2 (ko) | ||
| JPS6188471A (ja) | コネクタ− | |
| JP2594365B2 (ja) | 配線基板及び配線基板の接続方法 | |
| JPH032699U (ko) | ||
| JPH0325274U (ko) | ||
| JPS6038291Y2 (ja) | チツプ搭載用のプリント配線板 | |
| JPS62129778U (ko) | ||
| JPH051997B2 (ko) | ||
| JPH02137069U (ko) | ||
| JPS61102076U (ko) | ||
| JPH0440567U (ko) | ||
| JPH03102791A (ja) | プリント配線板の製造方法 | |
| JPS59101460U (ja) | 電子部品の接地構造 | |
| JPH01163343U (ko) | ||
| JPH0326058U (ko) |