JPH0510039A - Float-repairing construction - Google Patents

Abstract

PURPOSE:To improve workability and durability by driving an anchor pin having an outlet, into a hole bored through the float-repairing section of a tile or the like, and by injecting monoliquid type epoxy resin having specified viscosity and elongation. CONSTITUTION:Through a tile 3 having a float section 2, a hole coming to a sill 1 is bored, and an anchor pin 6 having a resin outlet 7 is driven into. After that, monoliquid type epoxy resin composition including epoxy resin, ketimin having functional group to be shown by an equation I, modified silicon resin, catalyst, and silane compound, with the viscosity at 20 deg.C of 50-20000 poise and with the elongation of 20-40% after hardened, is injected. As a result, workability and durability after repairing can be improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for repairing floating mortar, tiles and the like.

[0002]

2. Description of the Related Art Up to now, the repair of floating mortar, tiles and the like has been carried out by various construction methods. As a representative example of such a floating repair method, when there is a floating portion 2 between the base 1 and the tile 3 as shown in FIG. 1 (see FIG. 1- (1)), a recess is formed at the repaired portion. That is, after forming the hole 4 (see FIG. 1- (2)), the two-component epoxy resin composition 5 is injected into the hole 4 (see FIG. 1- (3)), and then fixed by the anchor pin 6 (see FIG. 1-). 1- (4)) method,
Alternatively, as shown in FIG. 2, after forming the hole 4 in the same manner as described above, the anchor pin 6 combined with the injection port is fixed to the hole 4 (see FIG. 2- (1)), and the two-component epoxy resin composition is used. The material 5 is injected through the anchor pin 6, and the two-pack type epoxy resin composition 5 is injected from the resin discharge port 7 into the floating portion 2 and the like (see FIG. 2- (2)).

[0003]

Conventionally, a room temperature curable two-component type epoxy resin composition has been used exclusively in the floating repair method. However, the floating repair method using the above room temperature curable two-component epoxy resin composition has the following problems. Since the two-pack type epoxy resin composition is used, the main agent and the curing agent must be weighed and mixed at the time of use, and the work is complicated. Since the pot life after mixing the main agent and the curing agent is short, there is a difficulty in workability. Since the cured product is hard and poor in flexibility (elongation is 10% or less), expansion and contraction due to temperature change of the material to be repaired and vibration due to impact cannot be absorbed, and cracks occur.

The present invention has been made in view of the above facts, and since it is a one-pack type, there is no need to measure and mix the resin composition at the time of construction, so workability is excellent, and no primer is used. A specific one-pack type epoxy resin composition having characteristics of being excellent in crack followability, water resistance, and adhesiveness because the cured product has appropriate hardness and flexibility, and an anchor pin. The purpose is to provide the floating repair method to be used.

[0005]

According to the present invention, a repaired part is
It contains an epoxy resin (a), a ketimine having a functional group represented by formula I (b), a modified silicone resin (c), a modified silicone resin catalyst (d) and a silane compound (e), and has a viscosity of 50 to 20000. Poise (20 ℃),
It provides a floating repair method characterized by repairing using a one-pack type epoxy resin composition having an elongation after curing of 20 to 400% and an anchor pin.

[Chemical 4] (In the formula I, R ¹ and R ² are each independently selected from a hydrogen atom, an alkyl group having 1 to 6 carbon atoms and a phenyl group.)

The present invention will be described in detail below. First, the components contained in the one-pack type epoxy resin composition used in the present invention will be described.

The epoxy resin (a) used in the present invention may be any epoxy resin having a liquid state at room temperature.

Examples of the epoxy resin (a) include bisphenol A, bisphenol F and bisphenol A.
Bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AD type epoxy resin and the like obtained by reacting D and the like with epichlorohydrin, and hydrogenated epoxy resin, glycidyl ester type epoxy resin, novolac type epoxy resin Examples thereof include, but are not limited to, resins, urethane-modified epoxy resins having a urethane bond, nitrogen-containing epoxy resins obtained by epoxidizing metaxylenediamine and hydantoin, and rubber-modified epoxy resins containing polybutadiene or NBR. .

The epoxy resin (a) may be used alone or in combination of two or more.

As a curing agent for the epoxy resin (a), a ketimine (b) having a functional group represented by the following formula I in its molecule is used.

[0011]

[Chemical 5] (In the formula I, R ¹ and R ² are a hydrogen atom or a carbon number of 1 to 6
Is an alkyl group or a phenyl group. )

The ketimine (b) is stable in the absence of water, but becomes a primary amine by the water and functions as a curing agent for the epoxy resin (a). That is, ketimine (b) is a latent curing agent. Then, by this, the storage stability of the room temperature curable one-pack type epoxy resin composition used in the present invention containing the components (a) to (e) is enhanced and the curability at the time of use becomes good.

Examples of such ketimine (b) include compounds represented by the following formula Ia or Ib.

[0014]

[Chemical 6] (In the formula Ia, R ¹ , R ² , R ³ and R ⁴ are each independently selected from a hydrogen atom, an alkyl group having 1 to 6 carbon atoms and a phenyl group, and X is an alkylene having 2 to 6 carbon atoms. Represents a group or a non-adjacent arylene group having 6 to 12 carbon atoms.)

[0015]

[Chemical 7] (In the formula Ib, R ¹ , R ² , R ³ , R ⁴ and R ⁵ are each independently selected from a hydrogen atom, an alkyl group having 1 to 6 carbon atoms and a phenyl group, and X is each independently
It is selected from an alkylene group having 2 to 6 carbon atoms and a non-adjacent arylene group having 6 to 12 carbon atoms. )

More specific examples of the compound corresponding to such ketimine (b) include 1,2-ethylenebis (isopentylideneimine), 1,2-hexylenebis (isopentylideneimine), 1, 2-propylenebis (isopentylideneimine), p, p'-biphenylenebis (isopentylideneimine), 1,2-ethylenebis (isopropylideneimine), 1,3-propylenebis (isopropylideneimine), p Examples thereof include phenylene bis (isopentylideneimine), (diethylenetriamine methyl isobutyl ketone polycondensation product) phenylglycidyl ether adduct, and the like.

The ketimine (b) may be used alone or in combination of two or more kinds.

The amount of ketimine (b) used depends on the period during which the one-pack type epoxy resin composition is stored, but in general,
The amount is 1 to 60 parts by weight, preferably 10 to 30 parts by weight, based on 100 parts by weight of the epoxy resin (a). If it is less than 1 part by weight, the curing rate will be slow, which is not preferable.
If the amount exceeds 0 parts by weight, the epoxy resin (a) is likely to be cured during storage and storage stability is deteriorated, which is not preferable.

Modified silicone resin (c) used in the present invention
The term, for example, refers to a silicone resin having a functional group such as an amino group, a phenyl group or an alkoxy group introduced therein.
It is preferable to use a silicone resin having a hydrolyzable silicon group represented by II at the end.

[0020]

[Chemical 8] (In the formula II, R ⁶ is a monovalent hydrocarbon group having 1 to 12 carbon atoms,
R ⁷ is a monovalent hydrocarbon group having 1 to 6 carbon atoms, and n is an integer of 0 to 2)

More specifically, silicone resins having a methyldimethoxysilyl group at the end are exemplified, and commercially available products such as poly (methyldimethoxysilylethyl ether) (MSP21S, manufactured by Kaneka Corporation) are used. it can.

These modified silicone resins (c) may be used alone or in combination of two or more.

Use of such a modified silicone resin (c) is important for imparting flexibility to a cured product of the one-pack type epoxy resin composition. The amount of the modified silicone resin (c) used is preferably 10 to 500 parts by weight, more preferably 50 to 50 parts by weight, based on 100 parts by weight of the epoxy resin (a).
200 parts by weight. If it is less than 10 parts by weight, the flexibility is insufficient, while if it exceeds 500 parts by weight, the adhesiveness is deteriorated, which is not preferable.

The modified silicone resin catalyst (d) is a catalyst that cures the modified silicone resin (c). That is, the modified silicone resin (c) is cured by the water in the air in the presence of the modified silicone resin catalyst (d).

More specifically, examples thereof include tin compounds such as dibutyltin oxide, metal salts of carboxylic acids such as lead octylate, amine salts such as cibutylamine-2-ethylhexoate, and even one kind. You may use 2 or more types together.

The amount of the modified silicone resin catalyst (d) used is generally 0.1 to 10 parts by weight based on 100 parts by weight of the modified silicone resin (c).

The silane compound (e) used in the present invention is
A so-called silane coupling agent represented by the following formula III, and a reaction product of the coupling agent and a polymer.

Formula III R ⁹ Si (OR ⁸ ) ₃ (In Formula III, R ⁸ is an alkyl group or an alkoxyalkyl group, and R ⁹ is an organic functional group having an amino group, a mercapto group, a vinyl group, an epoxy group or the like at the terminal. It is.)

As the silane compound (e), it is preferable to use an aminoalkyltrialkoxysilane, vinyltrialkoxysilane, epoxyalkyltrialkoxysilane, mercaptoalkyltrialkoxysilane or an alkoxysilane derivative which is a copolymer thereof. preferable.

More specifically, examples include aminopropyltrimethoxysilane, a reaction product of aminopropyltrimethoxysilane and vinyltrimethoxysilane, and a reaction product of γ-glycidoxypropyltrimethoxysilane and polysulfide. And commercially available products can be used.

The molecular weight of these silane compounds (e) is
It is preferably 2000 or less. Molecular weight is 2000
If it exceeds, the adhesiveness tends to be poor, which is not preferable.

The silane compound (e) may be used alone or in combination of two or more kinds.

These silane compounds (e) act as an adhesive agent and a dehydrating agent. And the usage is
The amount is preferably 0.1 to 50 parts by weight, more preferably 1 to 10 parts by weight, based on 100 parts by weight of the epoxy resin (a). If the amount is less than 0.1 parts by weight, the storage stability of the one-pack type epoxy resin composition and the adhesion of the cured product thereof are deteriorated, which is not preferable, while if it exceeds 50 parts by weight,
This is not preferable because the curability of the one-pack type epoxy resin composition deteriorates.

The one-pack type epoxy resin composition used in the present invention contains, as essential components, epoxy resin (a), ketimine (b), modified silicone resin (c), modified silicone resin catalyst (d) and silane compound. (E) is contained, but usually, in addition to this, a filler is also contained.

The filler functions as a viscosity adjusting agent for the one-pack type epoxy resin composition, and specific examples thereof include calcium carbonate, titanium oxide, silica, talc and clay.

The filler has various effects as a viscosity modifier (thickener) depending on its type or its physical properties (for example, particle size). Therefore, it is not possible to unambiguously determine the amount used.

The one-pack type epoxy resin composition used in the present invention further comprises, if necessary, an antiaging agent such as a hindered amine type or a hindered phenol type, a pigment such as carbon black, an ultraviolet absorber or a plasticizer. You may contain additives, such as. Further, a dehydrating agent such as ethyl orthoformate may be contained.

The one-pack type epoxy resin composition used in the present invention contains the components described above and has a viscosity (20
C.) is 50 to 20,000 poise. If it is out of this range, it is difficult to inject and fill the one-part epoxy resin composition into the repaired portion. That is, when the porosity is less than 50 poise, the epoxy resin composition does not stay at a predetermined position and flows after pouring, and when the porosity exceeds 20,000 poise, it is too hard to be injected.

The one-pack type epoxy resin composition used in the present invention has an elongation after curing of 20 to 400%. If the elongation after curing is less than 20%, the flexibility is insufficient and the crack followability is poor.
%, It is not preferable because the adhesiveness and water resistance are poor.

The one-pack type epoxy resin composition used in the present invention comprises epoxy resin (a), ketimine (b), modified silicone resin (c), modified silicone resin catalyst (d) and silane compound (e). It is manufactured by mixing additives such as a filler by a conventional method and stored in a sealed container.

Next, the anchor pin will be described. The anchor pin used in the present invention is not particularly limited in its shape, size and the like. Generally, mortar, tiles and the like which are used for repairing floating may be used.

Specific examples of the anchor pin 6 include those shown in FIG. In the figure, 7 is a resin discharge port, and 8 is a slidable head used to spread the tip of the anchor pin.

The material to be repaired by the method of the present invention is not particularly limited, but concrete, mortar,
Inorganic substances such as tiles and metals such as iron and stainless steel are particularly suitable.

The floating repair method of the present invention is characterized by repairing a floating portion such as mortar and tile using the above-mentioned one-pack type epoxy resin composition and anchor pins. As shown, when there is a floating portion 2 between the base 1 and the tile 3 (see FIG. 1- (1)), after forming a recess or hole 4 in the repaired portion (see FIG. 1- (2)),
The one-pack type epoxy resin composition 5 is injected into the hole 4 (see FIG. 1-
(3)), and then anchoring the anchor pin 6 to fix it (see FIG. 1- (4)), or similarly, after forming the hole 4 in the repaired part, the anchor pin 6 used in combination with the injection port in the hole 4 To fix (see FIG. 2- (1)), and inject the one-pack type epoxy resin composition 5 through the anchor pin 6, that is, from the head (injection port) of the anchor pin 6,
From the resin discharge port 7 of the anchor pin 6, float it 2
A method of ejecting the same to fill it (see FIG. 2- (2)) is preferable.

The injected one-pack type epoxy resin composition is
It cures in 1-2 days at room temperature due to the action of moisture in the air. Then, the material to be repaired and the anchor pin are firmly bonded.

[0046]

EXAMPLES The present invention will be specifically described below with reference to examples, but the present invention is not limited thereto.

(Example) (i) Manufacture of one-pack type epoxy resin composition Bisphenol A type epoxy resin (manufactured by Sumitomo Chemical Co., trade name ELA128) at a ratio shown in Table 1 and poly (methyldimethoxy) as a modified silicone resin. Silylethyl ether) (Kanefuchi Chemical Co., Ltd., trade name MSP21S),
Prepare calcium carbonate and titanium oxide, which are fillers, and use a high-viscosity mixing stirrer at room temperature and under reduced pressure (20To
It stirred under (rr or less). Next, vinyltrimethoxysilane, which is a silane compound (manufactured by Nippon Unicar, trade name A1
71) and aminopropyltrimethoxysilane (manufactured by Nippon Unicar Co., Ltd., trade name A1100) and stirred under reduced pressure, and then a dioctyl phthalate dioctyl phthalate solution (manufactured by Sankyoki Gosei Co., Ltd.) which is a catalyst for modified silicone resin. , Trade name No. 918) and ketimine (trade name H-3 manufactured by Yuka Shell Epoxy Co., Ltd.), which is a curing agent for epoxy resin, are added in the same manner and stirred under reduced pressure to give a one-pack type epoxy resin composition. Manufactured. These viscosities (20 ° C,
BH type viscometer) was as shown in Table 1.

(Ii) Evaluation The one-pack type epoxy resin composition obtained in (i) was evaluated as follows, and the results are shown in Table 2.

(1) Workability The one-pack type epoxy resin composition was put in a cartridge, mounted on an air gun, injected into the anchor pin from the tip of the cartridge equipped with a nozzle, and evaluated according to the following criteria. ○: Easy to inject ×: Difficult to inject (The composition overflows from the injection port of the anchor pin.)

(2) Storage stability The one-pack type epoxy resin composition is placed in a hermetically sealed container and heated to 50 ° C.
And stored after 5 days and opened, and the properties were evaluated according to the following criteria. ◯: The rate of change in viscosity is within 50% of the initial viscosity Δ: The rate of change in viscosity is 50% to 200% of the initial viscosity ×: The rate of change in viscosity is 200% or more of the initial viscosity

(3) Hardness A one-pack type epoxy resin composition having a thickness of 2 mm was applied to a polyethylene board and cured and cured (20 ° C., 60% RH, 1
4 days) according to JIS K6301
Shore D hardness was measured.

(4) The elongation one-pack type epoxy resin composition was applied to a polyethylene board with a thickness of 2 mm and cured and cured (20 ° C., 60% RH, 1
4 days), and according to JIS K 6301, JIS 3
It was punched out into a dumbbell shape and pulled at a speed of 200 mm / min, and the elongation at break was measured.

(5) The adhesive one-pack type epoxy resin composition was applied to a rectangular parallelepiped (50 mm × 5
0 mm x 25 mm) 50m of adherend (either mortar, tile, concrete, iron or stainless steel)
It was applied on a surface of m × 50 mm with a thickness of 1 mm, and cured and cured (20 ° C., 60% RH, 14 days) to obtain a test body. The cured product of the one-pack type epoxy resin composition on the test body was cut with a cutter and peeled by hand while cutting, and the adhesiveness was evaluated according to the following criteria. ○: Cohesive failure of the above cured product ×: Interfacial peeling

[0054]

[Table 1]

[0055]

[Table 2]

As is apparent from Tables 1 and 2, the one-pack type epoxy resin composition defined for use in the present invention is
Since it has an appropriate viscosity, it has excellent workability during use and excellent storage stability, and its cured product exhibits appropriate hardness and elongation, and has excellent adhesiveness. On the other hand, when the modified silicone resin is lacking (Comparative Example 1), the storage stability is poor and the cured product is hard and has poor elongation. Further, when the epoxy resin is absent (Comparative Example 2), the storage stability is excellent, but the cured product is too soft and the adhesion to mortar and concrete is poor. Furthermore, if the viscosity is high (Comparative Example 3), the injection cannot be performed well, and the workability is poor.

[0057]

In the present invention, since the specific one-pack type epoxy resin composition is used in the floating repair method, the following effects can be obtained. Since the epoxy resin composition is a one-component type, it is possible to omit weighing and mixing of the main agent and the curing agent at the time of use, and because the cured product has excellent adhesiveness, there is no need for primer treatment of the material to be repaired. Therefore, work efficiency is increased. Since the viscosity and the usable time of the one-pack type epoxy resin composition are appropriate, the workability is good. Since the cured product of the one-pack type epoxy resin composition has appropriate flexibility, it can absorb expansion and contraction due to temperature change of the material to be repaired and vibration due to impact, and has excellent crack followability. The cured product of the one-pack type epoxy resin composition has excellent adhesiveness and water resistance, and thus has excellent durability after repair.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view for explaining a floating repair method.

FIG. 2 is a schematic cross-sectional view for explaining a floating repair method.

FIG. 3 is a cross-sectional view showing an example of an anchor pin.

[Explanation of symbols]

1 foundation 2 floating part 3 tiles 4 holes 5 Epoxy resin composition 6 anchor pins 7 Resin discharge port 8 heads

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification number Office reference number FI technical display location C09J 163/00 JFN 8416-4J

Claims (4)

[Claims] 1. A repaired part is an epoxy resin (a), formula I
A ketimine (b) having a functional group represented by, a modified silicone resin (c), a modified silicone resin catalyst (d) and a silane compound (e), and having a viscosity of 50 to 2000.
It has 0 poise (20 ° C.) and the elongation after curing is 20 to 40.
A floating repair method characterized by repairing using a one-component epoxy resin composition of 0% and an anchor pin. [Chemical 1] (In the formula I, R ¹ and R ² are each independently selected from a hydrogen atom, an alkyl group having 1 to 6 carbon atoms and a phenyl group.) 2. An epoxy resin (a), a ketimine having a functional group represented by the formula I (b), a modified silicone resin (c), a modified silicone resin catalyst (d) and a silane after forming a recess at a repaired portion. A one-pack type epoxy resin composition containing the compound (e), having a viscosity of 50 to 20000 poise (20 ° C.) and an elongation after curing of 20 to 400% is injected, and then an anchor pin is driven. The floating repair method described in 1. [Chemical 2] (In the formula I, R ¹ and R ² are each independently selected from a hydrogen atom, an alkyl group having 1 to 6 carbon atoms and a phenyl group.) 3. After forming a recess at the repaired portion, an anchor pin that is used in combination with an injection port is driven in, and then an epoxy resin (a), a ketimine (b) having a functional group represented by formula I, and a modified silicone resin (c). ), A modified silicone resin catalyst (d) and a silane compound (e), the viscosity is 50 to 20000 poise (20 ° C.), and the elongation after curing is 20 to 400%. The floating repair method according to claim 1, wherein the object is injected through the anchor pin. [Chemical 3] (In the formula I, R ¹ and R ² are each independently selected from a hydrogen atom, an alkyl group having 1 to 6 carbon atoms and a phenyl group.) 4. The epoxy resin composition according to claim 1, which contains 50 to 200 parts by weight of the modified silicone resin (c) with respect to 100 parts by weight of the epoxy resin (a). Floating repair construction method.