JPH0499540U - - Google Patents

Info

Publication number
JPH0499540U
JPH0499540U JP228391U JP228391U JPH0499540U JP H0499540 U JPH0499540 U JP H0499540U JP 228391 U JP228391 U JP 228391U JP 228391 U JP228391 U JP 228391U JP H0499540 U JPH0499540 U JP H0499540U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP228391U
Other languages
Japanese (ja)
Other versions
JP2515342Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1991002283U priority Critical patent/JP2515342Y2/en
Publication of JPH0499540U publication Critical patent/JPH0499540U/ja
Application granted granted Critical
Publication of JP2515342Y2 publication Critical patent/JP2515342Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Landscapes

  • Wire Bonding (AREA)
JP1991002283U 1991-01-28 1991-01-28 Spool for bonding wire Expired - Lifetime JP2515342Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1991002283U JP2515342Y2 (en) 1991-01-28 1991-01-28 Spool for bonding wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1991002283U JP2515342Y2 (en) 1991-01-28 1991-01-28 Spool for bonding wire

Publications (2)

Publication Number Publication Date
JPH0499540U true JPH0499540U (en) 1992-08-27
JP2515342Y2 JP2515342Y2 (en) 1996-10-30

Family

ID=31730290

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1991002283U Expired - Lifetime JP2515342Y2 (en) 1991-01-28 1991-01-28 Spool for bonding wire

Country Status (1)

Country Link
JP (1) JP2515342Y2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5943537A (en) * 1982-09-02 1984-03-10 Mitsubishi Electric Corp Wire bonding device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5943537A (en) * 1982-09-02 1984-03-10 Mitsubishi Electric Corp Wire bonding device

Also Published As

Publication number Publication date
JP2515342Y2 (en) 1996-10-30

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