JPH0498816A - Wafer stepper with wafer rear inspection mechanism - Google Patents
Wafer stepper with wafer rear inspection mechanismInfo
- Publication number
- JPH0498816A JPH0498816A JP2216091A JP21609190A JPH0498816A JP H0498816 A JPH0498816 A JP H0498816A JP 2216091 A JP2216091 A JP 2216091A JP 21609190 A JP21609190 A JP 21609190A JP H0498816 A JPH0498816 A JP H0498816A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- foreign substance
- laser beam
- adhered
- stage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007689 inspection Methods 0.000 title claims abstract description 9
- 238000000034 method Methods 0.000 claims abstract 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 230000001678 irradiating effect Effects 0.000 claims 1
- 239000000126 substance Substances 0.000 abstract 8
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 36
- 238000010586 diagram Methods 0.000 description 6
- 238000003384 imaging method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体製造工程に使用するウェーハステッパー
に関し、特に露光前にウェーハ裏面の異物付着検査を行
なう機構を備えたウェーハステッパーに間する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a wafer stepper used in a semiconductor manufacturing process, and particularly to a wafer stepper equipped with a mechanism for inspecting the backside of a wafer for foreign matter before exposure.
従来のウェーハステッパーは、第５図のフロー図に示す
ように、ウェーハカセット１内のウェーハー２を、プリ
アライメント機構部３で位置合せし、ステージ５へ搬送
し露光を行なっている。In the conventional wafer stepper, as shown in the flowchart of FIG. 5, a wafer 2 in a wafer cassette 1 is aligned by a pre-alignment mechanism 3, and is transported to a stage 5 for exposure.
この従来のウェーハステッパーでは、ウェーハの裏面状
態がわからないままステージ上にウェーハをのせていた
。そのため、第６図の断面図の様にウェーハ裏面に異物
１０が付着していると、ウェーハ６が真空吸着によりス
テージ５に固定された際に、局部的に隆起する。その部
分は他の面より高くなるため、ステッパーの投影レンズ
の焦点深度からはずれて、パターンの結像不良を起こす
一因となっていた。With this conventional wafer stepper, the wafer was placed on the stage without knowing the condition of the backside of the wafer. Therefore, if foreign matter 10 is attached to the back surface of the wafer as shown in the cross-sectional view of FIG. 6, it will locally bulge when the wafer 6 is fixed to the stage 5 by vacuum suction. Since that portion is higher than other surfaces, it deviates from the depth of focus of the projection lens of the stepper, causing poor pattern imaging.
本発明のウェーハステッパーは、露光前ウェーハをステ
ージ上にのせる直前に、ウェーハ裏面に異物が付着して
いるかどうかを検査する機構と、その結果で異物付着が
あるウェーハを除くための機構とを有している。The wafer stepper of the present invention includes a mechanism for inspecting whether or not foreign matter is attached to the back surface of the wafer immediately before placing the unexposed wafer on the stage, and a mechanism for removing wafers with foreign matter attached as a result of the inspection. have.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の実施例１を示すフロー図である。カセ
ット１より出たウェーハ２は、プリアライメント機構部
３にて位置合せを行った後、裏面検査部４で異物の付着
を調べ、付着のないウェーハはステージ５へ搬送し露光
を行う。異物付着のあるウェーハ６はリジェクトカセッ
ト７へ搬送し、露光は行わない。FIG. 1 is a flow diagram showing a first embodiment of the present invention. The wafer 2 taken out of the cassette 1 is aligned in a pre-alignment mechanism section 3, and then inspected for adhesion of foreign matter in a back surface inspection section 4, and wafers with no adhesion are transferred to a stage 5 and exposed. Wafers 6 with foreign matter attached are transferred to a reject cassette 7 and are not exposed.
第２図及び第３図は実施例１の裏面検査部４の原理図で
ある０周辺をホルダー８によって保持されたウェーハ２
の裏面へ向けて、下方からレーザー光９をウェーハを横
切る様に走査させる。又、その走査方向と垂直にウェー
ハ２を動かし、ウェーハ全面をレーザ光９で照射する。2 and 3 are principle diagrams of the backside inspection section 4 of Embodiment 1. The wafer 2 is held around 0 by the holder 8.
A laser beam 9 is scanned across the wafer from below toward the back surface of the wafer. Further, the wafer 2 is moved perpendicular to the scanning direction, and the entire surface of the wafer is irradiated with the laser beam 9.
この際、第３図の様にウェーハ裏面に異物１０があると
、レーザー光９は散乱光１１となって受光素子１２で検
出され、異物の存在が確認される。At this time, if there is a foreign object 10 on the back surface of the wafer as shown in FIG. 3, the laser beam 9 becomes scattered light 11 and is detected by the light receiving element 12, thereby confirming the presence of the foreign object.
第４図は実施例２の裏面検査部４の原理図である。周辺
をホルダー８により保持されたウェーハ６の裏面に対し
、ある角度を持ったＡ光源１３より均一な光を照射する
。この時のウェーハ裏面をカメラ１４により画像データ
として画像処理機構６に取り込む０次にカメラ１４を中
心にして１８０°または任意の角度回転した位置におい
たＢ光源１５からも同様に光を照射して、その時のウェ
ーハ裏面状態も画像データとして取り込む。FIG. 4 is a principle diagram of the back surface inspection section 4 of the second embodiment. The back surface of the wafer 6 whose periphery is held by a holder 8 is irradiated with uniform light from a light source 13 having a certain angle. The back side of the wafer at this time is taken into the image processing mechanism 6 as image data by the camera 14. Light is similarly irradiated from the B light source 15 placed at a position rotated by 180 degrees or any angle around the camera 14. , the state of the back surface of the wafer at that time is also captured as image data.
このとき、ウェーハ裏面に異物がなければ取り込んだ画
像は同じになるが、異物１０があるとＡ光源１３とＢ光
源１５では互いに照射方向の反対側に異物１０の影がで
きる。そのため取り込んだ２つの画像データは、異物の
ある箇所で異なる事になり、異物の存在が確認できる。At this time, if there is no foreign object on the back side of the wafer, the captured images will be the same, but if the foreign object 10 is present, the A light source 13 and the B light source 15 will cast shadows of the foreign object 10 on opposite sides of the irradiation direction. Therefore, the two captured image data differ at the location where the foreign object is present, and the presence of the foreign object can be confirmed.
本実施例は実施例１に対し、画像データの取り込み時間
が短かい為、処理時間が短縮できる利点がある。Compared to the first embodiment, this embodiment has the advantage that the processing time can be shortened because the time required to capture image data is shorter.
以上説明したように本発明は、露光前ウェーハをステー
ジ上にのせる直前に裏面に異物が付着しているかどうか
を検査し、その結果異物の付着のあるウェーハはステー
ジ上に搬送させないため、ウェーハ裏面の異物が起こす
パターン結像不良の発生を未然に防ぐという効果を有す
る。As explained above, the present invention inspects whether or not foreign matter is attached to the back surface of the unexposed wafer immediately before placing it on the stage, and as a result, wafers with foreign matter attached are not transferred onto the stage. This has the effect of preventing pattern imaging defects caused by foreign matter on the back surface.
第１図は本発明の実施例１のフロー図、第２図及び第３
図は実施例１の裏面検査部の原理図、第４図は実施例２
の裏面検査部の原理図、第５図は従来のウェーハステッ
パーのウェーハフロー図、第６図は従来の異物付着状態
を示す断面図である。
１・・・カセット、２・・・ウェーハ、３・・・プリア
ライメント機構部、４・・・裏面検査部、５・・・ウェ
ーハステージ、６・・・異物のあるウェーハ、７・・・
リジェクトカセット、８・・・ホルダー、９・・・レー
ザー光、１０・・・異物、１１・・・散乱光、１２・・
・受光素子、１３・・・Ａ光源、１４・・・カメラ、１
５・・・Ｂ光源、１６・・・画像処理機構。FIG. 1 is a flow diagram of Embodiment 1 of the present invention, FIG.
The figure is a principle diagram of the backside inspection section of Embodiment 1, and Figure 4 is Embodiment 2.
FIG. 5 is a wafer flow diagram of a conventional wafer stepper, and FIG. 6 is a cross-sectional view showing the state of foreign matter adhesion in a conventional wafer stepper. DESCRIPTION OF SYMBOLS 1... Cassette, 2... Wafer, 3... Pre-alignment mechanism part, 4... Back surface inspection part, 5... Wafer stage, 6... Wafer with foreign matter, 7...
Reject cassette, 8...Holder, 9...Laser light, 10...Foreign object, 11...Scattered light, 12...
・Light receiving element, 13...A light source, 14...Camera, 1
5... B light source, 16... Image processing mechanism.
Claims (1)
て、露光用のステージにウェーハを搬送する前工程に、
ウェーハ裏面を照射するための光源及びその反射光を検
知する手段と、異物付着が検知されたウェーハを除去す
る手段とを備えたことを特徴とするウェーハ裏面検査機
構付ウェーハステッパー。In the wafer stepper used in the semiconductor manufacturing process, in the pre-process of transporting the wafer to the exposure stage,
A wafer stepper with a wafer backside inspection mechanism, comprising: a light source for irradiating the backside of a wafer; a means for detecting the reflected light; and a means for removing a wafer on which foreign matter has been detected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2216091A JPH0498816A (en) | 1990-08-16 | 1990-08-16 | Wafer stepper with wafer rear inspection mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2216091A JPH0498816A (en) | 1990-08-16 | 1990-08-16 | Wafer stepper with wafer rear inspection mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0498816A true JPH0498816A (en) | 1992-03-31 |
Family
ID=16683109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2216091A Pending JPH0498816A (en) | 1990-08-16 | 1990-08-16 | Wafer stepper with wafer rear inspection mechanism |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0498816A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010063162A (en) * | 1999-12-22 | 2001-07-09 | 황인길 | Apparatus for displaying contamination state of wafer |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02184017A (en) * | 1989-01-11 | 1990-07-18 | Mitsubishi Electric Corp | Projection exposer |
| JPH03116715A (en) * | 1989-09-28 | 1991-05-17 | Fujitsu Ltd | Manufacture of semiconductor device |
-
1990
- 1990-08-16 JP JP2216091A patent/JPH0498816A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02184017A (en) * | 1989-01-11 | 1990-07-18 | Mitsubishi Electric Corp | Projection exposer |
| JPH03116715A (en) * | 1989-09-28 | 1991-05-17 | Fujitsu Ltd | Manufacture of semiconductor device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010063162A (en) * | 1999-12-22 | 2001-07-09 | 황인길 | Apparatus for displaying contamination state of wafer |
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