JPH0497560A - Electronic circuit module structure - Google Patents

Abstract

PURPOSE:To prevent various kinds of defects caused bar current capacity and voltage drop by providing more path whereby a contact socket with a built-in power supply bus supplies power in contact with a contact pin of an electronic circuit assembly. CONSTITUTION:In addition to a path which supplies a power supply through a pin 55 of an electronic circuit module 10, a power supply bus 30 is provided which forms the electronic circuit module 10 to supply power to a contact socket 32 through a projecting part, of a bus plate 31. Then, power is supplied to an LSI 43 through a cap 41 of a contact pin 45 of the electronic circuit assembly 40 which is in contact with the contact socket 32 passing through a substrate 42 and an LSI lead 44; thereby, it is possible to eliminate defects caused by too small current capacity and voltage drop.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electronic circuit module equipped with a plurality of LSIs, and particularly to an electronic circuit module structure capable of supplying a large current.

[Conventional technology]

Conventionally, this type of electronic circuit module has a structure in which an electronic circuit module 100 is mounted on a connector 2 on a printed circuit board 1, as shown in FIG. The power supply is transmitted from the contact 3 to the vial 55 from the power supply pattern 4 provided on the printed circuit board 1, via the ceramic substrate 54 and the solder 57.

[Problem to be solved by the invention]

In the conventional electronic circuit module structure described above, the power supply is provided from the electronic circuit module bin connected to the printed circuit board. In recent years, as LSIs installed in electronic circuit modules have become more highly integrated, there has been a trend toward increased power consumption. Therefore, the conventional power supply structure from the bottle of electronic circuit modules as described above has a disadvantage in terms of current capacity and voltage drop. There are drawbacks shown below.

(1) It is necessary to increase the number of power supply patterns on the printed circuit board, and the aspect ratio (plate thickness/through hole diameter) increases, making it difficult to manufacture the printed circuit board.

(2) It is necessary to increase the number of bins of the electronic circuit module, but increasing the number of bins per unit area has the disadvantage that the diameter of the bin becomes smaller, which is disadvantageous in terms of current capacity.

(3) The current passing bus is a printed circuit board or connector.

The shortcoming is that the route between the pin and the solder on the ceramic substrate 2 is long, resulting in a large voltage drop.

[Means for Solving the Problems] The electronic circuit module structure of the present invention includes a ceramic substrate having a plurality of pins, a plurality of conductive caps that are recessed and mounted on the ceramic substrate, and a top surface of the cap. A plurality of electronic circuit assemblies each comprising a conductive contact pin provided at a corner portion and electrically fixed to the cap, and a substrate electrically fixed to the cap and having an LSI mounted therein; A bus plate having square holes formed in a lattice shape and into which the electronic circuit assembly is inserted and mounted, and a plurality of contact sockets press-fitted and held at each lattice point portion of the bus plate. and a power supply bus configured with an end portion of the bus plate protruding outside, and when the electronic circuit assembly is inserted and mounted in the square hole of the bus plate, the contact pin and Electrical contact is made with the contact socket, and power is supplied to the electronic circuit assembly not only from the via of the ceramic substrate but also from an end of the bus plate protruding to the outside of the power supply bus. It is configured as follows.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a cross-sectional view showing an unmounted state of a connector according to an embodiment of the present invention, FIG. 2 is a cross-sectional view showing an enlarged main part of this embodiment, and FIG. It is a sectional view taken along the A line.

In FIG. 1, the electronic circuit module 10 of this embodiment has a connector 2 in which a plurality of contacts 3 are embedded on a printed circuit board 1 having a power supply pattern 4.
A plurality of electronic circuit assemblies 40 are fixed with solder 57 to the upper surface of a ceramic substrate 54 having a plurality of pins 55 that fit into the contacts 3 described above, and a flange 53 is fixed around the ceramic substrate 54. The cooling component 20 is mounted on the upper surface of the electronic circuit assembly 40 with thermally conductive grease 56 interposed therebetween. The cooling component 20 is a cold plate 21
It has a structure that has a water channel 24, a water supply port 22, and a drain port 23 on the inner surface. Cooling components 20 between electronic circuit assemblies 40
A power supply bus 30 is mounted below.

Further, as shown in FIGS. 2 and 3, a power supply bus 30
are a conductive bus plate 31 and a contact socket 32
It is composed of The bus plate 31 has a lattice shape with square holes that escape the B protrusion of the cooling component 20 relative to the electronic circuit assembly 40. The lattice point portion has a hole into which a contact socket 32 is press-fitted, and is electrically and mechanically connected to the bus plate 31 by press-fitting the contact socket 32 therein.

In the electronic circuit assembly 40, a concave conductive cap 41 is electrically fixed to a substrate 42, and an LSI 43 is thermally conductive and fixed to the bottom of the cap 41.
SI lead 44 is electrically connected to substrate 42 .

Contact pins 4 are provided at each corner of the top surface of the cap 41.
5 is electrically fixed, and the above-mentioned contact socket 32 is electrically connected to the contact pin 45.

As shown in FIG. 1, the end of the pass plate 31 constituting the power supply path 30 is sandwiched between the flange 53 and the cooling component 20 via insulators 51 and 52, and protrudes outward from the electronic circuit module 10. There is.

Next, the power supply bus of this embodiment having such a configuration will be shown. There are two types of power supply buses:

(1) A path supplied from the pin 55 of the electronic circuit module 10 as in the prior art; (2) A path supplied from the protrusion of the bus plate 31 of the power supply bus 30 constituting the electronic circuit module 10. In the path, power is supplied from the protrusion of the bus plate 31, from the bus plate 31 to the contact socket 32, then to the contact pin 45 of the electronic circuit assembly 40 that is in contact with the contact socket 32, and then From the cap 41 to the board 42 and LSI lead 4
It is supplied to LSI4B via 4. Normally, the path (1) is supplied with power from the ground side due to the electrical characteristics of the signal pattern on the printed circuit board 1, and the path (2) is supplied with power from the voltage side.

Although this embodiment shows an example using a connector, there is no connector and the bin 5 of the electronic circuit module 10
5 may be directly fixed to the printed circuit board 1.

〔Effect of the invention〕

As explained above, the present invention incorporates a power supply bus having a contact socket in an electronic circuit module, and the path for supplying power by contacting the contact socket with the contact pin provided on the top surface of the cap of the electronic circuit assembly is different from the conventional one. By providing a power supply path other than the power supply path from the bottle of the electronic circuit module described in the technology, it is effective in solving various drawbacks caused by the current capacity and voltage drop described in the prior art.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view showing an unmounted state of a connector according to an embodiment of the present invention, FIG. 2 is a cross-sectional view showing an enlarged main part of this embodiment, and FIG. Sectional view along line A, 4th
The figure is a sectional view showing a conventional electronic circuit module structure in a state where the connector is not mounted. 1... Printed circuit board, 2... Connector, 3... Contact, 4... Power supply pattern, 10.100...
Electronic circuit module, 20,110... Cooling component, 2
1゜111...cold plate, 22,122...
・Water supply port, 23.113... Drain port, 24,114・
... Waterway, 30... Power supply bus, 31... Bus plate, 32... Contact socket, 40.64.
...Electronic circuit assembly, 41...Cap, 42...Substrate, 43...LSI, 44.・・LSI lead, 45・
... Contact pin, 51.52 ... Insulator, 53.
...Flange, 54...Ceramic substrate, 55...
Pin, 56...grease, 57...solder.

Claims (1)

[Claims] A ceramic substrate having a plurality of pins, a plurality of conductive caps having a concave shape and mounted on the ceramic substrate, and a conductive contact pin provided at a corner of the upper surface of the cap and electrically fixed to the cap. and a plurality of electronic circuit assemblies each comprising a substrate electrically fixed to the cap and having an LSI mounted therein; A power supply comprising a bus plate into which a circuit assembly is inserted and mounted, and a plurality of contact sockets press-fitted into each lattice point portion of the bus plate, the ends of the bus plate protruding to the outside. when the electronic circuit assembly is fitted and mounted in the square hole of the bus plate, the contact pin and the contact socket make electrical contact, and An electronic circuit module structure characterized in that power is supplied not only from the pins of the ceramic substrate but also from an end of the bus plate protruding to the outside of the power supply bus.