JPH0497366U - - Google Patents
Info
- Publication number
- JPH0497366U JPH0497366U JP506291U JP506291U JPH0497366U JP H0497366 U JPH0497366 U JP H0497366U JP 506291 U JP506291 U JP 506291U JP 506291 U JP506291 U JP 506291U JP H0497366 U JPH0497366 U JP H0497366U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP506291U JPH0497366U (en) | 1991-01-17 | 1991-01-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP506291U JPH0497366U (en) | 1991-01-17 | 1991-01-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0497366U true JPH0497366U (en) | 1992-08-24 |
Family
ID=31735326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP506291U Pending JPH0497366U (en) | 1991-01-17 | 1991-01-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0497366U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001308388A (en) * | 2000-04-27 | 2001-11-02 | Rohm Co Ltd | Chip light-emitting element |
| JP2001352102A (en) * | 2000-06-07 | 2001-12-21 | Matsushita Electric Ind Co Ltd | Optical semiconductor device |
| JP2010187031A (en) * | 2010-05-31 | 2010-08-26 | Rohm Co Ltd | Chip type light emitting element |
| JP2014146846A (en) * | 2014-05-20 | 2014-08-14 | Rohm Co Ltd | Chip type light emitting element |
| JP2017033998A (en) * | 2015-07-29 | 2017-02-09 | ローム株式会社 | Semiconductor device and manufacturing method of the same |
| JP2017201729A (en) * | 2006-05-11 | 2017-11-09 | エルジー イノテック カンパニー リミテッド | Side-emitting type light-emitting device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01283883A (en) * | 1988-05-10 | 1989-11-15 | Matsushita Electric Ind Co Ltd | Light emitting diode and forming method for its electrode |
-
1991
- 1991-01-17 JP JP506291U patent/JPH0497366U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01283883A (en) * | 1988-05-10 | 1989-11-15 | Matsushita Electric Ind Co Ltd | Light emitting diode and forming method for its electrode |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001308388A (en) * | 2000-04-27 | 2001-11-02 | Rohm Co Ltd | Chip light-emitting element |
| JP2001352102A (en) * | 2000-06-07 | 2001-12-21 | Matsushita Electric Ind Co Ltd | Optical semiconductor device |
| JP2017201729A (en) * | 2006-05-11 | 2017-11-09 | エルジー イノテック カンパニー リミテッド | Side-emitting type light-emitting device |
| US10243112B2 (en) | 2006-05-11 | 2019-03-26 | Lg Innotek Co., Ltd. | Light emitting device and method for fabricating the same |
| US10580943B2 (en) | 2006-05-11 | 2020-03-03 | Lg Innotek Co., Ltd. | Light emitting device and method for fabricating the same |
| JP2010187031A (en) * | 2010-05-31 | 2010-08-26 | Rohm Co Ltd | Chip type light emitting element |
| JP2014146846A (en) * | 2014-05-20 | 2014-08-14 | Rohm Co Ltd | Chip type light emitting element |
| JP2017033998A (en) * | 2015-07-29 | 2017-02-09 | ローム株式会社 | Semiconductor device and manufacturing method of the same |