JPH0496857U - - Google Patents

Info

Publication number
JPH0496857U
JPH0496857U JP1991055438U JP5543891U JPH0496857U JP H0496857 U JPH0496857 U JP H0496857U JP 1991055438 U JP1991055438 U JP 1991055438U JP 5543891 U JP5543891 U JP 5543891U JP H0496857 U JPH0496857 U JP H0496857U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1991055438U
Other languages
Japanese (ja)
Other versions
JP2502547Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPH0496857U publication Critical patent/JPH0496857U/ja
Application granted granted Critical
Publication of JP2502547Y2 publication Critical patent/JP2502547Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S165/00—Heat exchange
    • Y10S165/044—Heat exchange having flexible heat exchange surface conforming to a solid structure, e.g. applicator
    • Y10S165/047—Heat exchange having flexible heat exchange surface conforming to a solid structure, e.g. applicator for cooling
    • Y10S165/048—Electrical component

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP1991055438U 1990-07-20 1991-07-17 熱移動装置 Expired - Lifetime JP2502547Y2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/556,949 US5000256A (en) 1990-07-20 1990-07-20 Heat transfer bag with thermal via
US556949 1990-07-20

Publications (2)

Publication Number Publication Date
JPH0496857U true JPH0496857U (ko) 1992-08-21
JP2502547Y2 JP2502547Y2 (ja) 1996-06-26

Family

ID=24223475

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1991055438U Expired - Lifetime JP2502547Y2 (ja) 1990-07-20 1991-07-17 熱移動装置

Country Status (3)

Country Link
US (1) US5000256A (ko)
JP (1) JP2502547Y2 (ko)
DE (1) DE9108728U1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011530190A (ja) * 2008-08-04 2011-12-15 クラスタード システムズ カンパニー 接点を冷却した電子機器匡体

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* Cited by examiner, † Cited by third party
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JPH04206555A (ja) * 1990-11-30 1992-07-28 Hitachi Ltd 電子機器の冷却装置
IL100806A (en) * 1991-02-01 1997-02-18 Commw Scient Ind Res Org Heat transfer device
SE9100596D0 (sv) * 1991-03-01 1991-03-01 Carlstedt Elektronik Ab Magasin foer stora vlsi-kapslar
US5205348A (en) * 1991-05-31 1993-04-27 Minnesota Mining And Manufacturing Company Semi-rigid heat transfer devices
US5187645A (en) * 1991-06-07 1993-02-16 Ergo Computing, Inc. Portable computer with docking connector for peripheral devices
US5130889A (en) * 1991-06-28 1992-07-14 Digital Equipment Corporation Integrated circuit protection by liquid encapsulation
JPH0590461A (ja) * 1991-09-25 1993-04-09 Hitachi Ltd 電子装置
DE4217596C2 (de) * 1992-05-27 1994-06-16 Siemens Nixdorf Inf Syst Einbausystem für auf Leiterplatten montierte hochintegrierte Bausteine
DE4217597C2 (de) * 1992-05-27 1994-09-08 Siemens Nixdorf Inf Syst Einbausystem für auf Leiterplatten montierte hochintegrierte gehäuselose Bausteine
DE4217598A1 (de) * 1992-05-27 1993-12-02 Siemens Nixdorf Inf Syst Einbausystem für auf Leiterplatten montierte hochintegrierte, gehäuselose Bausteine
US5323292A (en) * 1992-10-06 1994-06-21 Hewlett-Packard Company Integrated multi-chip module having a conformal chip/heat exchanger interface
DE4326207A1 (de) * 1992-10-06 1994-04-07 Hewlett Packard Co Mechanisch schwimmendes Mehr-Chip-Substrat
DE4312057A1 (de) * 1993-04-13 1993-10-14 Siegmund Maettig Vorrichtung zum Kühlen hochintegrierter Multi-Chip-Moduls für Datenverarbeitungsanlagen mit hoher Rechnerleistung
US5423498A (en) * 1993-04-27 1995-06-13 E-Systems, Inc. Modular liquid skin heat exchanger
US5704416A (en) * 1993-09-10 1998-01-06 Aavid Laboratories, Inc. Two phase component cooler
US5458189A (en) * 1993-09-10 1995-10-17 Aavid Laboratories Two-phase component cooler
US5485671A (en) * 1993-09-10 1996-01-23 Aavid Laboratories, Inc. Method of making a two-phase thermal bag component cooler
JP3385482B2 (ja) * 1993-11-15 2003-03-10 株式会社日立製作所 電子機器
US5403973A (en) * 1994-01-18 1995-04-04 Santilli; Michael A. Custom conformal heat sinking device for electronic circuit cards and methods of making the same
DE4404035A1 (de) * 1994-02-09 1995-08-10 Sel Alcatel Ag Wärmeleitvorrichtung für elektrische Bauelemente
US5472043A (en) * 1994-03-22 1995-12-05 Aavid Laboratories, Inc. Two-phase component cooler with radioactive initiator
US5383340A (en) * 1994-03-24 1995-01-24 Aavid Laboratories, Inc. Two-phase cooling system for laptop computers
US5411077A (en) * 1994-04-11 1995-05-02 Minnesota Mining And Manufacturing Company Flexible thermal transfer apparatus for cooling electronic components
US5390077A (en) * 1994-07-14 1995-02-14 At&T Global Information Solutions Company Integrated circuit cooling device having internal baffle
US5529115A (en) * 1994-07-14 1996-06-25 At&T Global Information Solutions Company Integrated circuit cooling device having internal cooling conduit
US5560423A (en) * 1994-07-28 1996-10-01 Aavid Laboratories, Inc. Flexible heat pipe for integrated circuit cooling apparatus
US5502582A (en) * 1994-09-02 1996-03-26 Aavid Laboratories, Inc. Light source cooler for LCD monitor
WO1996037366A1 (en) * 1995-05-22 1996-11-28 Aavid Laboratories, Inc. Enclosure material for two-phase component cooler
US5587880A (en) * 1995-06-28 1996-12-24 Aavid Laboratories, Inc. Computer cooling system operable under the force of gravity in first orientation and against the force of gravity in second orientation
AT404532B (de) * 1996-02-13 1998-12-28 Electrovac Kühlkörper für elektrische und elektronische bauelemente
US5642776A (en) * 1996-02-27 1997-07-01 Thermacore, Inc. Electrically insulated envelope heat pipe
FR2745631B1 (fr) * 1996-03-01 1998-05-07 Mcb Ind Composant thermo-emissif a transmission thermique amelioree, et son procede de realisation
NZ286458A (en) * 1996-04-26 1999-01-28 Fisher & Paykel Evaporation tray to catch defrost water from refrigerator, bottom consists of flexible membrane
SE9604705L (sv) * 1996-12-20 1998-06-21 Ericsson Telefon Ab L M Förfarande och medel för att arrangera värmeöverföring
DE19714835A1 (de) * 1997-04-10 1998-10-15 Georg Schlomka Gehäuse für hochfrequent lärm- und wärmeemittierende Baugruppen
US5923086A (en) * 1997-05-14 1999-07-13 Intel Corporation Apparatus for cooling a semiconductor die
SG64996A1 (en) 1997-07-08 1999-05-25 Dso National Laborataries A heat sink
DE19732738A1 (de) * 1997-07-30 1999-02-04 Asea Brown Boveri Leistungshalbleiterbauelemente mit druckausgleichender Kontaktplatte
DE69825153D1 (de) * 1997-10-14 2004-08-26 Matsushita Electric Ind Co Ltd Wärmeleitende einheit und wärmeverbindungsstruktur welche diese einheit verwendet
US5966288A (en) * 1998-05-22 1999-10-12 Northern Telecom Limited Assemblies of electronic devices and flexible containers thereof
DE29817185U1 (de) 1998-09-24 1998-11-26 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH, 81543 München Wärmeleitende Einlegematte für elektrische und elektronische Geräte
US6085831A (en) * 1999-03-03 2000-07-11 International Business Machines Corporation Direct chip-cooling through liquid vaporization heat exchange
US6896039B2 (en) * 1999-05-12 2005-05-24 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US6302192B1 (en) * 1999-05-12 2001-10-16 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
DE10033848A1 (de) * 2000-07-12 2002-01-24 Plg Elektronik Ingenieur Und D Elektrisches Gerät
US6972958B2 (en) * 2003-03-10 2005-12-06 Hewlett-Packard Development Company, L.P. Multiple integrated circuit package module
US7063127B2 (en) * 2003-09-18 2006-06-20 International Business Machines Corporation Method and apparatus for chip-cooling
TWI235817B (en) * 2004-03-26 2005-07-11 Delta Electronics Inc Heat-dissipating module
US7133286B2 (en) * 2004-05-10 2006-11-07 International Business Machines Corporation Method and apparatus for sealing a liquid cooled electronic device
US7581585B2 (en) * 2004-10-29 2009-09-01 3M Innovative Properties Company Variable position cooling apparatus
US20060090881A1 (en) * 2004-10-29 2006-05-04 3M Innovative Properties Company Immersion cooling apparatus
US20060196640A1 (en) * 2004-12-01 2006-09-07 Convergence Technologies Limited Vapor chamber with boiling-enhanced multi-wick structure
JP2006261457A (ja) * 2005-03-17 2006-09-28 Fujitsu Ltd 受熱体、受熱装置及び電子機器
US20070034360A1 (en) * 2005-06-08 2007-02-15 Hall Jack P High performance cooling assembly for electronics
US8561673B2 (en) * 2006-09-26 2013-10-22 Olantra Fund X L.L.C. Sealed self-contained fluidic cooling device
US7428152B1 (en) 2006-10-27 2008-09-23 Isothermal Systems Research, Inc. Localized thermal management system
KR101420802B1 (ko) * 2008-01-17 2014-07-21 삼성전자주식회사 전자모듈용 방열구조체 및 이를 구비한 전자기기
WO2010036784A1 (en) * 2008-09-26 2010-04-01 Parker Hannifin Corporation Thermally conductive gel packs
TW201019431A (en) * 2008-11-03 2010-05-16 Wen-Qiang Zhou Insulating and heat-dissipating structure of an electronic component
US9163883B2 (en) 2009-03-06 2015-10-20 Kevlin Thermal Technologies, Inc. Flexible thermal ground plane and manufacturing the same
US8477500B2 (en) * 2010-05-25 2013-07-02 General Electric Company Locking device and method for making the same
TW201241603A (en) * 2011-04-08 2012-10-16 Asustek Comp Inc Motherboard
US9658000B2 (en) * 2012-02-15 2017-05-23 Abaco Systems, Inc. Flexible metallic heat connector
US20140354314A1 (en) * 2013-05-31 2014-12-04 Hitesh Arora Thermal interface techniques and configurations
US11598594B2 (en) 2014-09-17 2023-03-07 The Regents Of The University Of Colorado Micropillar-enabled thermal ground plane
US11988453B2 (en) 2014-09-17 2024-05-21 Kelvin Thermal Technologies, Inc. Thermal management planes
US10111363B2 (en) * 2014-12-04 2018-10-23 Microsoft Technology Licensing, Llc System for effectively transfering heat from electronic devices and method for forming the same
US12104856B2 (en) 2016-10-19 2024-10-01 Kelvin Thermal Technologies, Inc. Method and device for optimization of vapor transport in a thermal ground plane using void space in mobile systems
JP6886698B2 (ja) * 2017-06-29 2021-06-16 北川工業株式会社 熱伝導液パック
US10566263B2 (en) * 2017-09-28 2020-02-18 Intel Corporation Conformable heat spreader
US11054193B2 (en) 2018-05-30 2021-07-06 Amazon Technologies, Inc. Vehicle with vibration isolated electronics
US10912224B2 (en) * 2018-05-30 2021-02-02 Amazon Technologies, Inc. Thermally conductive vibration isolating connector
WO2020195301A1 (ja) * 2019-03-28 2020-10-01 日本電気株式会社 電子機器
US11158562B2 (en) 2020-02-11 2021-10-26 International Business Machines Corporation Conformal integrated circuit (IC) device package lid
EP3893274A1 (en) * 2020-04-07 2021-10-13 ABB Schweiz AG Cooling element and method of manufacturing a cooling element
CN115997099A (zh) 2020-06-19 2023-04-21 开尔文热技术股份有限公司 折叠式热接地平面
US11574853B2 (en) * 2020-06-30 2023-02-07 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device
CN214122875U (zh) * 2021-01-28 2021-09-03 益德电子科技（杭州）有限公司 电脑水族箱安装结构
JP2022159909A (ja) 2021-04-05 2022-10-18 日本航空電子工業株式会社 デバイス
US11800643B2 (en) 2021-04-05 2023-10-24 Japan Aviation Electronics Industry, Limited Device having closed space between overlapping sealing members
DE102022207570A1 (de) * 2022-07-25 2024-01-25 Robert Bosch Gesellschaft mit beschränkter Haftung Kühlvorrichtung für eine zu kühlende Baugruppe in einem Fahrzeug

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US3826957A (en) * 1973-07-02 1974-07-30 Gen Electric Double-sided heat-pipe cooled power semiconductor device assembly using compression rods
JPS5544673A (en) * 1978-09-26 1980-03-29 Nec Corp Liquid cooling device for data processor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011530190A (ja) * 2008-08-04 2011-12-15 クラスタード システムズ カンパニー 接点を冷却した電子機器匡体

Also Published As

Publication number Publication date
JP2502547Y2 (ja) 1996-06-26
US5000256A (en) 1991-03-19
DE9108728U1 (de) 1991-11-21

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