FR2745631B1 - Composant thermo-emissif a transmission thermique amelioree, et son procede de realisation - Google Patents

Composant thermo-emissif a transmission thermique amelioree, et son procede de realisation

Info

Publication number
FR2745631B1
FR2745631B1 FR9602619A FR9602619A FR2745631B1 FR 2745631 B1 FR2745631 B1 FR 2745631B1 FR 9602619 A FR9602619 A FR 9602619A FR 9602619 A FR9602619 A FR 9602619A FR 2745631 B1 FR2745631 B1 FR 2745631B1
Authority
FR
France
Prior art keywords
thermo
production
improved thermal
thermal transmission
emissive component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9602619A
Other languages
English (en)
Other versions
FR2745631A1 (fr
Inventor
Jose Dupont
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MCB Industrie
Original Assignee
MCB Industrie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MCB Industrie filed Critical MCB Industrie
Priority to FR9602619A priority Critical patent/FR2745631B1/fr
Priority to DE1997602936 priority patent/DE69702936T2/de
Priority to EP19970400429 priority patent/EP0793270B1/fr
Priority to DK97400429T priority patent/DK0793270T3/da
Publication of FR2745631A1 publication Critical patent/FR2745631A1/fr
Application granted granted Critical
Publication of FR2745631B1 publication Critical patent/FR2745631B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FR9602619A 1996-03-01 1996-03-01 Composant thermo-emissif a transmission thermique amelioree, et son procede de realisation Expired - Fee Related FR2745631B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR9602619A FR2745631B1 (fr) 1996-03-01 1996-03-01 Composant thermo-emissif a transmission thermique amelioree, et son procede de realisation
DE1997602936 DE69702936T2 (de) 1996-03-01 1997-02-26 Gehäuse für thermische Strahlungsbauelemente mit verbesserter Wärmeleitung und Herstellungsverfahren dafür
EP19970400429 EP0793270B1 (fr) 1996-03-01 1997-02-26 Boítier de composant(s) thermo-émissif(s) à transmission thermique améliorée, et son procédé de réalisation
DK97400429T DK0793270T3 (da) 1996-03-01 1997-02-26 Hus til strålingskomponenter med forbedret varmeledning og fremgangsmåde til fremstilling af sådanne

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9602619A FR2745631B1 (fr) 1996-03-01 1996-03-01 Composant thermo-emissif a transmission thermique amelioree, et son procede de realisation

Publications (2)

Publication Number Publication Date
FR2745631A1 FR2745631A1 (fr) 1997-09-05
FR2745631B1 true FR2745631B1 (fr) 1998-05-07

Family

ID=9489768

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9602619A Expired - Fee Related FR2745631B1 (fr) 1996-03-01 1996-03-01 Composant thermo-emissif a transmission thermique amelioree, et son procede de realisation

Country Status (4)

Country Link
EP (1) EP0793270B1 (fr)
DE (1) DE69702936T2 (fr)
DK (1) DK0793270T3 (fr)
FR (1) FR2745631B1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019209657A1 (de) * 2019-07-02 2021-01-07 Continental Automotive Gmbh Kühlanordnung

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4092697A (en) * 1976-12-06 1978-05-30 International Business Machines Corporation Heat transfer mechanism for integrated circuit package
US4323914A (en) * 1979-02-01 1982-04-06 International Business Machines Corporation Heat transfer structure for integrated circuit package
US5000256A (en) * 1990-07-20 1991-03-19 Minnesota Mining And Manufacturing Company Heat transfer bag with thermal via
DE9203252U1 (de) * 1992-03-11 1992-05-07 TELEFUNKEN SYSTEMTECHNIK GMBH, 7900 Ulm Anordnung zur Kühlung

Also Published As

Publication number Publication date
DE69702936D1 (de) 2000-10-05
DK0793270T3 (da) 2001-01-15
EP0793270A1 (fr) 1997-09-03
FR2745631A1 (fr) 1997-09-05
EP0793270B1 (fr) 2000-08-30
DE69702936T2 (de) 2001-04-05

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Legal Events

Date Code Title Description
ST Notification of lapse