JPH0496256A - Metallic hermetic sealing cover - Google Patents
Metallic hermetic sealing coverInfo
- Publication number
- JPH0496256A JPH0496256A JP20612690A JP20612690A JPH0496256A JP H0496256 A JPH0496256 A JP H0496256A JP 20612690 A JP20612690 A JP 20612690A JP 20612690 A JP20612690 A JP 20612690A JP H0496256 A JPH0496256 A JP H0496256A
- Authority
- JP
- Japan
- Prior art keywords
- lid
- soldering
- solder
- wettability
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 title description 17
- 229910000679 solder Inorganic materials 0.000 claims abstract description 45
- 238000005476 soldering Methods 0.000 claims description 36
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 24
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000010408 film Substances 0.000 claims 1
- 239000010409 thin film Substances 0.000 claims 1
- 238000007747 plating Methods 0.000 abstract description 24
- 229920001721 polyimide Polymers 0.000 abstract description 7
- 239000009719 polyimide resin Substances 0.000 abstract description 7
- 238000009736 wetting Methods 0.000 abstract description 6
- 238000003892 spreading Methods 0.000 abstract description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 24
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 12
- 229910052759 nickel Inorganic materials 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 11
- 229910045601 alloy Inorganic materials 0.000 description 10
- 239000000956 alloy Substances 0.000 description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- 238000012360 testing method Methods 0.000 description 6
- 229910052742 iron Inorganic materials 0.000 description 4
- 229910000640 Fe alloy Inorganic materials 0.000 description 3
- 238000005253 cladding Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 241000282806 Rhinoceros Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
「産業上の利用分野」
この発明は、ＩＣ等の半導体素子が収納されたアルミナ
パッケージの開口部を封止するための金属製ハーメチッ
クシール蓋に関するものである。DETAILED DESCRIPTION OF THE INVENTION "Field of Industrial Application" The present invention relates to a metal hermetic seal lid for sealing an opening of an alumina package in which a semiconductor element such as an IC is housed.
「従来の技術」
従来、この種のハーメチックシール蓋としては、４２ア
ロイやコバール等の鉄系合金からなる矩形や円形状をな
す薄板の表面の片面もしくは両面に、はんだ付けができ
るようにニッケルメッキが施されたもの、さらに、この
ニッケルメッキ層の表面に金メツキが施されたもの、上
記薄板の片面もしくは両面にニッケルを熱間クラッド加
工によって接合したものが知られている。``Prior Art'' Conventionally, this type of hermetic seal lid has been manufactured by using nickel plating on one or both sides of the surface of a rectangular or circular thin plate made of iron-based alloy such as 42 alloy or Kovar to enable soldering. There are known types in which the surface of the nickel plating layer is further plated with gold, and types in which nickel is bonded to one or both sides of the thin plate by hot cladding.
そして、このようなハーメチックシール蓋は、パッケー
ジの開口周縁部に形成された金属製、シーリング部に窓
枠状のはんだ薄板を介して重ねられ、オーブン等で加熱
することにより、はんだ薄板を溶かして上記金属製シー
リングに接合されて、パッケージの開口部を封止するよ
うになっている。Such a hermetic seal lid is made by stacking a metal sealing part formed around the opening of the package with a thin solder plate shaped like a window frame interposed therebetween, and melts the thin solder plate by heating it in an oven or the like. The metal sealing member is bonded to the metal sealing member to seal the opening of the package.
「発明が解決しようとする課題」
ところで、上記ハーメチックシール蓋においては、その
内面が′ａ浄な金やニッケルに覆われているため、パッ
ケージの加熱封止工程の間に、溶融はんだが蓋の内面に
濡れ広がり、その一部がホンディングワイヤに接したり
、ＩＣ上部に垂れるなどの重大な欠陥が発生し易いとい
う問題がある。``Problems to be Solved by the Invention'' By the way, in the above-mentioned hermetic seal lid, since its inner surface is covered with pure gold or nickel, molten solder may leak onto the lid during the heat sealing process of the package. There is a problem in that serious defects such as wet spreading on the inner surface and part of it coming into contact with the bonding wire or hanging on the top of the IC are likely to occur.
そのため、加熱封止時に２００２重〜２Ｋｆ重の強度の
ツーリングクリップを用いて、蓋をパッケージのキャビ
ティ内部側に反らして開口周縁に当接させて、この当接
部分より内側への溶融はんだの流れを防止することによ
り、はんだがキャビティ内に入り込むことを防止してい
るものもあるが、この場合、蓋が高い圧力で押し付けら
れるので、接合部のはんだ層の厚みが薄くなってしまう
。Therefore, during heat sealing, a tooling clip with a strength of 2,002 to 2Kf is used to bend the lid toward the inside of the package cavity and contact the opening periphery, so that the molten solder flows inward from this contact area. Some devices prevent solder from entering the cavity by preventing the solder from entering the cavity, but in this case, the lid is pressed with high pressure, which reduces the thickness of the solder layer at the joint.
このように、はんだ層の厚みが薄くなると、蓋表面やセ
ラミックスパッケージのシーリング部のメタライズ面に
吸着している水分子が加熱封止時にガス化した際に、は
んだ層から逃げにくくなり、はんだの濡れ不良やボイド
の発生を引き起こすという問題がある。In this way, when the thickness of the solder layer becomes thinner, when the water molecules adsorbed on the lid surface or the metallized surface of the sealing part of the ceramic package gasify during heat sealing, it becomes difficult for them to escape from the solder layer. There is a problem that it causes poor wetting and the generation of voids.
さらに、封止後、温度サイクルをかけると、セラミック
スパッケージと金属蓋の熱膨張の差が生じ、はんだ層に
剪断応力が発生するが、この熱応力は、はんだ層の層厚
に反比例して層厚が薄くなるほど大きくなるので、温度
サイクル気密寿命が短いという問題がある。Furthermore, when temperature cycles are applied after sealing, a difference in thermal expansion occurs between the ceramic package and the metal lid, which generates shear stress in the solder layer, but this thermal stress is inversely proportional to the thickness of the solder layer. As the thickness decreases, the size increases, so there is a problem that the temperature cycle airtight life is short.
この発明は上記問題を解決することを目的としている。This invention aims to solve the above problem.
「課題を解決するための手段」
上記目的を達成するために、この発明の金属製ハーメチ
ックシール蓋は、蓋本体の内面の中央部もしくは中央部
を周回する部分の濡れ性を、蓋本体の内面の外周部のは
んだが付けられるはんだ付け面の濡れ性より低くしたも
のであり、このように、濡れ性を設定するために、蓋本
体の内面の中央部もしくは中央部を周回する部分に、は
んだレジストを塗布したもの、蓋本体の内面の中央部も
しくは中央部を周回する部分を酸化したもの、蓋本体の
内面のはんだ付け面にのみはんだ付け用の金属薄膜を形
成したものが挙げられる。"Means for Solving the Problems" In order to achieve the above object, the metal hermetic seal lid of the present invention has a structure in which the wettability of the central part of the inner surface of the lid main body or the part surrounding the central part is controlled by the inner surface of the lid main body. The wettability is lower than that of the soldering surface to which solder is attached to the outer periphery of the lid.In order to set the wettability, solder is applied to the center of the inner surface of the lid body or the part surrounding the center. Examples include those coated with a resist, those in which the center of the inner surface of the lid body or the portion surrounding the center is oxidized, and those in which a thin metal film for soldering is formed only on the soldering surface of the inner surface of the lid body.
「作用」
この発明の金属製ハーメチックシール蓋にあっては、蓋
本体の内面の中央部もしくは中央部を周回する部分の濡
れ性が、蓋本体の内面の外周部のはんだが付けられるは
んだ付け面の濡れ性より低くいので、蓋をパッケージの
開口部にはんだを介し接合する際に、溶融はんだがはん
だ付け面を越えて蓋の内面に濡れ広がることがない。"Function" In the metal hermetic seal lid of the present invention, the wettability of the central part of the inner surface of the lid body or the part surrounding the central part is the soldering surface to which solder is applied on the outer periphery of the inner surface of the lid body. When the lid is bonded to the opening of the package via solder, the molten solder does not spread beyond the soldering surface onto the inner surface of the lid.
「実施例」
以下、図面を参照してこの発明の金属製ノ＼−メチツク
シールの実施例を説明する。"Embodiments" Hereinafter, embodiments of the metal seal of the present invention will be described with reference to the drawings.
幅１５０ｘｚｘ長さ２ｘＸ厚み０．３ｘｘの４２アロイ
（鉄系合金）の帯状の板材の片面に厚さ１０μｌのニッ
ケルメッキを施した後、これを１０ｘｘｘｌＯｚｘの正
方形に打ち抜いて蓋本体ｌを多数枚形成した。この蓋本
体ｌにおいてニッケルメッキが施された側を内面とする
。After applying nickel plating to a thickness of 10μl on one side of a strip-shaped plate of 42 alloy (iron alloy) with a width of 150xz x length 2x x thickness 0.3xx, punch this into a square of 10xxxlOzx to form a large number of lid bodies l. did. The nickel-plated side of this lid body l is defined as the inner surface.
（実施例１）
上記蓋本体Ｊの内面全域にスピンコータを使用してポリ
イミド樹脂を厚さ１０μ鱈こ塗布し、中央部の９ ｘｘ
×９ ｘｘの内側部分（はんだ付け不要領域）に、紫外
線を照射して硬化させ、他の部分の未硬化ポリイミド樹
脂を除去することにより、はんだレジスト３を形成した
（第１図および第２図参照）。このはんだレジスト３を
形成することにより、この部分の濡れ性をはんだ付け面
２の濡れ性より低くした。(Example 1) Using a spin coater, apply polyimide resin to a thickness of 10 μm over the entire inner surface of the lid body J, and coat the inner surface of the lid body J with a thickness of 9 xx in the center.
Solder resist 3 was formed by irradiating the inner part of ×9 xx (area not requiring soldering) with ultraviolet rays to cure it, and removing the uncured polyimide resin in other parts (Figs. 1 and 2). reference). By forming this solder resist 3, the wettability of this portion was made lower than that of the soldering surface 2.
（実施例２）
上記蓋本体１の内面全域にスピンコータを使用してポリ
イミド樹脂を厚さ１０μｌに塗布し、外径９ ｘｘＸ９
ｘｘ、輻１ｘｇの中央周回部（はんだ付け不要領域）
に、紫外線を照射して硬化させ、他の部分の未硬化ポリ
イミド樹脂を除去することにより、窓枠状のはんだレジ
スト４を形成した（第３図および第４図参照）。このは
んだレジスト４を形成することにより、この部分の濡れ
性をはんだ付け面２の濡れ性より低くした。(Example 2) Polyimide resin was applied to the entire inner surface of the lid body 1 to a thickness of 10 μl using a spin coater, and the outer diameter was 9 xxX9.
xx, center circumference part of radius 1xg (soldering unnecessary area)
Then, a window frame-shaped solder resist 4 was formed by irradiating ultraviolet rays to cure the resin and removing the uncured polyimide resin from other parts (see FIGS. 3 and 4). By forming this solder resist 4, the wettability of this portion was made lower than that of the soldering surface 2.
４２アロイ（鉄系合金）とニッケルとを熱間加工でクラ
ッドした材料を厚み０．３１ｚｚまで圧延し、これを１
０ｘｘｘ ｌ Ｏｘｘの大きさに打ち抜いて蓋本体５を
多数枚形成した。なお、圧延後のニッケル厚は１０μ！
である。A material made by hot working cladding of 42 alloy (iron alloy) and nickel is rolled to a thickness of 0.31zz, and this is
A large number of lid main bodies 5 were formed by punching them to a size of 0xxx l Oxx. In addition, the nickel thickness after rolling is 10μ!
It is.
（実施例３）
上記蓋本体５の内面の中央部の９ ｚｘＸ ９ ｘｘの
内側部分（はんだ付け不要領域）６に、ＹＡＧレーザ（
出力１５Ａ、ｌ０００Ｈｚ、走査速度５０ｘｘ／５ｅｃ
１大気雰囲気）を照射して、この部分６を酸化すること
により表面を荒し、この部分６の濡れ性をはんだ付け面
２の濡れ性より低くした（第５図および第６図参照）。(Example 3) A YAG laser (
Output 15A, 1000Hz, scanning speed 50xx/5ec
1 atmospheric atmosphere) to oxidize this portion 6 to roughen the surface, and the wettability of this portion 6 was made lower than that of the soldering surface 2 (see FIGS. 5 and 6).
なおはんだ付け面２にはアルミ板でマスクをかけておき
、レーザ照射の際に発生するベーパが付着するのを防止
する。The soldering surface 2 is masked with an aluminum plate to prevent vapor generated during laser irradiation from adhering.
（実施例４）
上記蓋本体５の内面の外径９ ｘｘＸ ９ ａｘ、幅１
＋ｕの中央周回部（はんだ付け不要領域）７に、ＹＡＧ
レーザ（出力１５Ａ、 １０００Ｈｚ、走査速度５０
ｚｘ７’ｓｅｃ、大気雰囲気）を照射して、この部分７
を酸化することにより表面を荒し、この部分７の濡れ性
をはんだ付け面２の濡れ性より低くした（第７図および
第８図参照）。なおはんだ付け面２にはアルミ板でマス
クをかけておき、レーザ照射の際に発生するベーパが付
着するのを防止する。(Example 4) Outer diameter of the inner surface of the lid body 5: 9 xxX 9 ax, width: 1
+U central circumferential part (soldering unnecessary area) 7, YAG
Laser (output 15A, 1000Hz, scanning speed 50
zx7'sec, atmospheric atmosphere), this part 7
The surface was roughened by oxidizing, and the wettability of this portion 7 was made lower than that of the soldering surface 2 (see FIGS. 7 and 8). The soldering surface 2 is masked with an aluminum plate to prevent vapor generated during laser irradiation from adhering.
幅１５０ｉｚｘ長さ２１厚み０．３ｘｚの４２アロイ（
鉄系合金）の帯状の板材を、１０ｘｚｘｌＯＪ１１の正
方形に打ち抜いて蓋本体８を多数枚形成した。42 alloy (width 150iz x length 21 thickness 0.3xz)
A large number of lid bodies 8 were formed by punching out strip-shaped plates of iron-based alloy (iron-based alloy) into 10xzxlOJ11 squares.
（実施例５）
上記蓋本体８を治具にセットし、中央部の９ｊｌｊＩＸ
９ｘｚの内側部分（はんだ付け不要領域）９全面にスク
リーン印刷によって常温硬化メツキマスクを塗布すると
ともに、他面には全面メツキマスクを塗布した後、バレ
ルメッキによりはんだ付け面となる部分に厚みｌＯμ！
のニッケルメッキを施し１その後、有機溶剤でメツキマ
スクを溶解除去することにより、蓋本体の内面のはんだ
付け面２にのみはんだ付け用のメツキ層（金属薄Ｍ）１
０形成する（第９図および第１Ｏ図参照）。このメツキ
層ＩＯを形成することにより、蓋本体８の内面の中央部
分の濡れ性を外周部のはんだ付け面の濡れ性より低くす
る。(Example 5) Set the lid main body 8 on a jig, and
A room temperature curing plating mask is applied to the entire inner part of 9xz (area not requiring soldering) 9 by screen printing, and after applying a full plating mask to the other side, barrel plating is applied to the part that will become the soldering surface to a thickness of lOμ!
1 Then, by dissolving and removing the plating mask with an organic solvent, a plating layer (metal thin M) 1 for soldering is applied only to the soldering surface 2 on the inner surface of the lid body.
0 (see FIG. 9 and FIG. 1O). By forming this plating layer IO, the wettability of the center portion of the inner surface of the lid main body 8 is made lower than the wettability of the soldering surface of the outer peripheral portion.
（実施例６）
上記蓋本体８を治具にセットし、外径９Ｉ×９ａｘ、幅
ｌｘｉの中央周回部（はんだ付け不要領域）１１にスク
リーン印刷によって常温硬化メツキマスクを塗布すると
ともに、他面には全面メツキマスクを塗布した後、バレ
ルメッキにより蓋本体８の内面の中央周回部８以外の部
分に厚み１０μｌのニッケルメッキを施し、その後、有
機溶剤でメツキマスクを溶解除去することにより、蓋本
体８の内面のはんだ付け面にはんだ付け用のメツキ層（
金属薄膜）１２を形成する（第１１図および第１２図参
照）。なお、中央周回部１１の内側にもメツキ層１２が
形成される。上記メツキ層１２を形成することにより、
蓋本体８の内面の中央周回部ＩＩの濡れ性を外周部のは
んだ付け面の濡れ性より低くする。(Example 6) The above-mentioned lid main body 8 was set in a jig, and a room-temperature curing plating mask was applied by screen printing to the central circumferential portion (soldering-free area) 11 with an outer diameter of 9I x 9ax and a width of lxi, and a plating mask that cured at room temperature was applied to the other side. After applying a plating mask to the entire surface, nickel plating with a thickness of 10 μl is applied to the inner surface of the lid body 8 other than the central circumferential portion 8 by barrel plating, and then, by dissolving and removing the plating mask with an organic solvent, the lid body 8 is plated. There is a plating layer for soldering on the inner soldering surface (
12 (see FIGS. 11 and 12). Note that the plating layer 12 is also formed inside the central circumferential portion 11 . By forming the plating layer 12,
The wettability of the central circumferential part II on the inner surface of the lid main body 8 is made lower than the wettability of the soldering surface of the outer peripheral part.
ここで、上記濡れ性を低下させる物理的要因について述
べると、
固液界面では、
７Ｑｓ ＋ ７ａｃ ｏ ｓθ”７ｓ
なるヤングの式が成り立つ。Here, to describe the physical factors that reduce the wettability, the following Young's equation holds true at the solid-liquid interface: 7Qs + 7ac o sθ''7s.
γρＳ、固液界面の表面張力（界面張力）７ｇ 、液体
の表面張力、
γＳ 、固体の表面張力、
θ ：接触角（０〜１８０°）、
そして、「濡れ性か悪い」＝「接触角（θ）が大きい」
ことを示す。そこで、濡れ性を悪くするためには、γｅ
が一定であるから「γＳを小さくし、γ（ｌｓを大きく
するＪ必要がある。上記実施例における 「酸化Ｊ、
「メツキなし」および「はんだレジスト」等の処理は、
「γＳを小さくし、γＱｓを大きくする」という条件に
当てはまるので、この処理により濡れ性を低下させるこ
とができるのである。γρS, surface tension of solid-liquid interface (interfacial tension) 7g, surface tension of liquid, γS, surface tension of solid, θ: contact angle (0 to 180°), and "poor wettability" = "contact angle ( θ) is large.”
Show that. Therefore, in order to worsen the wettability, γe
Since γ is constant, it is necessary to decrease γS and increase γ(ls. In the above example, oxidation J,
Processing such as "no plating" and "solder resist" is
Since the conditions of "reducing γS and increasing γQs" are met, wettability can be reduced by this treatment.
そして、第１３図に示すように、上記各実施例の金属製
ハーメチックシール蓋Ａと、はんだ薄板Ｂと、アルミナ
パッケージＣとを重ね合わせ強度２０９のシーリングク
リップで仮固定した。Then, as shown in FIG. 13, the metal hermetic seal lid A of each of the above examples, the thin solder plate B, and the alumina package C were temporarily fixed with a sealing clip having an overlap strength of 209.
なお、上記はんだ薄板Ｂは、厚さ７０μｌに圧延したＰ
ｂ−１０ｖｔ％Ｓｎを外径１０ｚｘＸ１（ｈｙｘｘ幅０
．５１１の窓枠状に打ち抜き、十分に洗浄したものであ
る。Note that the solder thin plate B is made of P rolled to a thickness of 70 μl.
b-10vt%Sn with outer diameter 10zxX1 (hyxx width 0
．． It was punched out into the shape of a 511 window frame and thoroughly cleaned.
また、上記アルミナパッケージＣは、はんだ付け部１７
である外形１０．５ｚｚＸ１−０．５ｚｚｘ幅１ｕの部
分にタングステンンペーストを焼成した後、ニッケルメ
ッキをｌＯμ１１その上に金メツキを２μｌ施したアル
ミナ９０％のＤＩＰ型のものである。なお、図中符号１
８はシリコンチップ、１９は外部リードを示す。Further, the alumina package C has a soldering portion 17.
It is a 90% alumina DIP type with an outer diameter of 10.5zzx1-0.5zzx and a width of 1u, after which tungsten paste is fired, 10μl of nickel plating is applied, and 2μl of gold plating is applied thereon. In addition, the code 1 in the figure
8 is a silicon chip, and 19 is an external lead.
次いで、上記仮固定されたしのを３００℃以上３分、最
高温度３５０℃の温度条件下で、窒素９０％、水素ｌＯ
％の雰囲気のベルト炉に入れてはんだ付けを行いアルミ
ナパッケージを気密封止した。Next, the temporarily fixed rhinoceros was heated at 300°C or higher for 3 minutes and at a maximum temperature of 350°C, with 90% nitrogen and 10% hydrogen.
% atmosphere in a belt furnace, soldering was performed, and the alumina package was hermetically sealed.
そして、下記に示すような評価試験を行い、その結果を
第１表に示す。Then, the following evaluation tests were conducted, and the results are shown in Table 1.
（Ａ）Ｘ線透過試験
金属製ハーメチックシール蓋とパッケージとの接合部に
おけるボイドの有無を検査する。(A) X-ray transmission test The presence or absence of voids at the joint between the metal hermetic seal lid and the package is inspected.
（Ｂ）蓋引き剥がし後、光学顕微鏡検査蓋の内面のはん
だが、はんだ不要領域に広がって、アルミナパッケージ
のキャビティ内に垂れているか否かを検査する。(B) After peeling off the lid, inspect using an optical microscope. Inspect whether the solder on the inner surface of the lid has spread to areas where no solder is needed and is dripping into the cavity of the alumina package.
（Ｃ）気密封止試験
温度サイクル（−６５℃〜１５０℃）をかけた後、Ｈｅ
ガス微量リーク試験およびフロロカーホングロス試験を
行って、気密封止寿命を調べる。(C) After applying a temperature cycle (-65°C to 150°C) for hermetic sealing test, He
Perform a gas trace leak test and a fluorocarbon gloss test to determine hermetic seal life.
また、比較例として以下のハーメチックノール蓋を用意
した。In addition, the following hermetic knoll lid was prepared as a comparative example.
（比較例Ｉ）
幅１５０１夏×長さ２ｆ×厚み０，３ｘｘの４２アロイ
（鉄系合金）の帯状の板材の片面に厚さ１０μ肩のニッ
ケルメッキを施した後、これをｌ０ＩＩＩＸＩＯＩＩＩ
ＩＩ＋の正方形に打ち抜いてなるハーメチックシール蓋
。(Comparative Example I) After applying nickel plating to a thickness of 10μ on one side of a 42 alloy (iron-based alloy) strip plate material of width 1501mm x length 2f x thickness 0.3xx, this was
A hermetic seal lid made by punching out a II+ square.
（比較例２）
４２アロイ（鉄系合金）とニッケルとを熱間加工でクラ
ッドした材料を厚み０．３１ｘｘまで圧延し、これを１
０ｉｕＸ１０ｉｘの大きさに打ち抜いてなるハーメチッ
クシール蓋。なお、圧延後のニッケル厚は１０μｌであ
る。(Comparative Example 2) A material made by hot working cladding of 42 alloy (iron alloy) and nickel was rolled to a thickness of 0.31xx, and this was rolled to a thickness of 0.31xx.
A hermetic seal lid punched to a size of 0iu x 10ix. Note that the nickel thickness after rolling was 10 μl.
そして、上記実施例と同様に、これら比較例１゜２のハ
ーメチックシール蓋と、はんだ薄板と、アルミナパッケ
ージとを重ね合わせ強度２０ｇのシーリングクリップで
仮固定した後、ベルト炉に入れてはんだ付けを行いアル
ミナパッケージを気密封止した。Then, in the same way as in the above example, the hermetic seal lid, thin solder plate, and alumina package of Comparative Example 1゜2 were overlapped and temporarily fixed with a sealing clip with a strength of 20 g, and then placed in a belt furnace and soldered. The alumina package was hermetically sealed.
（比較例３）
さらに、上記比較例１の７Ｘ−メチツクシール蓋を強度
ＩＫｇのシーリングクリップで仮固定したものを上記と
同様にベルト炉に入れてはんだ付けを行いアルミナパッ
ケージを気密封止した。(Comparative Example 3) Furthermore, the 7X-methic seal lid of Comparative Example 1 temporarily fixed with a sealing clip having a strength of I kg was placed in a belt furnace and soldered in the same manner as above to hermetically seal the alumina package.
（比較例４）
また、上記比較例２のハーメチックシール蓋を強度ＩＫ
ｇのシーリングクリップで仮固定したものを上記と同様
にベルト炉に入れてはんだ付けを行いアルミナパッケー
ジを気密封止した。(Comparative Example 4) In addition, the hermetic seal lid of Comparative Example 2 was
The alumina package temporarily fixed with the sealing clip in g was placed in a belt furnace and soldered in the same manner as above to hermetically seal the alumina package.
そして、上記比較例１〜４に対して、上記と同様の評価
試験（Ａ）〜（Ｃ）を行い、その結果を第１表に示す。Evaluation tests (A) to (C) similar to those described above were performed on the Comparative Examples 1 to 4, and the results are shown in Table 1.
（以下余白）
第１表から明らかなように、この発明に係わる実施例１
〜６の金属製ハーメチックシール蓋では、該蓋とパッケ
ージとの接合部にボイドが発生しておらず、しかも蓋の
内面のはんだが、はんだ不要領域に広がって、アルミナ
パッケージのキャビティ内に垂れていないことが判る。(The following is a blank space) As is clear from Table 1, Example 1 according to the present invention
In the metal hermetic seal lid of No. 6 to 6, no voids were generated at the joint between the lid and the package, and the solder on the inner surface of the lid spread to areas where solder was not required and dripped into the cavity of the alumina package. It turns out there isn't.
なお、比較例１゜２では、はんだがパッケージのキャビ
ティ内に垂れ、ＩＣとして使用できなかった。In Comparative Example 1.2, the solder dripped into the cavity of the package and could not be used as an IC.
また、比較例１〜４に比べて温度サイクル気密封止寿命
が数倍に向上しているのが判る。Furthermore, it can be seen that the temperature cycle hermetic sealing life is improved several times compared to Comparative Examples 1 to 4.
なお、この発明の金属製ハーメチックシール蓋において
は、上記実施例の他に、蓋本体の内面の中央部もしくは
中央部を周回する部分を、化学的または機械的手段等に
より面を酸化させることにより、この部分の濡れ性を、
蓋本体の内面の外周部のはんだが付けられるはんだ付け
面の濡れ性より低くしてもよい。In addition, in the metal hermetic seal lid of the present invention, in addition to the above-mentioned embodiments, the central part of the inner surface of the lid main body or the part surrounding the central part is oxidized by chemical or mechanical means. , the wettability of this part,
The wettability may be lower than that of the soldering surface of the outer periphery of the inner surface of the lid body to which solder is attached.
「発明の効果」
以上説明したように、この発明の金属製ハーメチックシ
ール蓋によれば、蓋本体の内面の中央部もしくは中央部
を周回する部分の濡れ性を、蓋本体の内面の外周部のは
んだが付けられるはんだ付け面の濡れ性より低くしたの
で、蓋をパッケージの開口部にはんだを介し接合する際
に、溶融したはんだがはんだ付け面を越えて蓋の内面に
濡れ広がることがなく、よって、該はんだの一部がボン
ディングワイヤに接したり、ＩＣ上部に垂れたりすると
いう欠陥を引き起こすことがない。"Effects of the Invention" As explained above, according to the metal hermetic seal lid of the present invention, the wettability of the central part of the inner surface of the lid body or the part surrounding the central part is controlled by the wettability of the outer peripheral part of the inner surface of the lid body. Since the wettability is lower than that of the soldering surface to which the solder is attached, when the lid is joined to the opening of the package via solder, the molten solder does not spread beyond the soldering surface to the inner surface of the lid. Therefore, defects such as a portion of the solder coming into contact with the bonding wire or dripping onto the top of the IC will not occur.
また、加熱封止時に蓋を高い圧力で開口周縁に圧接する
必要がないので、接合部のはんだ層の厚みが薄くなるこ
とがなく、よって、はんだ層の薄さに起因するはんだの
濡れ不良やボイドの発生を防止することができるととも
に、温度サイクル気密寿命を従来に比べて格段に向上さ
せることができる。In addition, since there is no need to press the lid against the periphery of the opening with high pressure during heat sealing, the thickness of the solder layer at the joint does not become thinner, which prevents poor wetting of the solder due to the thinness of the solder layer. The generation of voids can be prevented, and the temperature cycle airtight life can be significantly improved compared to the conventional method.
第１図ないし第１３図はこの発明の金属製のハーメチッ
クシール蓋の実施例を示するものである。
第１図および第２図は第１実施例を示し、第１図は蓋の
平面図、第２図は同側面図、第３図および第４図は第２
実施例を示し、第３図は蓋の平面図、第４図は同側面図
、第５図および第６図は第３実施例を示し、第５図は蓋
の平面図、第６図は同側面図、第７図および第８図は第
４実施例を示し、第７図は蓋の平面図、第８図は同側面
図、第９図および第１θ図は第５実施例を示し、第９図
は蓋の平面図、第１Ｏ図は同側面図、第１１図および第
１２図は第６実施例を示し、第１１図は蓋の平面図、第
１２図は同側面図、第１３図はパッケージに蓋を接合し
ている状態を示す斜視図である。
１．５．８・・・・・・蓋本体、２・・・・・・はんだ
付け面、３．４・・・・・・はんだレジスト、
６．９・・・・・・蓋本体内面の中央部、７．１ ］・
・・・・・中央周回部、
１０．１２・・・・・メツキ層、
Ａ・・・・・金属製ハーメチックシール蓋、Ｂ・・・・
・・はんだ薄板、Ｃ・・・・パッケージ。1 to 13 show examples of the metal hermetic seal lid of the present invention. 1 and 2 show the first embodiment, FIG. 1 is a plan view of the lid, FIG. 2 is a side view of the same, and FIGS. 3 and 4 are the second embodiment.
FIG. 3 is a plan view of the lid, FIG. 4 is a side view of the same, FIGS. 5 and 6 show the third embodiment, FIG. 5 is a plan view of the lid, and FIG. The same side view, FIGS. 7 and 8 show the fourth embodiment, FIG. 7 is a plan view of the lid, FIG. 8 is the same side view, and FIGS. 9 and 1θ show the fifth embodiment. , FIG. 9 is a plan view of the lid, FIG. 1O is a side view of the same, FIGS. 11 and 12 show the sixth embodiment, FIG. 11 is a plan view of the lid, and FIG. FIG. 13 is a perspective view showing a state in which the lid is joined to the package. 1.5.8...Lid body, 2...Soldering surface, 3.4...Solder resist, 6.9...Inner surface of the lid body Central part, 7.1 ]・
...Central circumferential portion, 10.12...Plating layer, A...Metal hermetic seal lid, B...
...Solder thin plate, C...Package.
Claims (4)
内部に半導体素子が装填されたパッケージの開口部には
んだを介して密着されて該開口部を封止する金属製ハー
メチックシール蓋であって、上記蓋本体の上記開口部に
対向する内面の中央部もしくは中央部を周回する部分の
濡れ性を、上記内面の外周部のはんだが付けられるはん
だ付け面の濡れ性より低くしたことを特徴とする金属製
ハーメチックシール蓋。(1) A thin metal film for soldering is formed on the lid body,
A metal hermetic seal lid that is tightly attached via solder to an opening of a package in which a semiconductor element is loaded to seal the opening, the central portion of the inner surface facing the opening of the lid main body; Alternatively, a metal hermetic seal lid characterized in that the wettability of the portion surrounding the central portion is lower than the wettability of the soldering surface to which solder is attached to the outer periphery of the inner surface.
部分に、はんだレジストを塗布することにより、この部
分の濡れ性をはんだ付け面の濡れ性より低くしたことを
特徴とする請求項１記載の金属製ハーメチックシール蓋
。(2) Claim 1 characterized in that a solder resist is applied to the central part of the inner surface of the lid body or a part surrounding the central part, so that the wettability of this part is lower than that of the soldering surface. Metal hermetically sealed lid as described.
部分を酸化することにより、この部分の濡れ性をはんだ
付け面の濡れ性より低くしたことを特徴とする請求項１
記載の金属製ハーメチックシール蓋。(3) Claim 1 characterized in that the central part of the inner surface of the lid body or the part surrounding the central part is oxidized to make the wettability of this part lower than that of the soldering surface.
Metal hermetically sealed lid as described.
の金属薄膜を形成することにより、上記内面の中央部も
しくは中央部を周回する部分の濡れ性を上記はんだ付け
面の濡れ性より低くしたことを特徴とする請求項１記載
の金属製ハーメチックシール蓋。(4) By forming a metal thin film for soldering only on the soldering surface of the inner surface of the lid body, the wettability of the central part of the inner surface or the part surrounding the central part is lower than that of the soldering surface. The metal hermetic seal lid according to claim 1, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20612690A JPH0496256A (en) | 1990-08-03 | 1990-08-03 | Metallic hermetic sealing cover |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20612690A JPH0496256A (en) | 1990-08-03 | 1990-08-03 | Metallic hermetic sealing cover |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0496256A true JPH0496256A (en) | 1992-03-27 |
Family
ID=16518221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20612690A Pending JPH0496256A (en) | 1990-08-03 | 1990-08-03 | Metallic hermetic sealing cover |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0496256A (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09199622A (en) * | 1996-01-18 | 1997-07-31 | Ngk Spark Plug Co Ltd | Metal lid substrate for electronic part package, metal lid, and its manufacturing method |
| JP2006190856A (en) * | 2005-01-07 | 2006-07-20 | Senju Metal Ind Co Ltd | Lid for package and manufacturing method thereof |
| US7173331B2 (en) | 2003-02-06 | 2007-02-06 | Neomax Materials Co., Ltd. | Hermetic sealing cap and method of manufacturing the same |
| JP2010040585A (en) * | 2008-07-31 | 2010-02-18 | Tanaka Holdings Kk | Lid for package sealing and its manufacturing method |
| US7790988B2 (en) | 2006-02-15 | 2010-09-07 | Neomax Materials Co., Ltd. | Hermetic sealing cap, electronic component accommodation package, and method for producing hermetic sealing cap |
| JPWO2012017888A1 (en) * | 2010-08-04 | 2013-10-03 | 株式会社村田製作所 | Electronic component manufacturing method and electronic component |
| US8865584B2 (en) | 2010-05-18 | 2014-10-21 | Toyota Jidosha Kabushiki Kaisha | Semiconductor device and manufacturing method thereof |
| JP2015073027A (en) * | 2013-10-03 | 2015-04-16 | 日立金属株式会社 | Cap for hermetic seal, package for electronic component and method of manufacturing cap for hermetic seal |
| JP2016115701A (en) * | 2014-12-11 | 2016-06-23 | 株式会社Ｎｅｏｍａｘマテリアル | Manufacturing method of lid material for hermetic seal and lid material for hermetic seal |
| JP2017028255A (en) * | 2015-07-15 | 2017-02-02 | 日立金属株式会社 | Cap for hermetic seal and electronic component housing package |
| JP2018074021A (en) * | 2016-10-31 | 2018-05-10 | 日立金属株式会社 | Manufacturing method of lid for airtight sealing |
| JP2020053554A (en) * | 2018-09-27 | 2020-04-02 | 日立金属株式会社 | Hermetic sealing cap and manufacturing method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57112054A (en) * | 1980-12-29 | 1982-07-12 | Fujitsu Ltd | Semiconductor device |
-
1990
- 1990-08-03 JP JP20612690A patent/JPH0496256A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57112054A (en) * | 1980-12-29 | 1982-07-12 | Fujitsu Ltd | Semiconductor device |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09199622A (en) * | 1996-01-18 | 1997-07-31 | Ngk Spark Plug Co Ltd | Metal lid substrate for electronic part package, metal lid, and its manufacturing method |
| US7173331B2 (en) | 2003-02-06 | 2007-02-06 | Neomax Materials Co., Ltd. | Hermetic sealing cap and method of manufacturing the same |
| JP2006190856A (en) * | 2005-01-07 | 2006-07-20 | Senju Metal Ind Co Ltd | Lid for package and manufacturing method thereof |
| US7790988B2 (en) | 2006-02-15 | 2010-09-07 | Neomax Materials Co., Ltd. | Hermetic sealing cap, electronic component accommodation package, and method for producing hermetic sealing cap |
| JP2010040585A (en) * | 2008-07-31 | 2010-02-18 | Tanaka Holdings Kk | Lid for package sealing and its manufacturing method |
| US8865584B2 (en) | 2010-05-18 | 2014-10-21 | Toyota Jidosha Kabushiki Kaisha | Semiconductor device and manufacturing method thereof |
| JPWO2012017888A1 (en) * | 2010-08-04 | 2013-10-03 | 株式会社村田製作所 | Electronic component manufacturing method and electronic component |
| JP2015073027A (en) * | 2013-10-03 | 2015-04-16 | 日立金属株式会社 | Cap for hermetic seal, package for electronic component and method of manufacturing cap for hermetic seal |
| US10183360B2 (en) | 2013-10-03 | 2019-01-22 | Hitachi Metals, Ltd. | Hermetic sealing cap, electronic component housing package, and method for manufacturing hermetic sealing cap |
| JP2016115701A (en) * | 2014-12-11 | 2016-06-23 | 株式会社Ｎｅｏｍａｘマテリアル | Manufacturing method of lid material for hermetic seal and lid material for hermetic seal |
| US10461001B2 (en) | 2014-12-11 | 2019-10-29 | Hitachi Metals, Ltd. | Method for manufacturing hermetic sealing lid member, and method for manufacturing electronic component housing package |
| JP2017028255A (en) * | 2015-07-15 | 2017-02-02 | 日立金属株式会社 | Cap for hermetic seal and electronic component housing package |
| JP2018074021A (en) * | 2016-10-31 | 2018-05-10 | 日立金属株式会社 | Manufacturing method of lid for airtight sealing |
| JP2020053554A (en) * | 2018-09-27 | 2020-04-02 | 日立金属株式会社 | Hermetic sealing cap and manufacturing method thereof |
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