JPH0495328A - Formation of partition wall - Google Patents

Abstract

PURPOSE:To uniform the film thickness of each resist so as to enhance the yield of formation of partition walls by forming on a partition-wall forming thick film layer a leveling layer whose surface is almost flat, and laminating the resist to the surface of the leveling layer. CONSTITUTION:A leveling layer 22 is formed by thick film printing in such a manner as covering the whole outer surface of a partition-wall forming thick film layer 20 and is left for a required time and then leveled so as to flatten the surface thereof. Each time the partition-wall forming thick film layer 20 and the leveling layer 22 are printed or after the printing is completed, the layers 20,22 are dried. The leveling layer 22 is stacked on a resist 24 and an electrode base 14 is held in an oven so as to dry the resist 24. Next the resist 24 is exposed using a mask (not shown in the Figure) so that a resist pattern 28 from which the channeling area 26 of the partition-wall forming thick film layer 22 is exposed is formed. Next the leveling layer 22 and the partition-wall forming thick film layer 22 of the channeling area 26 which is exposed are removed by means of etching by blasting. The remaining leveling layer 22 and partition-wall forming thick film layer 20 are baked whereby formation of a partition wall is completed.

Description

[Detailed description of the invention] (Industrial application field) The present invention relates to a method for forming partition walls in a gas discharge panel.

(Prior Art) When making a gas discharge panel higher in definition, color, or smaller, the problem is how to form a fine image interval of 9%.

A screen printing method is used to form the partition walls of a gas discharge panel, but forming the partitions g1 by laminating thick film materials in a predetermined pattern has the following problems: 1. It is difficult to practically form more than 5 partition walls per mm.

(Problem to be Solved by the Invention) Therefore, in a separate application, the inventor of this application has proposed a method of forming partition walls of a gas discharge panel using etching by blasting.

In this method, a thick film layer for forming a partition wall is laminated on an electrode of a substrate provided with an electrode, a resist is formed on the thick film layer so as to expose a groove forming region Kt of this thick film layer, and the exposed groove forming region Apply an abrasive to this area and remove the etching. As a result, a partition wall consisting of the remaining portion of the thick film layer for partition formation is obtained, and according to this partition wall forming method, a partition wall of 1 m
It is possible to form eight or more partition walls per m.

However, when the thick film layer for forming partition walls is laminated by the thick film printing method, there is a problem that the resist is easily peeled off from the thick film layer because the resist forming surface of the thick film layer is extremely uneven.

This point will be explained with reference to the drawings. Figure 5 (A) - (
C) is a sectional view of a main part for explaining the case where a resist is formed on the thick film layer for forming a partition wall, and shows one step of the resist forming process in this case.

In forming the resist, first, as shown in FIG.
Apply with SUBISI COAT.

1@Resist forming surface of wall forming thick film layer 10] ○a has large unevenness, and due to this unevenness, the unevenness of the film thickness of the resist 10 becomes large.

Next, as shown in FIG. 5(B), the resist 12 is exposed to light to harden the resist portions corresponding to the partition forming portions. In the figure, the cured portions and uncured portions of the resist] 2 are indicated by reference numerals 12a and 12b. Since the non-uniformity of the film thickness is large, uncured portions 12b are likely to be formed in a deep part close to the resist forming surface 10 days in the thick part.

Next, as shown in FIG. 5(C), the resist 128 is developed to remove the uncured portion 12a. Even if there is a hardened portion 12b of the partition forming portion that should remain, for example, as shown in FIG.
B) (As shown by this symbol and % B, the uncured portion 12 is attached to the cured portion or between B and the resist forming surface 10a.
b, the cured portion A is removed together with the uncured portion 12a, and the cured portion B is removed from the resist forming surface 10a.
Because of the weak adhesion to the resist surface 10a, it may easily peel off from the resist surface 10a. If the hardened portions A and B do not remain, the thick film layer for forming partition walls that should remain as partition walls will be etched away, making it impossible to form the desired partition walls.

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, it is an object of the present invention to provide a method for forming partition walls in which the thickness of the resist is made uniform to form l@ walls.

(Means for Solving the Problems) In order to achieve this object, the barrier rib forming method of the present invention provides a leveling layer with a flat surface on a thick film layer for wall formation when forming the barrier Wt of a gas discharge panel. a step of forming;
A step of laminating a resist on this leveling layer to form a resist pattern exposing the groove forming region of the thick film layer for forming a partition, and a step of removing the thick film layer for forming a partition in the groove forming region using an etching jig using blasting. It is characterized by comprising.

(Function) According to such a method for forming partition walls, a leveling layer having a substantially flat surface is formed on the thick film layer for forming partition walls, and a resist is laminated on the surface of this leveling layer. Therefore, even if the surface of the thick film layer for forming partition walls is uneven, the resist can be laminated with a substantially uniform thickness.

(Example) Embodiments of the present invention will be described below with reference to the drawings.

It should be noted that the drawings are only schematic representations to the extent that the invention can be understood.

Fig. 1 is a manufacturing process diagram to provide a detailed explanation of the present invention, and Figs. 1 (A) to (C) show the process in progress, taken in a direction perpendicular to the display electrodes of the gas discharge display panel. The main parts are shown in cross-section, and FIGS. 1(D) to (H) show the state in the middle of the process as cross-sections of the main parts taken in the direction of the display electrodes of the gas discharge display panel.

As shown in FIG. 1(A), in this embodiment, a plurality of stripe-shaped cathode patterns arranged in parallel are printed on one substrate surface 14a of the electrode substrate 14 using a thick film printing method. This pattern is dried and then fired to form the cathode 16.

Next, as shown in FIG. 1B, a protective layer 18 is laminated on the upper surface of the cathode 16 by a screen printing method, and the printed protective layer 18 is cured. The protective layer] 8 has a property that it will not be scraped off by the abrasive material of blasting, and is intended to protect the cathode 16 from damage caused by the abrasive material.

Next, as shown in FIG. 1C, a thick film layer 20 for forming partition walls is printed on the protective layer 18 and the substrate surface 14a.

Next, as shown in FIG. 1(D), the thick film layer 2 for forming partition walls is
The leveling layer 22 is printed as a thick film so as to cover the entire upper surface of the layer 0, and is left for a required period of time to level the leveling layer 22 and flatten its surface.

These layers 20 and 22 are dried each time or after printing of the partition wall forming thick film layer 20 and the leveling layer 22 is completed.

FIG. 2 is an enlarged sectional view of essential parts showing a state in which a leveling layer is laminated on a thick film layer for forming partition walls.

The main components of the thick film paste of the thick film layer 20 for forming partition walls are a glass component, a pigment, and a screeching oil.In the production of a color display panel, a white thick film paste such as 421
A black thick film paste such as 9741DuPon manufactured by Okuno Pharmaceutical Co., Ltd. is used as a thick film paste for forming partition walls in the production of a monochrome panel display. The viscosity of this thick film paste for forming partition walls is set to be high, for example, about 1500 ps (under a temperature environment of 25° C.) for the purpose of improving dimensional accuracy and lamination properties. However, with such high viscosity, the roughness of the surface 20a of the thick film layer 2o for forming partition walls becomes large, as shown in FIG. partition walls cannot be formed properly.

Therefore, in this example, a thinning liquid exclusively for this paste was added to the thick film paste for forming partition walls, and the viscosity was adjusted to, for example, 5 oo.
ps (temperature environment of 25° C.), and this low viscosity thick film paste is used as a thick film paste for forming a leveling layer. Low viscosity thick film paste does not have good lamination properties or has a high leveling effect.By leaving it open when required after printing, the surface 20a of the partition forming layer 20 can be removed as shown in FIG.
The leveling layer 22 having a much flatter surface 22a can be easily formed.

After forming the leveling layer 22, as shown in FIG. 1(E), a resist 24 is laminated on the leveling layer 22 by, for example, a spin code method, and the electrode substrate 14 is dried at a temperature of 80° C. for about 30 minutes. The resist 24 is kept in an oven for a period of time to dry it.

Next, as shown in FIG. 1F, the resist 24 is exposed to light using a mask (not shown) to form a resist pattern 28 that exposes the groove forming regions 26 of the thick film layer 22 for forming partition walls. The resist pattern 24a has a stripe shape, and has a plurality of patterns 24a arranged in parallel.

FIG. 3 is an enlarged sectional view of a main part showing a state in which a resist is laminated on a leveling layer, and shows a state in which the resist is exposed.

As shown in FIG. 3, the surface 22a of the leveling layer 22
is substantially flat, and therefore, by laminating the resist 24 on this surface 22a, it is possible to form a resist 24 with a substantially uniform thickness.
Good fertility can be obtained in the darkness. ! After 11, the unexposed portion 24b of the resist 24 is removed to obtain a resist pattern 28 consisting of the exposed portion 24a remaining on the leveling layer 22. The resist pattern 28 is on the surface 122
Since it has good adhesion to surface 22a, it will not easily peel off from surface 22a during etching by blasting in the subsequent process.

Next, as shown in FIGS. 1F to 1G, the leveling layer 22 and the partition wall forming thick film layer 20 in the exposed groove forming region 26 are removed by etching using blasting. When the partition wall forming thick film layer 20 is removed to the substrate surface 14 or the protective layer 18, the partition wall forming thick film layer 20 remaining constitutes the partition wall. The blast machine used for this etching may have any suitable configuration.

Next, the leveling layer 22 and the partition wall forming thick film layer 20 are fired to complete the formation of the partition walls. As shown in FIG. 1(H), this baking creates the resist pattern 28 and the protective layer 1.
8 will be destroyed by fire.

In the above embodiment, the leveling layer 22 is formed using a low viscosity thick film paste formed from the thick film paste of the partition wall forming thick film layer 26, but the leveling layer 22 is not limited to this. System film forming liquid OCD
type7-20001 manufactured by Tokyo Ohka Kogyo Co., Ltd. (in addition, this t
ype7-2000 is an alcohol solution of hydroxysilane). In this case, after applying this film forming liquid to the surface 20a of the thick film layer 20 for forming partition walls, The electrode substrate 14 is rotated with a spinner (for example, at a low rotation speed of 500 rpm or less) to flatten the surface of the coated film forming liquid layer. After drying the flattened film forming liquid layer, etching is performed by blasting. Thereafter, the film forming liquid layer and the partition wall forming thick film layer 20 are fired to complete the formation of the partition walls.

Further, in the above embodiment, the leveling layer 22 has a single layer structure, but is not limited to this, and may have a multilayer structure.

FIG. 4 is an enlarged sectional view of a main part showing a state in which a two-layered leveling layer is formed, and shows a state in which a resist layered on the leveling layer is exposed. Note that the constituent components (corresponding constituent components) of the above-mentioned embodiments are indicated with the same reference numerals.

In the example shown in FIG. 4, the leveling layer 22 is composed of the above-described low viscosity thick film paste layer 30 and film forming liquid layer 32. Hereinafter, the process of forming a leveling layer with a two-layer structure and the subsequent steps will be mainly explained, or the detailed explanation will be omitted for the same points as those of the above-mentioned embodiments.

In this case, a low viscosity thick film paste is printed on the partition wall forming thick film layer 20, and this paste is left to dry for a required period of time to flatten the surface. A low viscosity thick film paste layer 30 is obtained.

Next, a film-forming liquid, such as the above-mentioned CD type 7-2000, is applied onto the low-viscosity thick-film paste layer 30 using a stainer to obtain a layer 32 of the film-forming liquid with a flat surface, and then this layer 32 is dried.

Next, a resist 24 is laminated on the film forming liquid layer 32 and exposed to light to form a resist pattern 28.

Next, etching is performed by blasting, and then the barrier rib forming thick film #20, the low viscosity thick film paste layer 30, and the film forming liquid layer 32 are fired (baking temperature: 580° C.) to complete the barrier rib formation.

In this example, since the film forming liquid layer 32 is formed on the flattened low viscosity thick film paste layer 30, the thick film layer 32 for partition wall formation
The thickness of the film-forming liquid layer 32 is thinner than that in the case where the film-forming liquid layer 32 is formed on the surface 20a of 0.
The speed can be set to about rpm.

The present invention is not limited to the embodiments described above, and therefore the shape, dimensions, forming material, forming method, numerical conditions, and other conditions of each component can be changed as desired. For example, in the embodiments described above, the partition walls are formed on the electrode substrate on the cathode forming side of the gas discharge panel, or may be formed on the electrode substrate on the anode forming side. In addition, in the above-mentioned embodiments, a protective layer is provided on the entire top surface of the cathode, but no protective layer is provided on the substrate surface, or a protective layer is not provided on the substrate surface and the top surface of the cathode in the partition forming area. At the same time, a protective layer may be provided on the upper surface of the cathode in the groove forming region, or a protective layer may be provided not only on the cathode but also on the substrate surface.

(Effects of the Invention) As is clear from the above description, according to the barrier rib forming method of the present invention, a hesong layer with an almost flat surface is formed on the thick film layer for barrier rib formation, and the surface of the leveling layer is Layer the resist. Therefore, even if the surface of the thick film layer for forming partition walls is uneven, the resist can be laminated with a substantially uniform thickness and with a much smoother surface.

As a result, the resist pattern formed for forming the barrier ribs can be formed on the leveling layer with good adhesion, so that peeling or chipping of the resist pattern hardly occurs, and distortion of the exposed shape of the resist can be reduced. Therefore, when the partition walls are formed by etching using blasting, the partition walls having a predetermined shape can be formed with a high yield.

[Brief explanation of drawings]

1(A) to 1(H) are manufacturing process diagrams providing a detailed explanation of the present invention; FIG. 2 is an enlarged sectional view of essential parts showing a state in which a leveling layer is laminated on a thick film layer for forming partition walls; The figure is an enlarged cross-sectional view of the main part showing a state in which a resist is formed on the leveling layer. Figure 4 is an enlarged cross-sectional view of the main part showing a state in which a two-layered leveling layer is formed. FIG. 2 is a diagram illustrating a case where a resist is directly formed on a thick film for forming a wA wall. 20...Thick film layer for forming partition walls 22...Leveling layer, 24...Resist 26...
-Groove formation area, 28-...resist pattern. Patent Applicant: Oki Electric Industry Co., Ltd. 26. Groove Formation Region Manufacturing Process Diagram for Explanation of the Embodiment FIG. 1 14a-Substrate Surface 1 Manufacturing Process Diagram for the Explanation of the Embodiment FIG. 2 Figure 2 Leveling layer of a two-layer structure Figure 4 State of forming resist 12 Description of forming and applying resist to thick film layer Figure 5

Claims (1)

[Claims] (1) In forming the partition walls of the gas discharge panel, a step of forming a leveling layer with a flat surface on the thick film layer for forming the partition walls, and laminating a resist on the leveling layer to form the thick film layer for forming the partition walls. A method for forming a barrier rib, comprising the steps of: forming a resist pattern that exposes a groove forming region; and removing a thick film layer for forming a barrier rib in the groove forming region by blast etching.