JPH0493174A - Board for dressing - Google Patents

Abstract

PURPOSE:To automatize the dressing process by providing a dressing part which has a dressing face displaying a dressing effect with its contact with the polishing face of a polishing machine, and the part to be held which is held on a dressing means. CONSTITUTION:A dressing board 10 used for the dressing means of an automatic polishing device is equipped with a dressing part 12 having the dressing face which displays a dressing effect with its contact with the polishing face of a polishing machine, and the part 14 to be held which is held on the dressing means. This dressing part 12 will do by having the dressing face which can efficiently remove the polishing residue, abrasive, etc., clogged on the polishing surface of the polishing machine, and the pad of the polishing machine is subjected to dressing easily with the similar motion to polishing process, by installing a dressing board 10 on the carrier of the polishing machine similarly to the board to be polished.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a dressing substrate for removing the deviation of a polishing disk.

[Prior Art] The production of ordinary magnetic disk substrates, Si wafers, etc. includes a step of polishing their surfaces.

[Normal polishing]--The process is carried out as follows.

As shown in FIG. 6, a workpiece 6 supported by a carrier 60 is held between upper and lower surface plates 62 and 63. The upper and lower surface plates 62 and 63 each have a pad 6465,
Pads 64 and 65 are placed facing each other so as to be in contact with both surfaces of the workpiece 6. In this state, the workpiece is polished by supplying an abrasive between the workpiece 6 and the pads 64 and 65 while the carrier 60 rotates and then revolves.

In the polishing process, when multiple batches of polishing are performed in succession, the pads 64 and 65 become clogged with polishing slag, abrasive, etc., resulting in a decrease in polishing speed and the occurrence of scratches. For this reason, after polishing multiple batches, a dredging step is indispensable to periodically remove polishing slag, abrasives, etc. that are clogged in the pads 64.65 of the upper and lower surface plates 62.63. Traditionally, the dressing process uses cutter blades, dressing carriers,
This is done by using high-pressure water to remove polishing slag, abrasives, etc. that have clogged the pads 64 and 65.

[Problems to be Solved by the Invention] However, all conventional dredging processes are performed manually. For this reason, it has been difficult to determine whether or not there is a demand for automating the polishing process in order to realize a fully automated line, and how to respond to that demand.

The training process requires special movements. Therefore, even if automatic robots are used, multiple robots are required. Another problem is that the automated equipment becomes larger and its operation becomes more complicated.

The present invention has been made in view of this point, and an object of the present invention is to provide a dressing substrate used for automating the dressing process.

[Means for Solving the Problems] The present invention provides a dressing substrate for use in the dressing means of an automatic polishing apparatus comprising a polishing disc and a dressing means for dressing the polishing surface of the polishing disc, A dressing substrate is provided, comprising a dressing part having a dressing part that exhibits a dressing effect by contacting a polished surface of a disk, and a held part held by dressing means.

Here, as the old material of the dressing substrate, glass, metal, ceramics, resin such as polypropylene, polyvinyl chloride, etc. are used.

The dressing part may have a sinking surface that can efficiently remove polishing slag, abrasive, etc. that are clogged on the polishing surface of the polishing disk. For example, an uneven surface formed by providing a plurality of parallel or concentric grooves can be mentioned. In this case, the pitch of the grooves is preferably 2 mm to 20 mm. This is because if the pitch of the grooves is less than 2 mm, the removed polishing slag tends to accumulate and the dressing effect will not be sufficiently exerted, and if the pitch of the grooves exceeds 20 m11, the number of grooves will decrease and the dressing time will become longer. It is from. The depth of the groove is preferably 1 mm to 10 mm. This is because if the groove depth is less than 1 mm, the pad will follow the irregular shape and the tressing effect will be weakened, and if the groove depth exceeds 10 mm, it will be necessary to thicken the board when manufacturing the tracing board. This is because the TfLm of the dressing substrate itself becomes very large and the automation equipment becomes large. Further, the grooves may be provided in the same shape on both sides of the dressing substrate as long as a sufficient dressing effect is exhibited, or may be provided in different shapes on each side.

Alternatively, the dressing portion may be constructed by removing a brush on the surface of the dressing substrate.

The gripping portion is a portion that grips the dressing substrate when dressing the polishing surface of the polishing disk.

When the gripping method is a chucking method in a part of the chamfer, it is preferable that the gripping portion has the same shape as the substrate to be polished. On the other hand, when the gripping method is a suction method, the width of the gripping portion is preferably 10 mm to 35 mm. This is because if the width of the gripping part is less than 10 mm, a large force is required for suction, making it difficult to securely grip it, and if the width of the gripping part exceeds 35 m, common use for each substrate size is impossible, i.e. This is because it requires specialization of the suction section, which increases the work involved in changing stages.

Chuffing, suction, etc. are used as a gripping method for the treading substrate.

[Function] By placing the dressing substrate of the present invention on the carrier of a polishing machine in the same manner as the substrate to be polished, the pad of the polishing disk can be easily dressed in the same operation as in the polishing process.

Therefore, it is possible to completely automate the dredging process of the polishing pad.

[Example] Hereinafter, an example of the present invention will be specifically described with reference to the drawings.

Embodiment 1 FIG. 1 is a plan view showing an embodiment of a dressing substrate according to the present invention. 10 in the figure is a dressing board for an 8.25-inch disk. The dressing substrate 1o has an outer diameter of 210 mm, an inner diameter of 100 mm, and a thickness of 3 mm, and is made of polypropylene. The dressing board 1° is composed of a dressing part]2 and a chucking part]4 provided inside the dressing part]2. Further, a plurality of parallel grooves 16 are formed in the dressing portion 12, forming an uneven surface. In addition, as shown in FIG. 2, the pitch P1 of the groove]6
was 2 mm, the depth Dl of the groove 16 was ], mm, and the width W of the chucking portion was 0.5 mm.

In addition, uneven surfaces of the same shape were formed in the dressing portions on both sides of the substrate.

Next, a case where the dressing substrate of the present invention is used in an automated line will be described.

FIG. 3 is an explanatory diagram showing a part of the polishing device in the automated line. 30 in the figure is a polishing device. Polishing device 3
0 is an upper surface plate (not shown), a lower surface plate 31, and a carrier 3
2, and a central axis 33. Upper surface plate and F
Each surface plate 3 is provided with a pad that contacts the workpiece. The carrier 32 is meshed with an internal gear formed around the outer periphery of the lower surface plate 31 and an external gear formed on the outer periphery of the central shaft 33, and revolves while rotating.

On the other hand, an automatic robot 34 is installed on the side of the polishing device 30. The arm 35 of the automatic robot 34 is movable to draw a trajectory indicated by a broken line in the figure. A dressing substrate stand 36 is installed within the range surrounded by the locus of the arm 35, and the dressing substrate 37 can be stored and taken out by the automatic robot 34. Also, within the range of the locus of the arm 35 of the automatic robot 34, a plating board storage cassette supply conveyor 40, a polishing board storage cassette supply conveyor 40, a polishing board cassette 38, a polishing board cassette 39, and a polishing board cassette 39 are provided. A cassette supply conveyor 43 for substrates is also mounted.In addition, a cassette discharge conveyor 42 for ``Metsuki'' substrates is mounted so that the three empty cassettes 38. can be moved from within the locus of the arm 35. A polished substrate storage cassette discharge conveyor 41 is placed.

A case will be described in which a substrate polishing process and a surface plate pad dressing process are performed using an apparatus having such a configuration.

First, in accordance with the polishing mode, the automatic robot 34 takes out the plating substrate from the plating substrate cassette 38 of the plating substrate storage cassette supply conveyor 40, and transfers it to the lower surface plate 3 of the polishing device 30. to be installed. The automatic robot 34 repeats this operation for one polishing process (15 times in this embodiment). The empty cassette 38 is transferred by a cassette discharge conveyor 42 for plated substrates. Next, the upper surface plate is placed on the carrier 32 so that both surfaces of the substrate are in contact with the pads.

Thereafter, the installed substrate is polished by the operation of the polishing device 30. After polishing is completed, the automatic robot 34 carries the polished substrate placed on the carrier 32 to the polished substrate cassette 39 of the polished substrate storage cassette discharge compare 4]. The automatic robot 34 repeats this operation for each polishing batch.

These series of polishing treatments are repeated several times.

Next, the automatic robot 34 carries the polished substrate placed on the carrier 32 to the three polished substrate cassettes of the polished substrate storage cassette discharge conveyor 41 according to the dressing mode, and then transfers the polished substrate cassette to the dressing substrate table 3.
6, the dressing substrate 37 is installed at a predetermined position on the carrier 32 on the lower surface plate 3]. The automatic robot 34 is
This operation is repeated for one batch of polishing processing. Next, the upper surface plate is placed on the carrier 32 so that the pads of the second surface plate are in contact with the dressing substrate 37. After that, the phrase (1
The dressing process is performed by the operation of the meeting device 30,
Padded or dressed.

After finishing the dressing work, the automatic robot 34 carries the dressing substrate 37 installed on the carrier 32 to the treading substrate stand 36. The automatic robot 34 repeats this operation for one batch of polishing processing.

After that, the automatic robot 34 wants to go into polishing mode.
Take out the plating board from the plating board cassette 38 of the plating board storage cassette supply conveyor 40,
It is installed on the carrier 32 on the lower surface plate 3 of the polishing device 30. The automatic robot 34 repeats this operation for one hatch of the polishing process.

In this way, the polishing process is performed again.

By repeating the above operations, the polishing device 30
can perform polishing and dressing processes completely automatically.

Embodiment 2 FIG. 4 is a plan view showing another embodiment of the dressing substrate according to the present invention. In the figure, 50 is a dressing board for a 3.5-inch disk. This tracing substrate 50 has an outer diameter of 95 mm and a thickness of 3 mm, and is made of tempered glass.

The dressing board 50 includes a dressing part 52 and three suction parts 54 provided inside the dressing part 52.
It is composed of The three suction parts 54 have the same distance from each suction part 54, and the distance from each of the suction parts 54 is the same, and the distance from the training substrate 50 is the same.
They were formed so that the distances from the center were the same. Further, the tresting portion 52 has a plurality of grooves 5 in parallel.
6 is formed, and an uneven surface is formed. In addition,
As shown in FIG. 5, the pitch P2 of the grooves 56 is 2 mm.

The depth D2 of the groove 56 is 1 mm, and the diameter d of the suction part is 15 mm.
And so. In addition, uneven surfaces of the same shape were formed in the dressing portions on both sides of the substrate.

Polishing is performed by performing the polishing process of the substrate and the dressing process of the pad of the surface plate in the same manner as in Example] except that the dressing substrate 50 is gripped by an automatic robot or the suction part 54 of the dressing board 50. The apparatus 30 is capable of fully automatic polishing and dressing operations.

[Effects of the Invention] As explained above, the dressing board of the present invention is used to automate the dressing process, and thereby, the dressing board of the present invention can be used to automate the dressing process of a plurality of automatic robots.・There is no need to use ・It is possible to downsize the equipment. Furthermore, by using the dressing substrate, the dressing operation is similar to a normal polishing operation, so that the operation of the automatic robot is replaced by parts.

[Brief explanation of drawings]

Fig. 1 is a plan view showing one embodiment of the present invention, and Fig. 2 is a plan view showing an embodiment of the present invention.
3 is an explanatory diagram showing part of an automated line using the dressing substrate of the present invention; FIG. 4 is a plan view showing another embodiment of the present invention; FIG. 5 is an enlarged cross-sectional view taken along line BB- in FIG. 4, and FIG. 6 is a partial cross-sectional view of the polishing apparatus. 1050... Dressing board, 12.52... Dressing part, 14... Chucking part, 1656...
・Groove, 30... Polishing device, 31... Lower surface plate, 32°60... Carrier 33... Center axis, 34...
Automatic robot, 35...Arm, 36...Dressing substrate stand, 37...Dressing substrate, 38...Cassette for plated substrate, 3...Cassette for polished substrate, 40...Plated substrate Storage cassette supply conveyor, 41... Polished substrate storage cassette discharge conveyor, 42. Cassette discharge conveyor for polished substrates,
43...Power Cera i supply conveyor for polished substrates, 5
4... Adsorption part, 61... Workpiece, 62... Upper surface plate, 63... Lower surface plate, 64. 65... Bat. Applicant's agent Patent attorney Takehiko Suzue

Claims (1)

[Claims] A dressing substrate used in the dressing means of an automatic polishing apparatus comprising a polishing disc and a dressing means for dressing the polishing surface of the polishing disc, the dressing substrate being in contact with the polishing surface of the polishing disc to exert a dressing effect. 1. A dressing substrate comprising a dressing part having a dressing surface and a held part held by dressing means.