JPH0491176A - Heat-resistant paint - Google Patents
Heat-resistant paintInfo
- Publication number
- JPH0491176A JPH0491176A JP20768090A JP20768090A JPH0491176A JP H0491176 A JPH0491176 A JP H0491176A JP 20768090 A JP20768090 A JP 20768090A JP 20768090 A JP20768090 A JP 20768090A JP H0491176 A JPH0491176 A JP H0491176A
- Authority
- JP
- Japan
- Prior art keywords
- coating film
- polymetallocarbosilane
- heat
- parts
- pts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003973 paint Substances 0.000 title claims abstract description 15
- 229920002050 silicone resin Polymers 0.000 claims abstract description 11
- 239000011256 inorganic filler Substances 0.000 claims abstract description 9
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 9
- 229910052910 alkali metal silicate Inorganic materials 0.000 claims abstract description 8
- 239000003960 organic solvent Substances 0.000 claims abstract description 6
- 239000011248 coating agent Substances 0.000 abstract description 30
- 238000000576 coating method Methods 0.000 abstract description 30
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 abstract description 6
- 238000005260 corrosion Methods 0.000 abstract description 5
- 230000007797 corrosion Effects 0.000 abstract description 5
- PHIQPXBZDGYJOG-UHFFFAOYSA-N sodium silicate nonahydrate Chemical compound O.O.O.O.O.O.O.O.O.[Na+].[Na+].[O-][Si]([O-])=O PHIQPXBZDGYJOG-UHFFFAOYSA-N 0.000 abstract description 5
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 abstract description 3
- 235000013870 dimethyl polysiloxane Nutrition 0.000 abstract description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 abstract description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 abstract description 2
- 229910010271 silicon carbide Inorganic materials 0.000 abstract 1
- 238000002156 mixing Methods 0.000 description 7
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 239000008096 xylene Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 2
- 229920000298 Cellophane Polymers 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical group [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 239000011575 calcium Substances 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000001247 metal acetylides Chemical class 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 235000021317 phosphate Nutrition 0.000 description 2
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 2
- 229920003257 polycarbosilane Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 150000004760 silicates Chemical class 0.000 description 2
- 229910021332 silicide Inorganic materials 0.000 description 2
- FNTJSKCLWLHJTN-UHFFFAOYSA-N tetrasodium silicate hydrate Chemical compound O.[Na+].[Na+].[Na+].[Na+].[O-][Si]([O-])([O-])[O-] FNTJSKCLWLHJTN-UHFFFAOYSA-N 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 150000001642 boronic acid derivatives Chemical class 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229920006037 cross link polymer Polymers 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- PAZHGORSDKKUPI-UHFFFAOYSA-N lithium metasilicate Chemical compound [Li+].[Li+].[O-][Si]([O-])=O PAZHGORSDKKUPI-UHFFFAOYSA-N 0.000 description 1
- 229910052912 lithium silicate Inorganic materials 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 229920001558 organosilicon polymer Polymers 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 229910052913 potassium silicate Inorganic materials 0.000 description 1
- 235000019353 potassium silicate Nutrition 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000011863 silicon-based powder Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- -1 zirconium alkoxide Chemical class 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Landscapes
- Paints Or Removers (AREA)
Abstract
Description
【発明の詳細な説明】 (産業上の利用分野) 本発明は高温下での使用に耐える耐熱性塗料に関する。[Detailed description of the invention] (Industrial application field) The present invention relates to a heat-resistant paint that can withstand use at high temperatures.
(従来の技術及びその問題点)
特開昭62−54768号公報には、ポリメタロカルボ
シラン、シリコーン樹脂及び無機充填材が有機溶剤に分
散又は溶解された耐熱性塗料が開示されている。上記公
報に記載の耐熱性塗料は、空気中での焼成焼付けが可能
であり、これから得られる塗膜は耐熱性に優れると共に
良好な耐食性、耐衝撃性を示すという、利点を有してい
る。(Prior art and its problems) Japanese Patent Application Laid-Open No. 62-54768 discloses a heat-resistant paint in which polymetallocarbosilane, silicone resin, and inorganic filler are dispersed or dissolved in an organic solvent. The heat-resistant paint described in the above-mentioned publication can be baked in air, and the coating film obtained therefrom has the advantage of not only excellent heat resistance but also good corrosion resistance and impact resistance.
他方、上記公報に記載の塗料を一般的な焼成焼付は温度
である250〜450℃に加熱してポリメタロカルボシ
ランを硬化させて得られる塗膜は、鉛筆硬度が2H〜3
Hであって比較的硬度が低く、塗膜に傷が付きやすいと
いう解決すべき問題点を有している。On the other hand, the coating film obtained by curing the polymetallocarbosilane by heating the paint described in the above-mentioned publication at a temperature of 250 to 450°C, which is the temperature for general baking, has a pencil hardness of 2H to 3.
H, has a relatively low hardness, and has a problem that needs to be solved in that the coating film is easily scratched.
(問題点を解説するための技術的手段)本発明は、優れ
た耐熱性及び耐食性を有し、かつ硬度の高い塗膜を与え
ることのできる、耐熱性塗料を提供する。(Technical means for explaining the problem) The present invention provides a heat-resistant paint that has excellent heat resistance and corrosion resistance and can provide a coating film with high hardness.
本発明によれば、ポリメタロカルボシラン、シリコーン
樹脂、無機充填材、及びアルカリ金属ケイ酸塩が有機溶
剤に分散又は溶解されている耐熱性塗料が提供される。According to the present invention, a heat-resistant paint is provided in which a polymetallocarbosilane, a silicone resin, an inorganic filler, and an alkali metal silicate are dispersed or dissolved in an organic solvent.
本発明におけるポリメタロカルボシランは、それ自体公
知の有機ケイ素重合体であり、例えば、特公昭61−4
9335号公報、同62−60414号公報、同63−
37139号公報、同63−49691号公報に記載の
方法に従って調製することができる。これら公報の記載
は本明細書の一部として参照される。The polymetallocarbosilane used in the present invention is an organosilicon polymer known per se, for example, Japanese Patent Publication No. 61-4
No. 9335, No. 62-60414, No. 63-
It can be prepared according to the methods described in JP-A No. 37139 and JP-A No. 63-49691. The descriptions in these publications are incorporated herein by reference.
ポリメタロカルボシランの代表的な製法は、数平均分子
量が200〜1000のポリカルボシランとチタンある
いはジルコニウムのアルコキシドとを反応させる方法で
ある。この反応によって、ポリカルボシランが、その骨
格中のケイ素原子の一部が酸素原子を介してチタン原子
あるいはジルコニウム原子で結合された、数平均分子量
が700〜100゜000の架橋重合体であるポリメタ
ロカルボシランが得られる。A typical method for producing polymetallocarbosilane is a method in which a polycarbosilane having a number average molecular weight of 200 to 1,000 is reacted with a titanium or zirconium alkoxide. Through this reaction, polycarbosilane is a crosslinked polymer with a number average molecular weight of 700 to 100°000, in which some of the silicon atoms in its skeleton are bonded via oxygen atoms with titanium atoms or zirconium atoms. A metallocarbosilane is obtained.
上記ポリメタロカルボシランの有機溶剤溶液が宇部興産
■からチラノコートのフェスタイプとして市販されてい
る。An organic solvent solution of the above-mentioned polymetallocarbosilane is commercially available from Ube Industries Ltd. as Tyrannocoat face type.
本発明におけるシリコーン樹脂の具体例としては、ジメ
チルポリシロキサン、メチルフェニルポリシロキサン、
ジフェニルポリシロキサンなどの純シリコーン樹脂、純
シリコーン樹脂をアルキッド樹脂、ポリエステル樹脂、
アクリル樹脂、エポキシ樹脂などの変成用樹脂と反応さ
せた変成シリコーンが挙げられる。Specific examples of the silicone resin in the present invention include dimethylpolysiloxane, methylphenylpolysiloxane,
Pure silicone resins such as diphenylpolysiloxane, pure silicone resins, alkyd resins, polyester resins,
Examples include modified silicones reacted with modifying resins such as acrylic resins and epoxy resins.
シリコーン樹脂の配合割合は、ポリメタロカルボシラン
100重量部当たり、10〜900重量部、特に50〜
500重量部であることが好ましい。シリコーン樹脂の
配合割合が過度に小さいと焼付は塗膜の可撓性が低下し
、その割合が過度に高くなると焼付は塗膜の耐熱性及び
耐食性が低下する。The blending ratio of the silicone resin is 10 to 900 parts by weight, particularly 50 to 900 parts by weight, per 100 parts by weight of polymetallocarbosilane.
Preferably, it is 500 parts by weight. If the blending ratio of silicone resin is too small, the flexibility of the coating film will be reduced due to baking, and if the ratio is too high, the heat resistance and corrosion resistance of the coating film will be reduced due to baking.
本発明における無機充填材としては、酸化物、ホウ化物
、リン酸塩、ケイ酸塩(但し、アルカリ金属ケイ酸塩を
除り)、ケイ化物、ホウ化物、窒化物及び炭化物から選
ばれる少なくとも一種が使用される。その例としては、
マグネシウム、カルシウム、バリウム、チタン、ジルコ
ニウム、クロム、マンガン、鉄、コバルト、ニッケル、
銅、亜鉛、ホウ素、アルミニウム、ケイ素の酸化物、炭
化物、窒化物、ケイ化物、ホウ化物、マグネシウム、カ
ルシウムあるいは亜鉛のホウ酸塩、リン酸塩、ケイ酸塩
が挙げられる。The inorganic filler in the present invention is at least one selected from oxides, borides, phosphates, silicates (excluding alkali metal silicates), silicides, borides, nitrides, and carbides. is used. For example,
Magnesium, calcium, barium, titanium, zirconium, chromium, manganese, iron, cobalt, nickel,
Examples include oxides, carbides, nitrides, silicides and borides of copper, zinc, boron, aluminum and silicon, borates, phosphates and silicates of magnesium, calcium or zinc.
無機充填材の配合割合は、ポリメタロカルボシラン10
0重量部当たり、10〜900重量部、特に50〜50
0重量部であることが好ましい。無機充填材を配合する
ことによって、焼付は塗膜の基材に対する密着性が向上
するが、その配合割合が過度に高くなると塗膜の可撓性
が低下する。The blending ratio of the inorganic filler is polymetallocarbosilane 10
0 parts by weight, 10 to 900 parts by weight, especially 50 to 50 parts by weight
Preferably, it is 0 parts by weight. By incorporating an inorganic filler, the adhesion of the coating film to the substrate during baking is improved, but if the proportion of the inorganic filler is too high, the flexibility of the coating film decreases.
本発明におけるアルカリ金属ケイ酸塩としては、式
MHO・n5iO2・xHzO
〔式中、iはLi、 Na、 K又はNR,(Rはアル
キル基)を示し、nは0.5〜4であり、×はO〜10
である。〕で表される化合物が一般的に使用される。As the alkali metal silicate in the present invention, the formula
MHO・n5iO2・xHzO [In the formula, i represents Li, Na, K or NR, (R is an alkyl group), n is 0.5 to 4, and x is O to 10
It is. ] Compounds represented by the following are generally used.
その具体例としては、メタケイ酸ソーダ9水和物、オル
トケイ酸ソーダ水和物、メタケイ酸カリウム水和物、及
びメタケイ酸リチウム水和物が挙げられる。Specific examples thereof include sodium metasilicate nonahydrate, sodium orthosilicate hydrate, potassium metasilicate hydrate, and lithium metasilicate hydrate.
アルカリ金属ケイ酸塩の配合割合は、ポリメタロカルボ
シラン100!量部当たり、5〜100重量部、特に1
0〜50重量部であることが好ましい、アルカリ金属ケ
イ酸塩の配合割合が過度に小さいと塗装塗膜の硬度が充
分でなく、その割合を過度に高めても硬度の上昇に限度
があり、逆に塗膜の可撓性が小さくなる。The blending ratio of alkali metal silicate is polymetallocarbosilane 100! 5 to 100 parts by weight, especially 1
If the blending ratio of the alkali metal silicate, which is preferably 0 to 50 parts by weight, is too small, the hardness of the painted film will not be sufficient, and even if the ratio is increased excessively, there is a limit to the increase in hardness. On the contrary, the flexibility of the coating film decreases.
本発明における有@溶剤としては、ポリメタロカルボシ
ラン及びシリコーン樹脂の溶解能がある溶剤であればす
べて使用することができる。その具体例としては、トル
エン、キシレン、n−ブタノール、イソブタノール、酢
酸ブチル、ミネラルスピリット、ソルベントナフサ、エ
チルセロソルブ、セロソルブアセテートが挙げられる。As the @solvent in the present invention, any solvent can be used as long as it is capable of dissolving polymetallocarbosilane and silicone resin. Specific examples include toluene, xylene, n-butanol, isobutanol, butyl acetate, mineral spirit, solvent naphtha, ethyl cellosolve, and cellosolve acetate.
有@溶剤の使用割合は、塗膜形成性成分の種類及び配合
割合に応じて種々異なるが、本発明の開示に従って当業
者が適宜決定することができる。The proportion of the solvent used varies depending on the type and blending ratio of the film-forming components, but can be appropriately determined by those skilled in the art in accordance with the disclosure of the present invention.
本発明の耐熱性塗料は、金属基材、あるいはセラミック
、耐火レンガなどの非金属基材に、刷毛塗す、ロールコ
ータ、スプレー、浸漬などのそれ自体公知の手段で塗布
され、ついで乾燥され、焼付けされる。The heat-resistant paint of the present invention is applied to a metal substrate or a non-metal substrate such as ceramic or firebrick by a known method such as brush coating, roll coating, spraying, or dipping, and then dried. Burned in.
耐熱性塗料の塗布量は20〜100g/rdであること
が好ましい、塗布量が過度に小さいと塗膜にピンホール
が発生しやすくなり、耐食性が低下する。The coating amount of the heat-resistant paint is preferably 20 to 100 g/rd; if the coating amount is too small, pinholes are likely to occur in the coating film, resulting in a decrease in corrosion resistance.
他方、塗布量が過度に大きいと塗膜が高温下又は冷熱サ
イクルに曝される際に塗膜にクランクが発生しやすくな
る。On the other hand, if the coating amount is excessively large, the coating film is likely to crack when exposed to high temperatures or cold/heat cycles.
焼付は温度は150°C以上、特に200°C以上であ
ることか好ましい。焼付は温度が過度に低いと塗料成分
の一つであるポリメタロカルボシランの硬化が充分に起
こらず、塗膜の強度が低くなると共に耐衝撃性も低下す
る。尚、塗料の塗装後に被塗装物が150°C以上の使
用環境に置かれる場合には焼付は工程を省略することも
できる。The baking temperature is preferably 150°C or higher, particularly 200°C or higher. If the baking temperature is too low, the polymetallocarbosilane, which is one of the paint components, will not be sufficiently cured, resulting in a decrease in the strength of the coating film and also in its impact resistance. Incidentally, if the object to be coated is placed in a usage environment of 150° C. or higher after coating, the baking step may be omitted.
(実施例)
以下に実施例及び比較例を示す。実施例において特別の
言及がない限り、「%」及び「部」は、それぞれ、「重
量%」及び「重量部」を示す。(Example) Examples and comparative examples are shown below. Unless otherwise specified in the examples, "%" and "parts" refer to "% by weight" and "parts by weight," respectively.
塗膜の鉛筆硬度はJTS K 5400に従って測定し
た。The pencil hardness of the coating film was measured according to JTS K 5400.
また塗膜の耐熱性はつぎのようにして評価した。Furthermore, the heat resistance of the coating film was evaluated as follows.
被塗装物を1000°Cで200時間空気オーブン中に
保持した後にオーブンから取り出しで空気中で徐冷し、
ついで塗膜に1m+ピッチのクロスカットをカッターナ
イフで入れ、この部分に粘着セロファンテープを貼り付
け、それを急激に剥がした後の塗膜の剥離の有無を調べ
た。塗膜の剥離が認められないものを耐熱性「良」とし
、一部でも剥離が認められたものを耐熱性「不良」とし
た。After keeping the object to be coated in an air oven at 1000°C for 200 hours, it was taken out from the oven and slowly cooled in the air.
Next, a cross cut of 1 m + pitch was made in the coating film using a cutter knife, adhesive cellophane tape was pasted on this area, and the presence or absence of peeling of the coating film was examined after the adhesive cellophane tape was rapidly peeled off. The heat resistance was rated as "good" if no peeling of the coating film was observed, and the heat resistance was rated as "poor" if any peeling was observed.
実施例1
ポリチタノカルボシランの50%キシレン溶液(宇部興
産昧製、チラノコート■ワニスタイプ)100部、メチ
ルフェニルポリシロキサンの50%キシレン溶液(東方
シリコーン社製、TSR−116)100部、炭化ケイ
素粉末100部、メタケイ酸ソーダ9水和物30部及び
キシレン70部をミキサーにより混合して耐熱製塗料を
調製した。Example 1 100 parts of a 50% xylene solution of polytitanocarbosilane (manufactured by Ube Industries, Ltd., Tyrannocoat Varnish Type), 100 parts of a 50% xylene solution of methylphenylpolysiloxane (manufactured by Toho Silicone Co., Ltd., TSR-116), carbonized A heat-resistant paint was prepared by mixing 100 parts of silicon powder, 30 parts of sodium metasilicate nonahydrate, and 70 parts of xylene using a mixer.
これとは別に基材として厚さ0.6m+のステンレス鋼
板(sus 316L)をアセトンで脱脂した後に風乾
した。Separately, a stainless steel plate (sus 316L) with a thickness of 0.6 m+ was degreased with acetone and air-dried as a base material.
前記耐熱性塗料を基材にスプレーガンによって約30μ
−厚さに塗装し、空気オーブン中で300°Cで25分
焼成焼付けした後に徐冷した。Approximately 30μ of the heat-resistant paint is applied to the base material using a spray gun.
- It was coated to a thickness, baked in an air oven at 300°C for 25 minutes, and then slowly cooled.
形成された塗膜の鉛筆硬度が9H以上であった。The pencil hardness of the formed coating film was 9H or higher.
また、この塗膜の耐熱性は「良jであった。Furthermore, the heat resistance of this coating film was "good."
実施例2
メタケイ酸ソーダ9水和物に代えて、オルトケイ酸ソー
ダ水和物30部を使用した以外は実施例1を繰り返した
。Example 2 Example 1 was repeated except that 30 parts of sodium orthosilicate hydrate was used instead of sodium metasilicate nonahydrate.
得られた塗膜の鉛筆硬度は9H以上であり、耐熱性は「
良」であった。The pencil hardness of the resulting coating film is 9H or higher, and the heat resistance is "
It was "Good".
比較例1
メタケイ酸ソーダ9水和物を配合しなかった以外は実施
例1を繰り返した。Comparative Example 1 Example 1 was repeated except that sodium metasilicate nonahydrate was not blended.
得られた塗膜の鉛筆硬度は2Hであり、耐熱性は「良」
であった。The pencil hardness of the resulting coating film was 2H, and the heat resistance was "good".
Met.
実施例3
炭化ケイ素粉末に代えて窒化ケイ素粉末200部を使用
した以外は実施例1を繰り返した。Example 3 Example 1 was repeated except that 200 parts of silicon nitride powder was used instead of silicon carbide powder.
得られた塗膜の鉛筆硬度は9H以上であり、耐熱性は「
良」であった。The pencil hardness of the resulting coating film is 9H or higher, and the heat resistance is "
It was "Good".
実施例4
炭化ケイ素粉末に代えて酸化ジルコニウム粉末50部を
使用した以外は実施例1を繰り返した。Example 4 Example 1 was repeated except that 50 parts of zirconium oxide powder was used instead of silicon carbide powder.
得られた塗膜の鉛筆硬度は9H以上であり、耐熱性は「
良」であった。The pencil hardness of the resulting coating film is 9H or higher, and the heat resistance is "
It was "Good".
Claims (1)
、及びアルカリ金属ケイ酸塩が有機溶剤に分散又は溶解
されていることを特徴とする耐熱性塗料。A heat-resistant paint characterized in that a polymetallocarbosilane, a silicone resin, an inorganic filler, and an alkali metal silicate are dispersed or dissolved in an organic solvent.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20768090A JPH0491176A (en) | 1990-08-07 | 1990-08-07 | Heat-resistant paint |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20768090A JPH0491176A (en) | 1990-08-07 | 1990-08-07 | Heat-resistant paint |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0491176A true JPH0491176A (en) | 1992-03-24 |
Family
ID=16543795
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20768090A Pending JPH0491176A (en) | 1990-08-07 | 1990-08-07 | Heat-resistant paint |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0491176A (en) |
-
1990
- 1990-08-07 JP JP20768090A patent/JPH0491176A/en active Pending
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