JPH04100876A - Heat-resistant coating material - Google Patents
Heat-resistant coating materialInfo
- Publication number
- JPH04100876A JPH04100876A JP21804390A JP21804390A JPH04100876A JP H04100876 A JPH04100876 A JP H04100876A JP 21804390 A JP21804390 A JP 21804390A JP 21804390 A JP21804390 A JP 21804390A JP H04100876 A JPH04100876 A JP H04100876A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- coating material
- formula
- parts
- glass frit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 title abstract description 28
- 238000000576 coating method Methods 0.000 title abstract description 28
- 239000000463 material Substances 0.000 title abstract description 9
- 239000011521 glass Substances 0.000 claims abstract description 12
- 229920003257 polycarbosilane Polymers 0.000 claims abstract description 12
- 229920002050 silicone resin Polymers 0.000 claims abstract description 11
- 239000011256 inorganic filler Substances 0.000 claims abstract description 9
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 9
- 239000003960 organic solvent Substances 0.000 claims abstract description 7
- 239000003973 paint Substances 0.000 claims description 19
- 125000000217 alkyl group Chemical group 0.000 abstract description 6
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 abstract description 4
- 229920000642 polymer Polymers 0.000 abstract description 4
- 239000004205 dimethyl polysiloxane Substances 0.000 abstract description 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 abstract description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 abstract description 2
- 150000003961 organosilicon compounds Chemical class 0.000 abstract 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 11
- 239000008096 xylene Substances 0.000 description 11
- 238000002156 mixing Methods 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000005388 borosilicate glass Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000005365 phosphate glass Substances 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 239000005385 borate glass Substances 0.000 description 2
- 239000011575 calcium Substances 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 2
- 239000005355 lead glass Substances 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 150000001247 metal acetylides Chemical class 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 229920001558 organosilicon polymer Polymers 0.000 description 2
- 235000021317 phosphate Nutrition 0.000 description 2
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 2
- 229920000555 poly(dimethylsilanediyl) polymer Polymers 0.000 description 2
- 229920003203 poly(dimethylsilylene-co-phenylmethyl- silylene) polymer Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 150000004760 silicates Chemical class 0.000 description 2
- 229910021332 silicide Inorganic materials 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 150000001642 boronic acid derivatives Chemical class 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000010411 cooking Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- OSXYHAQZDCICNX-UHFFFAOYSA-N dichloro(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](Cl)(Cl)C1=CC=CC=C1 OSXYHAQZDCICNX-UHFFFAOYSA-N 0.000 description 1
- GNEPOXWQWFSSOU-UHFFFAOYSA-N dichloro-methyl-phenylsilane Chemical compound C[Si](Cl)(Cl)C1=CC=CC=C1 GNEPOXWQWFSSOU-UHFFFAOYSA-N 0.000 description 1
- UWGIJJRGSGDBFJ-UHFFFAOYSA-N dichloromethylsilane Chemical compound [SiH3]C(Cl)Cl UWGIJJRGSGDBFJ-UHFFFAOYSA-N 0.000 description 1
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000006060 molten glass Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000012260 resinous material Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical class [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Landscapes
- Paints Or Removers (AREA)
Abstract
Description
【発明の詳細な説明】 (産業上の利用分野) 本発明は高温下での使用に耐える耐熱性塗料に関する。[Detailed description of the invention] (Industrial application field) The present invention relates to a heat-resistant paint that can withstand use at high temperatures.
(従来の技術及びその問題点)
特開昭62−235370号公報には、ポリカルボシラ
ン、シリコーン樹脂及び無機充填材が有機溶剤に分散又
は溶解された耐熱性塗料が開示されている。(Prior Art and its Problems) JP-A-62-235370 discloses a heat-resistant paint in which a polycarbosilane, a silicone resin, and an inorganic filler are dispersed or dissolved in an organic solvent.
上記公報に記載の耐熱性塗料は、空気中での焼成焼付け
が可能であり、これから得られる塗膜は耐熱性に優れる
と共に良好な耐食性、耐衝撃性を示すという、利点を有
している。The heat-resistant paint described in the above-mentioned publication can be baked in air, and the coating film obtained therefrom has the advantage of not only excellent heat resistance but also good corrosion resistance and impact resistance.
他方、上記公報に記載の塗料から形成される塗膜を約5
00″C以上の温度に暴露すると、ポリカルボシランが
無機物に転化するに伴って体積収縮し、基材に達するピ
ンホールが生成することがある。On the other hand, the coating film formed from the paint described in the above publication was
When exposed to temperatures above 00''C, the polycarbosilane undergoes volumetric shrinkage as it converts to inorganic matter, and pinholes can form that reach the substrate.
この塗膜に発生するピンホールのため、腐食性のガスに
曝される用途への利用が制限されるという、解決すべき
問題点がある。The pinholes that occur in this paint film limit its use in applications where it is exposed to corrosive gases, which is a problem that needs to be solved.
(問題点を解説するための技術的手段)本発明は、優れ
た耐熱性を有し、かつ高温下においてもピンホールの発
生がないか著しく抑制される塗膜を与えることのできる
耐熱性塗料を提供する。(Technical means for explaining the problem) The present invention is a heat-resistant paint that has excellent heat resistance and can provide a coating film in which pinholes are not generated or are significantly suppressed even at high temperatures. I will provide a.
本発明によれば、ポリカルボシラン及び/又はポリカボ
シラスチレン、シリコーン樹脂、無機充填材、及び軟化
点が400〜600℃であるガラスフリットが有機溶剤
に分散又は溶解されている耐熱性塗料が提供される。According to the present invention, there is provided a heat-resistant paint in which polycarbosilane and/or polycarbosilastyrene, a silicone resin, an inorganic filler, and a glass frit having a softening point of 400 to 600°C are dispersed or dissolved in an organic solvent. be done.
本発明におけるポリカルボシランは、主として下記式C
I)で表されるカルボシラン結合単位からなる有機ケイ
素重合体である。The polycarbosilane in the present invention mainly has the following formula C
It is an organosilicon polymer consisting of carbosilane bonding units represented by I).
(式中、R’ は水素原子又はアルキル基を、R2はア
ルキル基又はフェニル基を示す。)本発明におけるポリ
カルボシラスチレンは、上記式(I]で表される結合単
位と下記式(ff)のシラスチレン結合単位から構成さ
れ、場合によっては一部架橋した結合を有する有機ケイ
素重合体である。(In the formula, R' represents a hydrogen atom or an alkyl group, and R2 represents an alkyl group or a phenyl group.) The polycarbosilastyrene of the present invention has a bonding unit represented by the above formula (I) and the following formula (ff ) is an organosilicon polymer that is composed of silastyrene bond units, and in some cases has partially crosslinked bonds.
(式中、R3及びR4は、それぞれ、水素原子、アルキ
ル基又はフェニル基を示す。)
上記のポリカルボシラスチレンは、例えば特公昭63−
39617号公報に記載の方法に従って調製することが
できる。この公報の記載は本明細書の一部として参照さ
れる。(In the formula, R3 and R4 each represent a hydrogen atom, an alkyl group, or a phenyl group.)
It can be prepared according to the method described in Japanese Patent No. 39617. The description of this publication is incorporated herein by reference.
以下の記載において、ポリカルボシラン及びポリカルボ
シラスチレンを総称してrカルボシラン重合体」という
ことがある。In the following description, polycarbosilane and polycarbosilastyrene may be collectively referred to as "rcarbosilane polymer".
本発明におけるシリコーン樹脂の具体例としては、ジメ
チルポリシロキサン、メチルフェニルポリシロキサン、
ジフェニルポリシロキサンなどの純シリコーン樹脂、純
シリコーン樹脂をアルキッド樹脂、ポリエステル樹脂、
アクリル樹脂、エポキシ樹脂などの変成用樹脂と反応さ
せた変成シリコーンが挙げられる。Specific examples of the silicone resin in the present invention include dimethylpolysiloxane, methylphenylpolysiloxane,
Pure silicone resins such as diphenylpolysiloxane, pure silicone resins, alkyd resins, polyester resins,
Examples include modified silicones reacted with modifying resins such as acrylic resins and epoxy resins.
シリコーン樹脂の配合割合は、カルボシラン重合体10
0重量部当たり、10〜900重量部、特に50〜50
0重量部であることが好ましい。シリコーン樹脂の配合
割合が過度に小さいと焼付は塗膜の可撓性が低下し、そ
の割合が過度に高くなると焼付は塗膜の耐熱性及び耐食
性が低下する。The blending ratio of silicone resin is 10 parts of carbosilane polymer.
0 parts by weight, 10 to 900 parts by weight, especially 50 to 50 parts by weight
Preferably, it is 0 parts by weight. If the blending ratio of silicone resin is too small, the flexibility of the coating film will be reduced due to baking, and if the ratio is too high, the heat resistance and corrosion resistance of the coating film will be reduced due to baking.
本発明における無機充填材としては、酸化物、ホウ化物
、リン酸塩、ケイ酸塩、ケイ化物、ホウ化物、窒化物及
び炭化物から選ばれる少なくとも一種が使用される。そ
の例としては、マグネシウム、カルシウム、バリウム、
チタン、ジルコニウム、クロム、マンガン、鉄、コバル
ト、ニッケル、銅、亜鉛、ホウ素、アルミニウム、ケイ
素の酸化物、炭化物、窒化物、ケイ化物、ホウ化物、リ
チウム、ナトリウム、カリウム、マグネシウム、カルシ
ウムあるいは亜鉛のホウ酸塩、リン酸塩、ケイ酸塩が挙
げられる。As the inorganic filler in the present invention, at least one selected from oxides, borides, phosphates, silicates, silicides, borides, nitrides, and carbides is used. Examples include magnesium, calcium, barium,
Titanium, zirconium, chromium, manganese, iron, cobalt, nickel, copper, zinc, boron, aluminum, silicon oxides, carbides, nitrides, silicides, borides, lithium, sodium, potassium, magnesium, calcium or zinc. Examples include borates, phosphates, and silicates.
無機充填材の配合割合は、カルボシラン重合体100重
量部当たり、10〜900重量部、特に50〜500重
量部であることが好ましい。無機充填材を配合すること
によって、焼付は塗膜の基材に対する密着性が向上する
が、その配合割合が過度に高くなると塗膜の可撓性が低
下する。The blending ratio of the inorganic filler is preferably 10 to 900 parts by weight, particularly 50 to 500 parts by weight, per 100 parts by weight of the carbosilane polymer. By incorporating an inorganic filler, the adhesion of the coating film to the substrate during baking is improved, but if the proportion of the inorganic filler is too high, the flexibility of the coating film decreases.
本発明における軟化点400〜600”Cのガラスフリ
フトの素材であるガラスとしては、リン酸塩ガラス、ホ
ウケイ酸ガラス、鉛ガラスなどが挙げられる。これらの
中で鉛ガラスは毒性があるので、これを含む耐熱性塗料
は例えば調理器具などの民生用途への使用を差し控える
べきである。他方、リン酸塩ガラス及びホウケイ酸ガラ
スなどは毒性がないので、民生用を含む種々の用途にす
べて使用することができる。Examples of the glass material for the glass lift in the present invention having a softening point of 400 to 600"C include phosphate glass, borosilicate glass, and lead glass. Among these, lead glass is toxic, so Heat-resistant paints containing these should be avoided for civilian applications, such as cooking utensils.On the other hand, phosphate glasses and borosilicate glasses are non-toxic and should therefore be used in all types of applications, including civilian ones. can be used.
ガラスフリットは、溶融ガラスを水中にスプレーして象
、冷する、それ自体公知の製法に従って調製することが
できる。Glass frit can be prepared according to a method known per se, in which molten glass is sprayed into water and cooled.
ガラスフリットの粒径については特別の制限はないが、
一般には2〜20μmである。There are no particular restrictions on the particle size of glass frit, but
Generally, it is 2 to 20 μm.
ガラスフリフトの配合割合は、ポリメタロカルボシラン
100重量部当たり、10〜200M量部、特に20〜
100重量部であることが好ましい。ガラスフリントの
配合割合が過度に小さいと高温下での耐薬品性、即ち腐
食性ガスに対する耐久性が充分ではなく、その割合を過
度に高めると塗膜の可撓性が低下する。The blending ratio of glass lift is 10 to 200 M parts, particularly 20 to 200 M parts, per 100 parts by weight of polymetallocarbosilane.
Preferably it is 100 parts by weight. If the blending ratio of glass flint is too small, the chemical resistance at high temperatures, that is, the durability against corrosive gases will not be sufficient, and if the ratio is increased too much, the flexibility of the coating will decrease.
ガラスフリットの軟化点が400”Cより低いと、塗装
焼付は時にガラスフリットが溶融して凝集するために塗
装塗膜の密着性が低下し、機械的強度も低下する。その
軟化点が600”Cより高いと塗膜のピンホールを防止
する効果が小さくなる。When the softening point of the glass frit is lower than 400"C, the glass frit sometimes melts and aggregates during paint baking, which reduces the adhesion of the paint film and reduces the mechanical strength.The softening point is 600"C. If it is higher than C, the effect of preventing pinholes in the coating film will be reduced.
本発明における有機溶剤としては、カルボシラン重合体
及びシリコーン樹脂の溶解能がある溶剤であればすべて
使用することができる。その具体例としては、トルエン
、キシレン、n−ブタノール、イソブタノール、酢酸ブ
チル、ミネラルスピリット、ソルベントナフサ、エチル
セロソルブ、セロソルブアセテートが挙げられる。As the organic solvent in the present invention, any solvent can be used as long as it is capable of dissolving the carbosilane polymer and silicone resin. Specific examples include toluene, xylene, n-butanol, isobutanol, butyl acetate, mineral spirit, solvent naphtha, ethyl cellosolve, and cellosolve acetate.
有機溶剤の使用割合は、塗膜形成性成分の種類及び配合
割合に応じて種々異なるが、本発明の開示に従って当業
者が適宜決定することができる。The proportion of the organic solvent to be used varies depending on the type and blending proportion of the film-forming components, and can be appropriately determined by those skilled in the art in accordance with the disclosure of the present invention.
本発明の耐熱性塗料は、金属基材、あるいはセラミック
、耐火レンガなどの非金属基材に、刷毛室す、ロールコ
ータ、スプレー、浸漬などのそれ自体公知の手段で塗布
され、ついで乾燥され、焼付けされる。The heat-resistant paint of the present invention is applied to a metal base material or a non-metal base material such as ceramic or firebrick by means known per se such as a brush coater, a roll coater, spraying, or dipping, and then dried. Burned in.
耐熱性塗料の塗布量は20〜100g/rrfであるこ
とが好ましい。塗布量が過度に小さいと塗膜にピンホー
ルが発生しやすくなり、耐食性が低下する。The amount of heat-resistant paint applied is preferably 20 to 100 g/rrf. If the coating amount is too small, pinholes are likely to occur in the coating film, resulting in decreased corrosion resistance.
他方、塗布量が過度に大きいと塗膜が高温下又は冷熱サ
イクルに曝される際に塗膜にクランクが発生しやすくな
る。On the other hand, if the coating amount is excessively large, the coating film is likely to crack when exposed to high temperatures or cold/heat cycles.
焼付は温度は150℃以上、特に200℃以上であるこ
とが好ましい。焼付は温度が過度に低いと塗料成分の一
つであるポリメタロカルボシランの硬化が充分に起こら
ず、塗膜の強度が低くなると共に耐衝撃性もが低下する
。尚、塗料の塗装後に被塗装物が150℃以上の使用環
境に置かれる場合には焼付は工程を省略することもでき
る。The baking temperature is preferably 150°C or higher, particularly 200°C or higher. If the baking temperature is too low, the polymetallocarbosilane, which is one of the paint components, will not be sufficiently cured, resulting in a decrease in the strength of the coating film and its impact resistance. Incidentally, if the object to be coated is placed in a usage environment of 150° C. or higher after coating with the paint, the baking step may be omitted.
(実施例)
以下に実施例及び比較例を示す。実施例において特別の
言及がない限り、1%」及び「部」は、それぞれ、「重
量%」及び「重量部Jを示す。(Example) Examples and comparative examples are shown below. In the examples, unless otherwise specified, "1%" and "parts" refer to "% by weight" and "parts by weight J," respectively.
塗膜の耐熱性はつぎのようにして評価した。被塗装物を
1000℃で200時間空気オーブン中に保持した後に
オーブンから取り出しで空気中で徐冷し、ついで塗膜に
1mmピッチのクロスカットをカッターナイフで入れ、
この部分に粘着セロファンテープを貼り付け、それを急
激に剥がした後の塗膜の剥離の有無を調べた。塗膜の剥
離が認められないものを耐熱性「良」とし、一部でも剥
離が認められたものを耐熱性「不良」とした。The heat resistance of the coating film was evaluated as follows. After keeping the object to be coated in an air oven at 1000°C for 200 hours, it was taken out of the oven and slowly cooled in the air, and then cross cuts with a pitch of 1 mm were made on the coating film using a cutter knife.
Adhesive cellophane tape was attached to this area, and the presence or absence of peeling of the paint film was examined after the tape was rapidly peeled off. The heat resistance was rated as "good" if no peeling of the coating film was observed, and the heat resistance was rated as "poor" if any peeling was observed.
塗膜のピンホール状剥離部生成の有無はつぎのようにし
て評価した。被塗装物を1000″Cで200時間空気
オープン中に保持した後にオーブンから取り出して徐冷
し、ついでこれに200時間塩水を噴霧し、塗膜に腐食
が生成しているかどうかを50倍の顕微鏡で観察した。The presence or absence of pinhole-like peeling portions in the coating film was evaluated as follows. After holding the object to be coated in open air for 200 hours at 1000''C, remove it from the oven and allow it to cool slowly. Then, salt water is sprayed on it for 200 hours, and whether or not corrosion has formed on the coating film is examined using a 50x microscope. I observed it.
ピンホール状の剥離のあるものには錆の発生、塗膜の膨
れが観察された。Rust formation and blistering of the paint film were observed on those with pinhole-like peeling.
参考例1(ポリカルボシランの合成)
51の三ロフラスコに無水キシレン2.51及びナトリ
ウム400 gを入れ、窒素ガス気流下でキシレンの沸
点まで加熱し、ついでジメチルジクロロシラン1!を1
時間で滴下した。滴下終了の後、10時間加熱還流し沈
澱物を生成させた。この沈澱を濾過し、まずメタノール
で洗浄した後、水で洗浄して、白色粉末のポリジメチル
シラン420gを得た。Reference Example 1 (Synthesis of polycarbosilane) 2.51 g of anhydrous xylene and 400 g of sodium were placed in a 51-meter three-hole flask and heated to the boiling point of xylene under a stream of nitrogen gas, and then 1.5 g of dimethyldichlorosilane was added. 1
It dripped in time. After the dropwise addition was completed, the mixture was heated under reflux for 10 hours to form a precipitate. This precipitate was filtered and washed first with methanol and then with water to obtain 420 g of white powder polydimethylsilane.
他方、ジフェニルジクロロシラン750 g 及びホウ
酸124gを窒素ガス雰囲気下にn−ブチルエーテル中
、100〜120℃で加熱し、生成した白色樹脂状物を
さらに真空中400℃で1時間加熱することによって、
530gのポリボロジフェニルシロキサンを得た。On the other hand, 750 g of diphenyldichlorosilane and 124 g of boric acid were heated at 100 to 120°C in n-butyl ether under a nitrogen gas atmosphere, and the resulting white resinous material was further heated in vacuum at 400°C for 1 hour.
530 g of polyborodiphenylsiloxane was obtained.
つぎに、上記のポリジメチルシラン250gに上記のポ
リボロジフェニルシロキサン8.27gを添加して混合
し、還流管を備えた21の石英管中で窒素気流下で35
0℃まで加熱し6時間重合し、シロキサン結合を一部含
むポリカルボシランを得た。Next, 8.27 g of the above polyborodiphenylsiloxane was added to 250 g of the above polydimethylsilane and mixed, and the mixture was heated under a nitrogen stream in a 21 quartz tube equipped with a reflux tube for 35 minutes.
The mixture was heated to 0° C. and polymerized for 6 hours to obtain a polycarbosilane partially containing siloxane bonds.
生成物を放冷後、キシレンを加えて溶液として取り出し
、濾過した後に、キシレンを蒸発させ、数平均分子量1
500のポリカルボシランを得た。After cooling the product, add xylene to take it out as a solution, filter it, and then evaporate the xylene to reduce the number average molecular weight to 1.
500 polycarbosilane was obtained.
参考例2(ポリカルボシラスチレンの合成)ジクロロメ
チルシラン及びジクロロメチルフェニルシランの等モル
量を、トルエン溶媒中でNa分散型触媒の存在下に、1
10℃で重合反応させて、軟化点86〜94℃のポリシ
ラスチレンを得た。Reference Example 2 (Synthesis of polycarbosilastyrene) Equimolar amounts of dichloromethylsilane and dichloromethylphenylsilane were mixed in a toluene solvent in the presence of a Na dispersed catalyst,
A polymerization reaction was carried out at 10°C to obtain polysilastyrene having a softening point of 86 to 94°C.
このポリシラスチレンを420℃で15分間減圧下で熱
処理して軟化点175〜185℃1数平均分子量450
0のポリカルボシラスチレンを得た。This polysilastyrene was heat-treated at 420°C for 15 minutes under reduced pressure to have a softening point of 175-185°C and a number average molecular weight of 450.
0 polycarbosilastyrene was obtained.
実施例1
参考例1で得られたポリカルボシランの50%キシレン
熔液100部、メチルフェニルポリシロキサンの50%
キシレン溶液(東方シリコーン社製、TSR−116)
100部、炭化ケイ素粉末100部、リン酸塩ガラ
スフリット(日本フェロ−製、01−401−4l02
部、及びキシレン50部をミキサーにより混合して耐熱
性塗料を調製した。Example 1 100 parts of 50% xylene melt of polycarbosilane obtained in Reference Example 1, 50% of methylphenylpolysiloxane
Xylene solution (manufactured by Toho Silicone Co., Ltd., TSR-116)
100 parts, silicon carbide powder 100 parts, phosphate glass frit (manufactured by Nippon Ferro, 01-401-4l02
A heat-resistant paint was prepared by mixing 50 parts of xylene and 50 parts of xylene in a mixer.
これとは別に基材として厚さ0.6amのステンレス鋼
板(SOS 316L)をアセトンで脱脂した後に風乾
した。Separately, a stainless steel plate (SOS 316L) with a thickness of 0.6 am was degreased with acetone as a base material and then air-dried.
前記耐熱性塗料を基材にスプレーガンによって約30μ
m厚さに塗装し、空気オーブン中で300℃で25分焼
成焼付けした後に徐冷した。Approximately 30μ of the heat-resistant paint is applied to the base material using a spray gun.
The film was coated to a thickness of m, baked in an air oven at 300°C for 25 minutes, and then slowly cooled.
得られた塗膜の耐熱性は「良」であり、ピンホール状の
剥離が観察されなかった。The heat resistance of the resulting coating film was "good" and no pinhole-like peeling was observed.
実施例2
ホウ酸塩ガラスフリットに代えて、ホウケイ酸塩ガラス
フリット(日本フェロ−製、12−3615 )50部
を使用した以外は実施例1を繰り返した。Example 2 Example 1 was repeated except that 50 parts of borosilicate glass frit (manufactured by Nippon Ferro, 12-3615) was used in place of the borate glass frit.
得られた塗膜の耐熱性は「良」であり、ピンホール状の
剥離が観察されなかった。The heat resistance of the resulting coating film was "good" and no pinhole-like peeling was observed.
比較例1
ホウ酸塩ガラスフリットを配合したかった以外は実施例
1を繰り返した。Comparative Example 1 Example 1 was repeated except that a borate glass frit was wanted.
得られた塗膜の耐熱性は「良」であったが、ピンホール
状の剥離が観察された。Although the heat resistance of the resulting coating film was "good", pinhole-like peeling was observed.
実施例3
ポリカルボシランのキシレン溶液に代えて、参考例2で
得られたポリカルボシラスチレンの50%キシレン溶液
100部を使用した以外は実施例1を繰り返した。Example 3 Example 1 was repeated except that 100 parts of the 50% xylene solution of polycarbosilastyrene obtained in Reference Example 2 was used instead of the xylene solution of polycarbosilane.
得られた塗膜の耐熱性は「良」であり、ピンホール状の
剥離が観察されなかった。The heat resistance of the resulting coating film was "good" and no pinhole-like peeling was observed.
Claims (1)
リコーン樹脂、無機充填材、及び軟化点が400〜60
0℃であるガラスフリットが有機溶剤に分散又は溶解さ
れていることを特徴とする耐熱性塗料。Polycarbosilane and/or polycarbosilastyrene, silicone resin, inorganic filler, and a softening point of 400 to 60
A heat-resistant paint characterized by glass frit having a temperature of 0°C dispersed or dissolved in an organic solvent.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21804390A JPH04100876A (en) | 1990-08-21 | 1990-08-21 | Heat-resistant coating material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21804390A JPH04100876A (en) | 1990-08-21 | 1990-08-21 | Heat-resistant coating material |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04100876A true JPH04100876A (en) | 1992-04-02 |
Family
ID=16713753
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21804390A Pending JPH04100876A (en) | 1990-08-21 | 1990-08-21 | Heat-resistant coating material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04100876A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5622067A (en) * | 1994-01-27 | 1997-04-22 | Sudhaus Schloss-Und Beschlagtechnik Gmbh & Co. | User-codable magnetic lock |
US5882127A (en) * | 1995-03-16 | 1999-03-16 | Rohm Co. Ltd. | Card printer and method of printing on cards using the same |
JP2005060458A (en) * | 2003-08-08 | 2005-03-10 | Tokyu Construction Co Ltd | Incombustible coating composition and method for making organic base material incombustible by using it |
-
1990
- 1990-08-21 JP JP21804390A patent/JPH04100876A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5622067A (en) * | 1994-01-27 | 1997-04-22 | Sudhaus Schloss-Und Beschlagtechnik Gmbh & Co. | User-codable magnetic lock |
US5882127A (en) * | 1995-03-16 | 1999-03-16 | Rohm Co. Ltd. | Card printer and method of printing on cards using the same |
JP2005060458A (en) * | 2003-08-08 | 2005-03-10 | Tokyu Construction Co Ltd | Incombustible coating composition and method for making organic base material incombustible by using it |
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