JPH04239076A - Heat-resistant coating composition - Google Patents
Heat-resistant coating compositionInfo
- Publication number
- JPH04239076A JPH04239076A JP6572691A JP6572691A JPH04239076A JP H04239076 A JPH04239076 A JP H04239076A JP 6572691 A JP6572691 A JP 6572691A JP 6572691 A JP6572691 A JP 6572691A JP H04239076 A JPH04239076 A JP H04239076A
- Authority
- JP
- Japan
- Prior art keywords
- inorg
- heat
- coating film
- polyborosiloxane
- filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008199 coating composition Substances 0.000 title 1
- 229920002050 silicone resin Polymers 0.000 claims abstract description 11
- 239000011256 inorganic filler Substances 0.000 claims description 22
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 22
- 239000003973 paint Substances 0.000 claims description 21
- 239000003960 organic solvent Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 abstract description 28
- 238000000576 coating method Methods 0.000 abstract description 28
- 239000000758 substrate Substances 0.000 abstract description 6
- 239000000835 fiber Substances 0.000 abstract description 5
- 239000002904 solvent Substances 0.000 abstract description 4
- 239000000945 filler Substances 0.000 abstract 5
- 239000002245 particle Substances 0.000 abstract 1
- 238000002156 mixing Methods 0.000 description 7
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 4
- 239000008096 xylene Substances 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000011575 calcium Substances 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000001247 metal acetylides Chemical class 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 235000021317 phosphate Nutrition 0.000 description 2
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 150000004760 silicates Chemical class 0.000 description 2
- 229910021332 silicide Inorganic materials 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000011449 brick Substances 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- -1 magnesium oxyhydroxide Chemical compound 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920001558 organosilicon polymer Polymers 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical class [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical class [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Landscapes
- Paints Or Removers (AREA)
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は高温下での使用に耐える
耐熱性塗料に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat-resistant paint that can withstand use at high temperatures.
【0002】0002
【従来の技術及びその問題点】特開昭57−20046
2公報には、ポリボロシロキサン、シリコーン樹脂及び
無機充填材が有機溶剤に分散又は溶解された耐熱性塗料
が開示されている。この公報に記載の耐熱性塗料は、空
気中での焼成焼付けが可能であり、これから得られる塗
膜は耐熱性に優れると共に良好な耐食性、耐衝撃性を示
すという、利点を有している。[Prior art and its problems] Japanese Patent Application Laid-Open No. 57-20046
Publication No. 2 discloses a heat-resistant paint in which polyborosiloxane, a silicone resin, and an inorganic filler are dispersed or dissolved in an organic solvent. The heat-resistant paint described in this publication can be baked in air, and the coating film obtained therefrom has the advantage of not only excellent heat resistance but also good corrosion resistance and impact resistance.
【0003】上記公報に記載されている塗料の成分であ
る無機充填材の一つの機能は、得られる塗膜の基材との
密着性を向上させることである。しかし、この塗料から
得られる塗膜を高温下、例えば800〜1000℃に長
い時間暴露すると、塗膜がピンホール状に剥離すること
があるという解決すべき問題点を有している。One of the functions of the inorganic filler, which is a component of the paint described in the above publication, is to improve the adhesion of the resulting paint film to the substrate. However, when the coating film obtained from this paint is exposed to high temperatures, for example, 800 to 1000° C. for a long time, the coating film may peel off in the form of pinholes, which is a problem that needs to be solved.
【0004】0004
【問題点を解説するための技術的手段】本発明は、優れ
た耐熱性を有し、かつ基材との密着性がより優れた塗膜
を与えることのできる、耐熱性塗料を提供する。本発明
によれば、ポリボロシロキサン、シリコーン樹脂、粒状
の無機充填材、及び短繊維状の無機充填材が有機溶剤に
分散又は溶解されている耐熱性塗料が提供される。[Technical means for explaining the problem] The present invention provides a heat-resistant paint that has excellent heat resistance and can provide a coating film with better adhesion to a substrate. According to the present invention, a heat-resistant paint is provided in which polyborosiloxane, silicone resin, granular inorganic filler, and short fibrous inorganic filler are dispersed or dissolved in an organic solvent.
【0005】本発明におけるポリボロシロキサンは公知
の有機ケイ素重合体であり、例えば特公昭58−473
2号公報に記載の方法に従って調製することができる。
ポリボロシロキサンの数平均分子量は通常500〜10
000、好ましくは1000〜5000である。The polyborosiloxane used in the present invention is a known organosilicon polymer, for example, as disclosed in Japanese Patent Publication No. 58-473.
It can be prepared according to the method described in Publication No. 2. The number average molecular weight of polyborosiloxane is usually 500 to 10
000, preferably 1000-5000.
【0006】本発明におけるシリコーン樹脂の具体例と
しては、ジメチルポリシロキサン、メチルフェニルポリ
シロキサン、ジフェニルポリシロキサンなどの純シリコ
ーン樹脂、純シリコーン樹脂をアルキッド樹脂、ポリエ
ステル樹脂、アクリル樹脂、エポキシ樹脂などの変成用
樹脂と反応させた変成シリコーンが挙げられる。Specific examples of silicone resins used in the present invention include pure silicone resins such as dimethylpolysiloxane, methylphenylpolysiloxane, and diphenylpolysiloxane, and modified pure silicone resins such as alkyd resins, polyester resins, acrylic resins, and epoxy resins. For example, modified silicone reacted with a commercially available resin.
【0007】シリコーン樹詣の配合割合は、ポリボロシ
ロキサン100重量部当たり、10〜900重量部、特
に50〜500重量部であることが好ましい。シリコー
ン樹脂の配合割合が過度に小さいと焼付け塗膜の可撓性
が低下し、その割合が過度に高くなると焼付け塗膜の耐
熱性及び耐食性が低下する。The blending ratio of silicone resin is preferably 10 to 900 parts by weight, particularly 50 to 500 parts by weight, per 100 parts by weight of polyborosiloxane. If the blending ratio of silicone resin is too small, the flexibility of the baked coating will decrease, and if the proportion is too high, the heat resistance and corrosion resistance of the baked coating will decrease.
【0008】本発明における粒状の無機充填材としては
、酸化物、ホウ化物、リン酸塩、ケイ酸塩、ケイ化物、
ホウ化物、窒化物及び炭化物から選ばれる少なくとも一
種が使用される。その例としては、マグネシウム、カル
シウム、バリウム、チタン、ジルコニウム、クロム、マ
ンガン、鉄、コバルト、ニッケル、銅、亜鉛、ホウ素、
アルミニウム、ケイ素の酸化物、炭化物、窒化物、ケイ
化物、ホウ化物、リチウム、ナトリウム、カリウム、マ
グネシウム、カルシウムあるいは亜鉛のホウ酸塩、リン
酸塩、ケイ酸塩が挙げられる。粒状の無機充填材の平均
直径は通常2〜20μmである。The granular inorganic fillers used in the present invention include oxides, borides, phosphates, silicates, silicides,
At least one selected from borides, nitrides, and carbides is used. Examples include magnesium, calcium, barium, titanium, zirconium, chromium, manganese, iron, cobalt, nickel, copper, zinc, boron,
Mention may be made of aluminum, silicon oxides, carbides, nitrides, silicides, borides, lithium, sodium, potassium, magnesium, calcium or zinc borates, phosphates and silicates. The average diameter of the granular inorganic filler is usually 2 to 20 μm.
【0009】粒状の無機充填材と併用される短繊維状の
無機充填材は、ウイスカ及チョップド繊維の両者を包含
する。短繊維状の無機充填材としてはそれ自体公知のも
のをすべて使用することができ、その例としては、チタ
ン酸カリウム、炭化ケイ素、窒化ケイ素、アルミナ、ア
ルミナ・ボリア、酸化亜鉛、オキシ水酸化マグネシウム
などのウイスカあるいチョップド繊維が挙げられる。短
繊維状の無機充填材の直径は通常0.1〜10μmであ
り、長さ/直径(l/d)は通常5〜100である。Short fiber inorganic fillers used in combination with particulate inorganic fillers include both whiskers and chopped fibers. As short fibrous inorganic fillers, all known per se can be used, examples include potassium titanate, silicon carbide, silicon nitride, alumina, alumina boria, zinc oxide, magnesium oxyhydroxide. Examples include whiskers or chopped fibers such as. The diameter of the short fibrous inorganic filler is usually 0.1 to 10 μm, and the length/diameter (l/d) is usually 5 to 100.
【0010】粒状及び短繊維状の無機充填材の合計配合
割合は、ポリボロシロキサン100重量部当たり、10
〜900重量部、特に50〜500重量部であることが
好ましい。無機充填材の合計配合割合が過度に小さいと
、塗膜の密着性が低下し、その割合が過度に高くなると
塗膜の可撓性が低下する。高温下での塗膜の剥離がない
かきわめて少ない塗膜を形成するためには、粒状の無機
充填材と短繊維状の無機充填材とを併用することが必須
である。短繊維状の無機充填材の配合割合は、無機充填
材の全量100重量部当たり、5〜75重量部である。
短繊維状の無機充填材の配合割合が過度に小さいと高温
下で塗膜が剥離しやすくなり、その割合を過度に高くす
ると、塗料自体の流動性が損なわれるようになる。The total blending ratio of granular and short fibrous inorganic fillers is 10 parts by weight per 100 parts by weight of polyborosiloxane.
It is preferably from 50 to 500 parts by weight, particularly from 50 to 500 parts by weight. If the total blending ratio of the inorganic fillers is too small, the adhesion of the coating film will be reduced, and if the ratio is too high, the flexibility of the coating film will be reduced. In order to form a coating film that exhibits no or very little peeling of the coating film at high temperatures, it is essential to use a granular inorganic filler and a short fibrous inorganic filler in combination. The blending ratio of the short fibrous inorganic filler is 5 to 75 parts by weight per 100 parts by weight of the total amount of inorganic filler. If the blending ratio of the short fibrous inorganic filler is too small, the coating film will easily peel off at high temperatures, and if the ratio is too high, the fluidity of the paint itself will be impaired.
【0011】尚、無機充填材として短繊維状の無機充填
材のみを使用することも考えられるが、塗料中で短繊維
状の無機充填材が絡み合って、結果として塗料の流動性
が低下し、塗料の塗布あるいは吹きつけが困難となる。[0011] Although it is possible to use only short fibrous inorganic fillers as the inorganic filler, the short fibrous inorganic fillers become entangled in the paint, resulting in a decrease in the fluidity of the paint. Difficult to apply or spray paint.
【0012】本発明における有機溶剤としては、ポリメ
タロカルボシラン及びシリコーン樹脂の溶解能がある溶
剤であればすべて使用することができる。その具体例と
しては、トルエン、キシレン、n−ブタノール、イソブ
タノール、酢酸ブチル、ミネラルスピリット、ソルベン
トナフサ、エチルセロソルブ、セロソルブアセテートが
挙げられる。有機溶剤の使用割合は、塗膜形成性成分の
種類及び配合割合に応じて種々異なるが、本発明の開示
に従って当業者が適宜決定することができる。As the organic solvent in the present invention, any solvent can be used as long as it is capable of dissolving polymetallocarbosilane and silicone resin. Specific examples include toluene, xylene, n-butanol, isobutanol, butyl acetate, mineral spirit, solvent naphtha, ethyl cellosolve, and cellosolve acetate. The proportion of the organic solvent to be used varies depending on the type and blending proportion of the film-forming components, and can be appropriately determined by those skilled in the art in accordance with the disclosure of the present invention.
【0013】本発明の耐熱性塗料は、金属基材、電線あ
るいはセラミック、耐火レンガなどの非金属基材に、刷
毛塗り、ロールコータ、スプレー、浸漬などのそれ自体
公知の手段で塗布され、ついで乾燥され、焼付けされる
。The heat-resistant paint of the present invention is applied to metal substrates, electric wires, or non-metallic substrates such as ceramics and refractory bricks by means known per se such as brush coating, roll coating, spraying, and dipping, and then dried and baked.
【0014】耐熱性塗料の塗布量は20〜100g/m
2であることが好ましい。塗布量が過度に小さいと塗膜
にピンホールが発生しやすくなり、耐食性が低下する。
他方、塗布量が過度に大きいと塗膜が高温下又は冷熱サ
イクルに曝される際に塗膜にクラックが発生しやすくな
る。[0014] The amount of heat-resistant paint applied is 20 to 100 g/m.
It is preferable that it is 2. If the coating amount is too small, pinholes are likely to occur in the coating film, resulting in decreased corrosion resistance. On the other hand, if the coating amount is excessively large, cracks are likely to occur in the coating film when the coating film is exposed to high temperatures or to cooling/heating cycles.
【0015】焼付け温度は150℃以上、特に200℃
以上であることが好ましい。焼付け温度が過度に低いと
塗料成分の一つであるポリメタロカルボシランの硬化が
充分に起こらず、塗膜の強度が低くなると共に耐衝撃性
もが低下する。尚、塗料の塗装後に被塗装物が150℃
以上の使用環境に置かれる場合には焼付け工程を省略す
ることもできる。[0015] The baking temperature is 150°C or higher, especially 200°C.
It is preferable that it is above. If the baking temperature is too low, polymetallocarbosilane, which is one of the paint components, will not be sufficiently cured, resulting in lower strength and impact resistance of the paint film. In addition, the temperature of the object to be coated after painting is 150℃.
When placed in the above usage environment, the baking step can be omitted.
【0016】[0016]
【実施例】以下に実施例及び比較例を示す。以下におい
て特別の言及がない限り、「%」及び「部」は、それぞ
れ、「重量%」及び「重量部」を示す。[Example] Examples and comparative examples are shown below. Unless otherwise specified below, "%" and "parts" refer to "% by weight" and "parts by weight," respectively.
【0017】また塗膜の耐熱性はつぎのようにして評価
した。被塗装物を1000℃で200時間空気オーブン
中に保持した後にオーブンから取り出しで空気中で徐冷
し、ついで塗膜に1mmピッチのクロスカットをカッタ
ーナイフで入れ、この部分に粘着セロファンテープを貼
り付け、それを急激に剥がした後の塗膜の剥離の有無を
調べた。塗膜の剥離が認められないものを耐熱性「良」
とし、一部でも剥離が認められたものを耐熱性「不良」
とした。The heat resistance of the coating film was evaluated as follows. The object to be painted was kept in an air oven at 1000°C for 200 hours, then taken out of the oven and cooled slowly in the air. Then, crosscuts with a pitch of 1 mm were made in the coating film using a cutter knife, and adhesive cellophane tape was applied to these areas. The presence or absence of peeling of the coating film was examined after the coating was applied and then rapidly peeled off. Heat resistance is "good" if no peeling of the paint film is observed.
If peeling is observed even in some areas, the heat resistance is "poor".
And so.
【0018】塗膜のピンホール状剥離部生成の有無はつ
ぎのようにして評価した。被塗装物を1000℃で20
0時間空気オーブン中に保持した後にオーブンから取り
出して徐冷し、ついでこれに200時間塩水を噴霧し、
塗膜に腐食が生成しているかどうかを50倍の顕微鏡で
観察した。ピンホール状の剥離のあるものには錆の発生
、塗膜の膨れが観察された。The presence or absence of pinhole-like peeling portions in the coating film was evaluated as follows. The object to be coated is heated to 1000℃ for 20 minutes.
After being kept in an air oven for 0 hours, it was removed from the oven and slowly cooled, and then sprayed with salt water for 200 hours.
The coating film was observed under a 50x microscope to see if corrosion had formed. Rust formation and blistering of the paint film were observed on those with pinhole-like peeling.
【0019】実施例1
特公昭58−4732号公報に記載の方法に従って調製
した数平均分子量1500のポリボリシロキサンの50
%キシレン溶液100部、メチルフェニルポリシロキサ
ンの50%キシレン溶液(東芝シリコーン社製、TSR
−116)100部、平均直径3μmの粒状炭化ケイ素
粉末100部、直径1μm、長さ50μmのチタン酸カ
リウムウイスカ20部、及びキシレン50部をミキサー
で混合して耐熱製塗料を調製した。これとは別に基材と
して厚さ0.6mmのステンレス鋼板(SUS 31
6L)をアセトンで脱脂した後に風乾した。Example 1 Polybolysiloxane with a number average molecular weight of 1500 prepared according to the method described in Japanese Patent Publication No. 58-4732.
% xylene solution, 50% xylene solution of methylphenylpolysiloxane (manufactured by Toshiba Silicone Co., Ltd., TSR
-116) 100 parts of granular silicon carbide powder with an average diameter of 3 μm, 20 parts of potassium titanate whiskers with a diameter of 1 μm and a length of 50 μm, and 50 parts of xylene were mixed in a mixer to prepare a heat-resistant paint. Apart from this, a stainless steel plate (SUS 31) with a thickness of 0.6 mm was used as a base material.
6L) was degreased with acetone and air-dried.
【0020】前記耐熱性塗料を基材にスプレーガンによ
って約30μm厚さに塗装し、空気オーブン中で300
℃で25分焼成焼付けした後に徐冷した。得られた塗膜
の耐熱性は「良」であり、ピンホール状の剥離は観察さ
れなかった。[0020] The heat-resistant paint was applied to the base material to a thickness of about 30 μm using a spray gun, and then heated in an air oven for 300 μm.
After baking at ℃ for 25 minutes, it was slowly cooled. The heat resistance of the resulting coating film was "good" and no pinhole-like peeling was observed.
【0021】実施例2
チタン酸カリウムウイスカに代えて、直径0.5μm、
長さ30μmの窒化ケイ素ウイスカを使用した以外は実
施例1を繰り返した。得られた塗膜の耐熱性は「良」で
あり、ピンホール状の剥離は観察されなかった。Example 2 Instead of potassium titanate whiskers, a diameter of 0.5 μm,
Example 1 was repeated except that silicon nitride whiskers with a length of 30 μm were used. The heat resistance of the resulting coating film was "good" and no pinhole-like peeling was observed.
【0022】比較例1
チタン酸カリウムウイスカを配合したかった以外は実施
例1を繰り返した。得られた塗膜の耐熱性は「良」であ
ったが、ピンホール状の剥離が観察された。Comparative Example 1 Example 1 was repeated except that potassium titanate whiskers were included. Although the heat resistance of the resulting coating film was "good", pinhole-like peeling was observed.
Claims (1)
状の無機充填材、及び短繊維状の無機充填材が有機溶剤
に分散又は溶解されている耐熱性塗料。1. A heat-resistant paint comprising a polyborosiloxane, a silicone resin, a granular inorganic filler, and a short fibrous inorganic filler dispersed or dissolved in an organic solvent.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6572691A JPH04239076A (en) | 1991-01-11 | 1991-01-11 | Heat-resistant coating composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6572691A JPH04239076A (en) | 1991-01-11 | 1991-01-11 | Heat-resistant coating composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04239076A true JPH04239076A (en) | 1992-08-26 |
Family
ID=13295316
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6572691A Pending JPH04239076A (en) | 1991-01-11 | 1991-01-11 | Heat-resistant coating composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04239076A (en) |
-
1991
- 1991-01-11 JP JP6572691A patent/JPH04239076A/en active Pending
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