JPH0489270A - Recording/reader - Google Patents

Abstract

PURPOSE:To achieve easy highly precise registration between a record/read element array on a wiring substrate and a rotary cylinder by a method wherein a registrating projection formed to a support component to which the wiring substrate is fixed, is brought into contact with a rotary component to establish a relative location between the rotary cylinder and the record/read element array. CONSTITUTION:A thermal head is looked at from above with a platen roller 30, and a fitting component 33 is arranged further above them. Contact surfaces 26a, 27a of registrating pieces 26, 27 of the thermal head 21 are brought into contact with a rotary shaft 29 of the platen roller 30 or a bearing or the like supporting freely rotatably the rotary shaft 29. In order to realize such contact, an arrangement location concerning a carrying direction 32 of the thermal head 21 is adjusted and thereafter, is fixed to a fitting component 33 with a fitting screw 34. The rotary shaft 29 and an axis 47 of the platen roller 30 can be located on a normal line passing a heating element array 23 of a head substrate 24. That is, registration of the axis 47 of the platen roller 30 and of the heating element array 23 of the head substrate 24 when a printer 22 is manufactured, can be easily highly precisely realized.

Description

[Detailed Description of the Invention] [Industrial Field of Application] The present invention is characterized by an improved structure that is common to both recording devices that perform thermal printing and reading devices such as contact type image sensors that read images. Record 7' relates to a reading device.

[Prior Art] Hereinafter, the prior art of the present invention will be explained in conjunction with a thermal head that performs thermal printing. FIG. 6 is a sectional view of a typical first conventional thermal head 1. As shown in FIG. Thermal head 1
In manufacturing the thermal head 1, both ends of a rotating shaft 3, which is attached concentrically to the platen roller 2, are rotatably supported in the housing of the printing apparatus in which the thermal head 1 is used. Further, a mounting bracket 4 having a predetermined positional relationship with the mounting position of the rotating shaft 3 is fixed to this housing. A positioning protrusion 9 is formed on the mounting bracket 4 at a position spaced apart from the axis 8 of the rotary shaft 3 by a predetermined distance L1 in the sub-scanning direction of the thermal head 1 (left-right direction in FIG. 6).

The head substrate 5 has a heat-generating resistor array 6 linearly formed on one surface thereof, and an end face 7a of a heat sink 7 on the opposite surface from the side on which the heat-generating resistor array 6 is formed is aligned with the axis 8 in the sub-scanning direction. It is bonded to the heat sink 7 along the distance L1. The end surface 7a of the heat sink 7 to which the head substrate 5 is adhered is attached to the mounting bracket 4.
By abutting against the positioning protrusion 9 of the head substrate 5, the rotation shaft 3 can be positioned so that the axis 8 of the rotary shaft 3 is located on the normal line passing through the heat generating resistor array 6 of the head substrate 5. That is, the platen roller 2 can be positioned in the heating resistor array 6 so as to be in contact with the head substrate 5. After this, attach the mounting bracket 4 and the heat sink 7.
and are fixed using fixing screws 10.

In such a conventional thermal head 1, when positioning the platen roller 2 and the heating resistor array 6,
It is necessary to attach the mounting bracket 4 on which the positioning protrusion 9 is formed to the housing with high positioning accuracy with respect to the platen roller 2, but it is difficult to achieve high positioning accuracy and the number of man-hours required for positioning is large. The problem is that the

FIG. 7 is a sectional view of a second conventional thermal head 1a. This conventional example is similar to the aforementioned conventional example, and corresponding parts are given the same reference numerals. In this conventional example, the mounting bracket 4 is not provided with a positioning protrusion 9 as shown in FIG.
is made to protrude, and a positioning hole 12 into which the positioning pin 11 is inserted is provided on the remaining other side. With such a configuration, it is also possible to position the platen roller 2 and the heat generating resistor array 6.

However, even in such a conventional thermal head 1a, the mounting bracket 4 is positioned with the platen roller 2 via the housing of the printing device in which the thermal head 1a is used. Therefore, in this conventional example as well, the sixth
It has the same problems as the illustrated conventional example.

FIG. 8 is a sectional view of another conventional thermal head 1b. This conventional example is similar to the above-mentioned conventional example, and corresponding parts are denoted by the same reference numerals. When positioning the row 6 and the platen roller 2,
A pair of clamping pieces 13 and 14 spaced apart from each other by a distance approximately equal to the outer diameter of the rotating shaft 3 of the platen roller 2 or a bearing that rotatably supports the rotating shaft 3, and a support surface 14 that supports the rotating shaft 3 and the like from below. A pair of positioning members 15 are used on both sides of the rotating shaft 3 in the longitudinal direction.

This positioning member 15 is fixed to both ends of the heat sink 7 in the longitudinal direction using mounting screws 16.
is placed on the mounting bracket 4 so that the rotating shaft 3 is held between the holding pieces 13 of the positioning member 15, and is fixed with the fixing screw 10. In such a conventional example, unlike each of the above-mentioned conventional examples,
The heating resistor row 6 and the platen roller 2 can be positioned easily and with high precision.

[Problems to be Solved by the Invention] However, in such a conventional example, it is necessary to attach the positioning member 15 to both ends of the heat sink 7 in the longitudinal direction using the mounting screws 16, which increases the number of parts and the number of installation steps. In addition, when fixing the positioning member 15 to the heat sink 7 prior to adhering the head substrate 5 and the heat sink 7, a plurality of heat sinks 7 may be placed adjacent to each other in the longitudinal direction, and the adhesive may be attached to the heat sinks 7. The problem is that it is not possible to employ a technique for continuously applying the agent, and therefore, a great deal of effort is required to manufacture the thermal head 1.

Furthermore, since the positioning member 15 is attached to the heat sink 7 with the mounting screws 16, there is also the problem that the number of manufacturing steps is large.

When the heat dissipation plate 7 and the positioning member 15 shown in FIG. 8 are integrally formed, for example, by press molding, the manufacturing steps are simplified, but the same problems as described above occur with adhesive application. have.

Such problems in the conventional technology are not limited to the thermal head 1 described above, but also occur in image reading devices such as contact type image sensors in which photoelectric conversion elements are formed on a wiring board. However, the present invention attempts to solve the problems common to such recording/reading devices all at once.

It is an object of the present invention to solve the above-mentioned technical problems, to easily and accurately perform positioning processing between the recording/reading element array on the wiring board and the rotary cylinder, and to A record of excellent usability that can easily accommodate changes in the diameter of parts and rotating cylinders/1! The objective is to provide a device for collecting

[Means for Solving the Problems] The present invention provides a wiring board on one surface of which recording/reading element arrays are linearly arranged and a wiring pattern formed thereon, and an adhesive bonding the other surface of the wiring board. a support member having a region and positioning protrusions at both ends, and a rotating member equipped with a rotating cylinder, and the positioning protrusion formed on the support member to which the wiring board is fixed is brought into contact with the rotating member. This recording/reading device is characterized in that the relative position between the rotary cylinder and the recording/reading element array is set by rotating the rotary cylinder.

[Function] In manufacturing the recording/reading device of the present invention, the other surface of the wiring board, on which recording/reading element arrays are formed linearly arranged on one surface, is adhered to the adhesive region of the support member. Positioning protrusions are provided protruding from both ends of the support member. Therefore, when performing the adhesive treatment, adhesive or the like can be applied while a plurality of supporting members are arranged adjacently along the arrangement direction, which simplifies the manufacturing process of such a recording/reading device. be done.

Further, with the wiring board in contact with the support member, the positioning protrusion is brought into contact with the rotating member to determine the relative position 1 between the rotating cylinder and the recording/reading element array. Thereby, the process of determining the first place can be performed easily and with high precision.

[Embodiment] FIG. 1 is a sectional view of a thermal head 21 as a recording/reading device of the present invention, and FIG. 2 is a perspective view of a printer 22 in which the thermal head 21 is used. The thermal head 21 includes a head substrate 24 formed into a rectangular flat plate from an electrically insulating material such as alumina ceramic, on one surface of which a heating resistor array 23 as a recording/reading element array is linearly arranged. . The other surface of the head substrate 24 on the side opposite to the heating resistor array 23 is attached to a heat sink 25 as a support member formed of, for example, aluminum to a thickness tl (eg, 1.6 mm). The heat dissipation plate 25 has a generally rectangular flat plate shape, and is connected to the heating resistor array 2.
3, and positioning pieces 26 and 27 are provided at both ends thereof to protrude and extend toward the head substrate 24 side.

Such a thermal head 21 faces from above a platen roller 30 fixed concentrically to two rotating shafts in a housing 28 of a printer 22, and is attached to a positioning piece 26.
．． 27 is arranged to hang downward with respect to the platen roller 30. For example, a thermal recording paper 3 is placed between the heating resistor array 23 of the head substrate 24 and the platen roller 30.
1 is placed and conveyed in the direction of arrow 32, thermal recording is performed.

This heat sink 25 is attached to a mounting member 3 mounted on the housing 28 so as to be angularly displaceable in the arrow A1 direction or the arrow A2 direction.
3, it is fixed to the mounting member 33 by a mounting screw 34 through a long hole 35 parallel to the conveying direction 32.

That is, the mounting position of the heat sink 25 can be adjusted with respect to the mounting member 33 in a direction parallel to the conveying direction 32.

3 is an enlarged perspective view of the thermal head 21 seen from above in FIG. 1, and FIG. 4 is an enlarged perspective view of the vicinity of the positioning piece 26 of the heat sink 25. The configuration of the thermal head 21 will be described in detail with reference to FIGS. 1, 3, and 4. Head substrate 2 used for thermal head 21
4 has a width W1 along the conveyance direction 32, the heat sink 25 has a mounting portion 36 having a width W2 larger than the width W1.

At the upstream end of the carrying section 36 in the conveyance direction 32, there is a stepped section 3 bent in the direction in which the positioning pieces 26 and 27 protrude by approximately the plate thickness t2 (for example, 0.7 mm) of the head substrate 24.
7 is formed, and further upstream of the step portion 37 in the conveying direction 32, a drive circuit 38 that selectively drives the heating resistor array 23 of the head substrate 24 to generate heat to perform printing and drawing is provided with print data and the like. A mounting section 40 on which a visible wiring board 39 for supplying control signals is mounted is formed. A pair of screw holes 41 into which the mounting screws 34 are screwed through the elongated holes 35 of the mounting member 33 are formed in the mounting portion 40 on both sides in the longitudinal direction. The drive circuit 38 of the head substrate 24 is covered with a protective layer 42 made of a synthetic resin material, and a head cover 43 is provided to further cover these layers.

The head board 24 and the flexible wiring board 39 are connected to the heat sink 25
It is fixed to the heat dissipation plate 25 by an adhesive or a pressure-sensitive adhesive applied to the adhesive area 44 shown in FIG. 3 above. At this time, the positioning pieces 26 and 27 are connected to the conveying direction 32 of the extension area along the direction perpendicular to the conveying direction 32 of the adhesive area 44.
A heating resistor row 23 and a positioning piece 26.2 are placed outside gR.
The arrangement position is such that the distance L2 between the contact surfaces 26a and 27a at the upstream end of the transport direction 32 of No. 7 in the transport direction 32 is the same value as the radius R of the rotating shaft 29 (3.5 to 5 mm as an example). is formed. Note that the heating resistor row 23 is formed at a distance L3 (eg, 2 to 4 mm) from the downstream end of the head substrate 24 in the conveying direction 32.

A capacitor 45, a connector 46, etc. necessary for driving the heating resistor array 23 to generate heat are mounted on the flexible wiring board 39.

When assembling the printer 22 using the thermal head 21 having such a configuration, the thermal head 21 is rotatably attached to the housing 28 at a predetermined fixed position via the two rotating shafts of the platen roller 30. Thereafter, after assembling the thermal head 21 shown in the first figure, the thermal head 21 is made to face the platen roller 30 from above as shown in FIG. Contact surface 26 of positioning piece 26, 27
a, 27a are brought into contact with two rotating shafts of the platen roller 30 or bearings (not shown) that rotatably support the two rotating shafts.

The thermal head 21 is designed to achieve such contact.
The arrangement position with respect to the conveying direction 32 is adjusted, and then it is fixed to the mounting member 33 with the mounting screw 34. As a result, the rotation axis 2 is aligned on the normal line passing through the heating resistor array 23 of the head substrate 24.
and the axis 47 of the platen roller 30 are positioned. That is, the positioning of the axis 47 of the platen roller 30 and the heating resistor array 23 of the head substrate 24 when manufacturing the printer 22 can be easily and accurately achieved.

When the diameter of the two rotating shafts or the platen roller 30 used in the printer 22 is selected from among a plurality of diameters, the width W2 of the mounting portion 36 is set in the heat sink 25 shown in the first figure. Set it wide in advance. That is, the first
In the figure, the width W2 of the loading section 36 is expanded toward the upstream side in the conveyance direction 32. With such a configuration, it is possible to further displace the head substrate 24 to the upstream side of the conveyance direction 32 than the state shown in the first drawing, and it is possible to displace the head substrate 24 further upstream in the conveying direction 32 than in the state shown in the first drawing. Even when it is used, positioning with the heating resistor array 23 can be performed easily and with high precision as described above.

Moreover, in comparison with the prior art, in this embodiment, there is no need to attach the positioning pieces 26, 27 to the heat sink 25 with, for example, screws, and the manufacturing process can be simplified. Further, as described above, the positioning pieces 26 and 27 are provided outside the extension area in the direction orthogonal to the conveyance direction 32 with respect to the adhesive area 44 on the heat sink 25. Therefore, when manufacturing the thermal head 21, a plurality of heat dissipating plates 25 are arranged adjacent to each other in the longitudinal direction when performing the adhesive treatment,
It becomes possible to apply adhesive or adhesive to the adhesive area 44 continuously.

As a result, the manufacturing process can be significantly simplified compared to the prior art referred to in FIG. 8.

Further, as shown in FIG. 4, the positioning piece 26 only needs to contact the rotating shaft 29 of the platen roller 30 in parallel to the conveying direction 32, so even if the positioning piece 26 is bent in a direction crossing the conveying direction 32, the positioning piece 26 can be fixed. The operation is not affected by this, so as a modification of the heat sink 25, a configuration as shown in FIG. 5(1) may be used. In this configuration, the positioning pieces 26 and 27 of the heat sink 25 are
It has a shape that forms an angle θ1 with the normal direction to the surface of No. 5 and expands outward in the intersecting direction.

The angle θ1 is selected to be such that when the head substrate 24 is stacked on the heat sink 25 with the head substrate 24 bonded thereto, the upper heat sink 25 does not come into contact with the head substrate 24.

With this configuration, it is possible to stack a plurality of heat dissipating plates 25 at the manufacturing stage to which the head substrate 24 is attached for storage or transportation, and in this respect as well, it is possible to contribute to the simplification of the manufacturing process.

Further, as another modification of the heat sink 25, as shown in FIG. 5(2), the heat sink 25 is
A rising portion 48.49 that rises vertically upward along the normal direction of 50.
51 and a rising portion 52.53 that rises further upward from the upper end of the stepped portion 50.51, and these may constitute the positioning pieces 26.27.

At this time, the height Hl of the rising portions 48 and 49 is selected to be larger than the thickness t1 of the head substrate 24. With the heat dissipation plate 25 having such a configuration, it is possible to not only achieve the effects related to positioning and manufacturing process described in the above-mentioned embodiments, but also achieve the effects explained with reference to FIG. 5(1). This is something that can be achieved.

Heat sink 2 having the configuration described in each of the above embodiments
By using 5, positioning accuracy when manufacturing the thermal head 21 and printer 22 can be achieved much more easily and with higher precision than with conventional techniques, and the manufacturing process can be simplified. . Furthermore, even if the diameters of the rotating shaft 29 and platen roller 30 used are changed, this can be easily accommodated.

In the embodiments described above, the present invention has been explained in terms of the thermal head 21 and the printer 22 that performs thermal printing using the thermal head 21, but the present invention is not limited to such a configuration that performs thermal printing. This method can also be applied to a device that reads images, such as a so-called contact type image sensor.

That is, the heat generating resistor array 23 on the head substrate 24 shown in the first figure is a photoelectric conversion element array manufactured using semiconductor integrated circuit technology, and the head substrate 24 has the necessary circuit wiring and integrated circuits for reading control. In the case of a configuration in which circuit elements are included, the photoelectric conversion element array reads a sheet original having an image to be read by pinching it between the platen roller 30 and the platen roller 30 .

Therefore, even in such a reading device, the positioning process of the platen roller and the photoelectric conversion element array as explained in the printer 22 is essential, and the present invention can also be implemented in such an example.

[Effects of the Invention] As described above, according to the present invention, positioning protrusions are provided protruding from both ends of the support member. Therefore, when performing the adhesion process, it is possible to apply adhesive or the like while a plurality of support members are arranged adjacently along the arrangement direction of the recording/reading element rows, which makes it possible to manufacture such recording/reading devices. The process is simplified.

Further, with the wiring board in contact with the support member, the positioning protrusion is brought into contact with the rotating member to determine the relative position of the rotating cylinder and the recording/reading element array. This results in
Positioning processing can be performed easily and with high precision.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a sectional view of a thermal head 21 according to an embodiment of the present invention, FIG. 2 is a perspective view of a printer 22, FIG. 3 is an enlarged perspective view of the thermal head 21, and FIG. 4 is thermal head 21
An enlarged perspective view of the vicinity of the positioning piece 26, FIG.
6 is a cross-sectional view of the first conventional example, Section 7 is a cross-sectional view of the second conventional example, and FIG. 8 is a cross-sectional view of the second conventional example.
FIG. 2 is a sectional view of a conventional example. 2 thermal head, 22... printer, 23 heating resistor row, 24... head board, 25... heat sink, 26
．． 27... Positioning piece, 26a 27a... Contact surface, two... Rotating shaft, 30... Platen roller, 3
3... Mounting member, 35... Long hole, 443. Adhesion area, 47 - Axis WZ Figure Figure Figure Figure

Claims (1)

[Scope of Claims] A wiring board having recording/reading element arrays linearly arranged on one surface and a wiring pattern formed thereon, and an adhesive area to which the other surface of the wiring board is adhered, and both ends thereof a support member having a positioning protrusion on a portion thereof, and a rotating member equipped with a rotary cylinder; the positioning protrusion formed on the support member to which the wiring board is fixed is brought into contact with the rotary member and recorded as the rotary cylinder; /A recording/reading device characterized in that a relative position with respect to a reading element array is set.