JPH0357656A - Thermal head - Google Patents

Thermal head

Info

Publication number
JPH0357656A
JPH0357656A JP19495389A JP19495389A JPH0357656A JP H0357656 A JPH0357656 A JP H0357656A JP 19495389 A JP19495389 A JP 19495389A JP 19495389 A JP19495389 A JP 19495389A JP H0357656 A JPH0357656 A JP H0357656A
Authority
JP
Japan
Prior art keywords
thermal head
substrate
head substrate
wiring substrate
former
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19495389A
Other languages
Japanese (ja)
Inventor
Mitsuru Fujii
Original Assignee
Nec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corp filed Critical Nec Corp
Priority to JP19495389A priority Critical patent/JPH0357656A/en
Publication of JPH0357656A publication Critical patent/JPH0357656A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To make it possible to miniaturize a thermal head device by connecting a thermal head substrate to a wiring substrate for driving a thermal element on which the former is placed together using wire bonding technique.
CONSTITUTION: A thermal head substrate 3 is bonded to a wiring substrate 2 on which the former is placed together. Then an IC chip 5 mounted on the wiring substrate 2 must be of the same thickness as the thermal head substrate 3, for example, 0.3 to 0.4mm and both are connected using wire bonding tech nique. A connecting cable is a flexible substrate and supplies a signal and power from an outside system. A heat release plate 1 has an about 5° to 7° inclination, and this inclination angle represents a gradient with a recording surface. As the surface of an IC chip 5 is almost at the same height as the surface of a thermal head substrate 3, it is possible to reduce the height of a sealing resin from the conventional 1.0mm to 0.5 to 0.6mm or half as much. In addition, as the wiring substrate 2 can be placed over the thermal head substrate 3, the overall size is reduced half or about 10mm compared to the conventional 20mm.
COPYRIGHT: (C)1991,JPO&Japio
JP19495389A 1989-07-26 1989-07-26 Thermal head Pending JPH0357656A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19495389A JPH0357656A (en) 1989-07-26 1989-07-26 Thermal head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19495389A JPH0357656A (en) 1989-07-26 1989-07-26 Thermal head

Publications (1)

Publication Number Publication Date
JPH0357656A true JPH0357656A (en) 1991-03-13

Family

ID=16333075

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19495389A Pending JPH0357656A (en) 1989-07-26 1989-07-26 Thermal head

Country Status (1)

Country Link
JP (1) JPH0357656A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0550633A (en) * 1991-08-23 1993-03-02 Tdk Corp Thermal head
WO1997006011A1 (en) 1995-08-09 1997-02-20 Rohm Co., Ltd. Thermal print head
WO1997045270A1 (en) * 1996-05-30 1997-12-04 Rohm Co., Ltd. Head device provided with drive ics, to which protective coating is applied, and method of forming protective coating
US5739837A (en) * 1994-10-03 1998-04-14 Rohm Co. Ltd. Thermal printhead, and clip-type terminal lead and cover member used therefor
EP2052866A1 (en) * 2007-10-26 2009-04-29 Brother Kogyo Kabushiki Kaisha Printing apparatus

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0550633A (en) * 1991-08-23 1993-03-02 Tdk Corp Thermal head
US5739837A (en) * 1994-10-03 1998-04-14 Rohm Co. Ltd. Thermal printhead, and clip-type terminal lead and cover member used therefor
EP0978385A2 (en) 1994-10-03 2000-02-09 Rohm Co., Ltd. Thermal printhead, and clip-type terminal lead and cover member used therefor
WO1997006011A1 (en) 1995-08-09 1997-02-20 Rohm Co., Ltd. Thermal print head
US5874983A (en) * 1995-08-09 1999-02-23 Rohm Co., Ltd. Thermal print head
WO1997045270A1 (en) * 1996-05-30 1997-12-04 Rohm Co., Ltd. Head device provided with drive ics, to which protective coating is applied, and method of forming protective coating
US6034706A (en) * 1996-05-30 2000-03-07 Rohm Co., Ltd. Head device provided with drive ICS, to which protective coating is applied, and method of forming protective coating
CN1082453C (en) * 1996-05-30 2002-04-10 罗姆股份有限公司 Head device provided with drive ics, to which protective coating is applied, and method of forming protective coating
EP2052866A1 (en) * 2007-10-26 2009-04-29 Brother Kogyo Kabushiki Kaisha Printing apparatus

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