JPS6331764A - Thermal head - Google Patents

Abstract

PURPOSE:To enable printing even on a hard recording paper or a thick recording paper, by disposing driving ICs on the outside of end parts in the array direction of a heat generating resistor array. CONSTITUTION:Heat generating resistors 4 are arrayed on the surface of a ceramic substrate 2 having a vitreous glaze layer thereon, along one longitudinal edge of the substrate 2. Driving ICs 12 are disposed on the outside of end parts in the array direction of the array of the heat generating resistors 4. Since the driving ICs 12 are not disposed along a passing-paper direction 24 in which a recording paper is passed, a paper-passing surface can be made to be a flat surface. Since a passing-paper width W in which the recording papers can be passed is the distance between both side covers 18, 18, any recording paper having a width smaller than W can be passed between the resistors 4 and a platen roller without being bent at all. Accordingly, hard recording papers or thick recording papers which are difficult to bend can be also used.

Description

DETAILED DESCRIPTION OF THE INVENTION (Technical Field) The present invention relates to a thermal head used in printers, facsimile machines, and the like. (Prior Art) An example of a conventional thermal head is shown in FIG.

The same figure (A) is a plan view, the same figure (B) is E-F of the same figure (A)
A platen roller is added to the line cross-sectional view.

2 is a heat-resistant substrate such as a ceramic substrate, the surface of which is usually covered with a glassy glaze layer. A large number of heating resistors 4 are arranged on the surface of the substrate 2 along one side of the substrate 2. The upper part of the heating resistor 4 is covered with a protective film. A common electrode 6 commonly connected to all the heat generating resistors 4 is formed on one side of the array of heat generating resistors 4, and an individual selection electrode connected to each heat generating resistor 4 is formed on the other side. 8 is formed.

A printed wiring board 10 is provided adjacent to the board 2, and a driving IC (integrated circuit device) 12 is mounted between the wiring of the printed wiring board 10 and the individual electrodes 8 of the board 2 using a tape carrier method or other mounting method. Implemented by Reference numeral 7 denotes wiring for supplying driving power to the common electrode 6. For example, a glass epoxy substrate having a conductor pattern on its surface is placed, and the conductor pattern and the common electrode 6 are soldered.

A connector 14 is provided on the printed wiring board and supplies input signals and driving power from the outside.

The substrate 2 and the printed wiring board 1o are bonded and fixed to a support plate 16.

The upper parts of the driving ICI 2 and the printed wiring board 10 are covered by a cover 18.

A platen roller 20 is provided above the heat generating resistor 4 and presses the recording paper 22 passing between the heat generating resistor 4 and the platen roller 20 toward the heat generating resistor 4.

In a conventional thermal head, the driving ICI 2 is generally arranged on one side or both sides of the array of heating resistors 4, as typified by FIG. The recording paper 22 is arranged as indicated by arrow 24 in FIG.

It is sent in a direction perpendicular to the arrangement direction of the heating resistors 4. Therefore, the recording paper 22 is attached to the cover 18 on the drive ICI 2.
In order to avoid contact with the paper, the paper is inserted between the heating resistor 4 and the platen roller 20 while being bent.

Therefore, there is a problem in that conventional thermal heads cannot print on hard or thick recording paper.

(Objective) An object of the present invention is to provide a thermal head capable of printing even on hard or thick recording paper.

(Structure) The thermal head of the present invention is characterized in that the driving IC is disposed outside the ends of the heat generating resistor array in the arrangement direction.

Examples will be specifically described below.

FIG. 1 represents one embodiment of the invention. Figure 2 shows the same embodiment with a cover on, and Figure 2 (A)
is a plan view, and FIG. 3(B) is a sectional view taken along the line AB of FIG.

On the surface of a ceramic substrate 2 having a glassy glaze layer on its surface, heating resistors 4 are arranged along one longitudinal side of the substrate 2. Printed wiring boards 10.10 are arranged on both end sides of the board 2. The substrate 2 and the printed wiring board 10.10 are both glued and fixed onto the support plate 16.

The driving ICIs 2 are arranged on both sides of the array of the heating resistors 4 outside the ends in the array direction. Common @pole 6 on one side and selective electrode 8 on the other side of the array of heating resistors 4
are formed by patterning a conductor layer formed on the surface of the mackerel plate 2 using phosphorography technology.

The driving ICI 2 is mounted by a tape carrier method or other mounting method so as to be connected between the wiring of the printed wiring board 10 and the selection electrode 80. 14 is a connector, and 18 is a cover.

In this embodiment, since the driving ICI 2 is not arranged on the paper passing direction 24 through which the recording paper passes, the paper passing surface through which the recording paper passes can be made into a flat surface. The paper passing width W through which the recording paper passes is determined by the cover 1 on both sides as shown in FIG. 2(B).
Since the distance is 8.18, if the recording paper is narrower than this width, it can pass between the heating resistor 4 and the platen roller without bending the recording paper at all.

FIG. 3 shows another embodiment of the present invention, in which FIG. 3(A) is a plan view and FIG. 3(B) is a sectional view taken along line CD in FIG. 3(A).

Comparing this embodiment with the embodiment shown in FIG. 1, it is found that in the embodiment shown in FIG. On the other hand, the embodiment shown in FIG. 3 is different in that the driving ICI 2 is disposed outside one end of the arrangement direction of the heating resistors 4.

Other structures are similar to those in FIG.

(Effects) In the thermal head of the present invention, since the driving IC is arranged outside the end of the heating resistor array in the arrangement direction, the path through which the recording paper passes becomes flat, making it possible to bend the recording paper normally. This makes it possible to use not only paper that is possible but also hard paper that is difficult to bend or thick paper that is difficult to bend.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing one embodiment of the present invention (however, the cover is omitted), FIG. 2 (A) is a plan view showing the same implementation,
Figure CB) is a sectional view taken along the line CD in Figure (A). Fourth
Figure (A) is a plan view showing an example of a conventional thermal head;
The same figure (B) is a sectional view taken along the line EF of the same figure (A). 2...Substrate, 4...Heating resistor. 12... IC0 for drive circuit ・Agent: Patent attorney Shigeo Noguchi

Claims (1)

[Claims] (1) A thermal head equipped with a driving IC for driving a heating resistor, characterized in that the driving IC is disposed outside the end of the heating resistor array in the arrangement direction.