JPH0488045U - - Google Patents

Info

Publication number
JPH0488045U
JPH0488045U JP40083490U JP40083490U JPH0488045U JP H0488045 U JPH0488045 U JP H0488045U JP 40083490 U JP40083490 U JP 40083490U JP 40083490 U JP40083490 U JP 40083490U JP H0488045 U JPH0488045 U JP H0488045U
Authority
JP
Japan
Prior art keywords
actuating device
pressure ring
engine
ring
inertia ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP40083490U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP40083490U priority Critical patent/JPH0488045U/ja
Publication of JPH0488045U publication Critical patent/JPH0488045U/ja
Pending legal-status Critical Current

Links

JP40083490U 1990-12-18 1990-12-18 Pending JPH0488045U (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP40083490U JPH0488045U (cs) 1990-12-18 1990-12-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP40083490U JPH0488045U (cs) 1990-12-18 1990-12-18

Publications (1)

Publication Number Publication Date
JPH0488045U true JPH0488045U (cs) 1992-07-30

Family

ID=31879016

Family Applications (1)

Application Number Title Priority Date Filing Date
JP40083490U Pending JPH0488045U (cs) 1990-12-18 1990-12-18

Country Status (1)

Country Link
JP (1) JPH0488045U (cs)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002057209A (ja) * 2000-06-01 2002-02-22 Tokyo Electron Ltd 枚葉式処理装置および枚葉式処理方法
JP2013102126A (ja) * 2011-10-14 2013-05-23 Fuji Electric Co Ltd 半導体装置の製造方法および半導体装置の製造装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6099538A (ja) * 1983-11-01 1985-06-03 横河・ヒュ−レット・パッカ−ド株式会社 ピンチヤツク
JPS60184218A (ja) * 1984-03-01 1985-09-19 Fujikura Ltd 光フアイバ心線
JPS6245378A (ja) * 1985-08-23 1987-02-27 Hitachi Ltd 塗布装置
JPS6261152A (ja) * 1985-09-12 1987-03-17 Fujitsu Ltd 複数メデイア書式制御方式
JPS6393536A (ja) * 1986-10-08 1988-04-23 Nikon Corp 基板保持装置
JPH02290013A (ja) * 1989-04-28 1990-11-29 Tokyo Electron Ltd 温度処理方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6099538A (ja) * 1983-11-01 1985-06-03 横河・ヒュ−レット・パッカ−ド株式会社 ピンチヤツク
JPS60184218A (ja) * 1984-03-01 1985-09-19 Fujikura Ltd 光フアイバ心線
JPS6245378A (ja) * 1985-08-23 1987-02-27 Hitachi Ltd 塗布装置
JPS6261152A (ja) * 1985-09-12 1987-03-17 Fujitsu Ltd 複数メデイア書式制御方式
JPS6393536A (ja) * 1986-10-08 1988-04-23 Nikon Corp 基板保持装置
JPH02290013A (ja) * 1989-04-28 1990-11-29 Tokyo Electron Ltd 温度処理方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002057209A (ja) * 2000-06-01 2002-02-22 Tokyo Electron Ltd 枚葉式処理装置および枚葉式処理方法
JP2013102126A (ja) * 2011-10-14 2013-05-23 Fuji Electric Co Ltd 半導体装置の製造方法および半導体装置の製造装置
US9711383B2 (en) 2011-10-14 2017-07-18 Fuji Electric Co., Ltd. Fabrication method of semiconductor devices and fabrication system of semiconductor devices

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Legal Events

Date Code Title Description
A02 Decision of refusal

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Effective date: 19970805