JPH0486303U - - Google Patents
Info
- Publication number
- JPH0486303U JPH0486303U JP12964990U JP12964990U JPH0486303U JP H0486303 U JPH0486303 U JP H0486303U JP 12964990 U JP12964990 U JP 12964990U JP 12964990 U JP12964990 U JP 12964990U JP H0486303 U JPH0486303 U JP H0486303U
- Authority
- JP
- Japan
- Prior art keywords
- case
- electronic component
- fixed
- grounding part
- component element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims 1
- 238000003466 welding Methods 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
Description
第１図ないし第３図は本考案の一実施例による
一体成形型誘電体フイルタの接合構造を説明する
ための図であり、第１図はその斜視図、第２図は
その一部拡大断面図、第３図は誘電体ブロツクの
断面図、第４図は他の実施例によるデイスクリー
ト型誘電体フイルタを示す分解斜視図、第５図は
従来の接合構造を説明するための誘電体フイルタ
を示す斜視図である。
図において、１は一体成形型誘電体フイルタ（
電子部品）、２はアースケース、３は誘電体ブロ
ツク（電子部品素子）、６は外導電膜（アース部
）、２０はデイスクリート型誘電体フイルタ（電
子部品）、２３はケース、２４は誘電体同軸共振
器（電子部品素子）である。
1 to 3 are views for explaining the joint structure of an integrally molded dielectric filter according to an embodiment of the present invention, FIG. 1 is a perspective view thereof, and FIG. 2 is a partially enlarged cross-sectional view thereof. 3 is a sectional view of a dielectric block, FIG. 4 is an exploded perspective view showing a discrete dielectric filter according to another embodiment, and FIG. 5 is a dielectric filter for explaining a conventional junction structure. FIG. In the figure, 1 is an integrally molded dielectric filter (
2 is a ground case, 3 is a dielectric block (electronic component element), 6 is an outer conductive film (earth part), 20 is a discrete dielectric filter (electronic component), 23 is a case, 24 is a dielectric It is a body coaxial resonator (electronic component element).
Claims (1)
ース部と、上記ケースとを電気的、機械的に接続
固定するようにした電子部品の接合構造において
、上記アース部とケースとを溶接により接続固定
したことを特徴とする電子部品の接合構造。 In an electronic component joining structure in which the grounding part of an electronic component element housed in a metal case is electrically and mechanically connected and fixed to the case, the grounding part and the case are connected and fixed by welding. A bonding structure for electronic components characterized by the following.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12964990U JPH0486303U (en) | 1990-11-30 | 1990-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12964990U JPH0486303U (en) | 1990-11-30 | 1990-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0486303U true JPH0486303U (en) | 1992-07-27 |
Family
ID=31877041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12964990U Pending JPH0486303U (en) | 1990-11-30 | 1990-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0486303U (en) |
-
1990
- 1990-11-30 JP JP12964990U patent/JPH0486303U/ja active Pending