JPH0485754U - - Google Patents
Info
- Publication number
- JPH0485754U JPH0485754U JP12876490U JP12876490U JPH0485754U JP H0485754 U JPH0485754 U JP H0485754U JP 12876490 U JP12876490 U JP 12876490U JP 12876490 U JP12876490 U JP 12876490U JP H0485754 U JPH0485754 U JP H0485754U
- Authority
- JP
- Japan
- Prior art keywords
- light
- lead frame
- side lead
- emitting element
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 238000000465 moulding Methods 0.000 claims 4
- 239000000654 additive Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 229920002379 silicone rubber Polymers 0.000 description 2
- 235000002245 Penicillium camembertii Nutrition 0.000 description 1
Description
第１図は本考案の一実施例の断面図、第２図は
従来例の断面図である。
１……入力側リードフレーム、２……発光素子
、３……出力側リードフレーム、４……受光素子
、５……ドーム形状シリコンゴム、６……凹形状
シリコンゴム、７ａ……乳白色モールド樹脂、８
……黒色モールド樹脂。
FIG. 1 is a sectional view of an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional example. DESCRIPTION OF SYMBOLS 1... Input side lead frame, 2... Light emitting element, 3... Output side lead frame, 4... Light receiving element, 5... Dome-shaped silicon rubber, 6... Concave silicon rubber, 7a... Milky white mold resin , 8
...Black mold resin.
Claims (1)
ムと、前記入力側リードフレーム上に設置された
発光素子と、前記出力側リードフレーム上に前記
発光素子と対向するよう設置された受光素子と、
前記発光素子を覆うよう形成されたドーム形状の
第１の透明樹脂と、前記受光素子を覆つて前記第
１の透明樹脂と対向しかつ上面が凹状にされたド
ーム形状の第２の透明樹脂と、熱膨張の調整と強
度を上げるための添加剤が添加され前記発光素子
、受光素子、第１および第２の透明樹脂をモール
ドする光透過性モールド樹脂と、該光透過性モー
ルド樹脂をモールドする遮光性モールド樹脂とを
備えたことを特徴とする光結合半導体装置。 an input side lead frame, an output side lead frame, a light emitting element installed on the input side lead frame, a light receiving element installed on the output side lead frame so as to face the light emitting element,
a dome-shaped first transparent resin formed to cover the light-emitting element; and a dome-shaped second transparent resin that covers the light-receiving element, faces the first transparent resin, and has a concave upper surface. , a light-transmissive molding resin to which additives are added for adjusting thermal expansion and increasing strength, and molding the light-emitting element, the light-receiving element, and the first and second transparent resins; and molding the light-transmissive molding resin. 1. An optically coupled semiconductor device comprising: a light-shielding mold resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12876490U JPH0485754U (en) | 1990-11-29 | 1990-11-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12876490U JPH0485754U (en) | 1990-11-29 | 1990-11-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0485754U true JPH0485754U (en) | 1992-07-24 |
Family
ID=31876207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12876490U Pending JPH0485754U (en) | 1990-11-29 | 1990-11-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0485754U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5081485A (en) * | 1973-11-17 | 1975-07-02 | ||
| JPH02105471A (en) * | 1988-10-13 | 1990-04-18 | Nec Corp | Optical coupling semiconductor device |
-
1990
- 1990-11-29 JP JP12876490U patent/JPH0485754U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5081485A (en) * | 1973-11-17 | 1975-07-02 | ||
| JPH02105471A (en) * | 1988-10-13 | 1990-04-18 | Nec Corp | Optical coupling semiconductor device |