JPH0485731U - - Google Patents
Info
- Publication number
- JPH0485731U JPH0485731U JP12641090U JP12641090U JPH0485731U JP H0485731 U JPH0485731 U JP H0485731U JP 12641090 U JP12641090 U JP 12641090U JP 12641090 U JP12641090 U JP 12641090U JP H0485731 U JPH0485731 U JP H0485731U
- Authority
- JP
- Japan
- Prior art keywords
- flat plate
- wafer
- semiconductor wafer
- processing
- suction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12641090U JPH0485731U (de) | 1990-11-30 | 1990-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12641090U JPH0485731U (de) | 1990-11-30 | 1990-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0485731U true JPH0485731U (de) | 1992-07-24 |
Family
ID=31873969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12641090U Pending JPH0485731U (de) | 1990-11-30 | 1990-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0485731U (de) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000349050A (ja) * | 1999-06-09 | 2000-12-15 | Disco Abrasive Syst Ltd | 被加工物の切削方法及び切削装置 |
| JP2014045144A (ja) * | 2012-08-28 | 2014-03-13 | Fujitsu Semiconductor Ltd | ダイシング方法及びダイシング装置 |
-
1990
- 1990-11-30 JP JP12641090U patent/JPH0485731U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000349050A (ja) * | 1999-06-09 | 2000-12-15 | Disco Abrasive Syst Ltd | 被加工物の切削方法及び切削装置 |
| JP2014045144A (ja) * | 2012-08-28 | 2014-03-13 | Fujitsu Semiconductor Ltd | ダイシング方法及びダイシング装置 |