JPS6450428U - - Google Patents
Info
- Publication number
- JPS6450428U JPS6450428U JP14591987U JP14591987U JPS6450428U JP S6450428 U JPS6450428 U JP S6450428U JP 14591987 U JP14591987 U JP 14591987U JP 14591987 U JP14591987 U JP 14591987U JP S6450428 U JPS6450428 U JP S6450428U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- thickness
- center
- utility
- curved surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
Landscapes
- Materials For Photolithography (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14591987U JPS6450428U (de) | 1987-09-24 | 1987-09-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14591987U JPS6450428U (de) | 1987-09-24 | 1987-09-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6450428U true JPS6450428U (de) | 1989-03-29 |
Family
ID=31414933
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14591987U Pending JPS6450428U (de) | 1987-09-24 | 1987-09-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6450428U (de) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0496247A (ja) * | 1990-08-03 | 1992-03-27 | Shin Etsu Handotai Co Ltd | エピタキシャル成長用半導体ウェーハ、およびその製造方法 |
| WO2003107402A1 (ja) * | 2002-06-13 | 2003-12-24 | 信越半導体株式会社 | 半導体ウエーハ |
-
1987
- 1987-09-24 JP JP14591987U patent/JPS6450428U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0496247A (ja) * | 1990-08-03 | 1992-03-27 | Shin Etsu Handotai Co Ltd | エピタキシャル成長用半導体ウェーハ、およびその製造方法 |
| WO2003107402A1 (ja) * | 2002-06-13 | 2003-12-24 | 信越半導体株式会社 | 半導体ウエーハ |