JPH0483474U - - Google Patents

Info

Publication number
JPH0483474U
JPH0483474U JP12647390U JP12647390U JPH0483474U JP H0483474 U JPH0483474 U JP H0483474U JP 12647390 U JP12647390 U JP 12647390U JP 12647390 U JP12647390 U JP 12647390U JP H0483474 U JPH0483474 U JP H0483474U
Authority
JP
Japan
Prior art keywords
solder
chamber
solder bath
soldering
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12647390U
Other languages
English (en)
Other versions
JPH0641723Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990126473U priority Critical patent/JPH0641723Y2/ja
Publication of JPH0483474U publication Critical patent/JPH0483474U/ja
Application granted granted Critical
Publication of JPH0641723Y2 publication Critical patent/JPH0641723Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【図面の簡単な説明】
第１図ａ，ｂはこの考案の一実施例を示すもの
で、第１図ａは側面図、第１図ｂは、第１図ａの
−線による断面図、第２図は従来のはんだ付
け装置の概略を示す側面図である。 図中、３はプリント基板、４は搬送チエーン、
９ははんだ槽、１０ははんだ融液、２１ははんだ
付け装置、２２チヤンバ、２５は開口部、２６は
枠体、２６ａは下方部分、３１は取付足、３２は
ねじ部、３３は車輪である。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) プリント基板を搬送チエーンで搬送し、は
    んだ槽内のはんだ融液によつて前記プリント基板
    にはんだ付けを行うはんだ付け装置において、前
    記はんだ付け装置の全体を覆うチヤンバを設け、
    このチヤンバに前記はんだ槽が設置されている部
    分に開口部を形成し、この開口部に前記はんだ槽
    内のはんだ融液にその周縁部の下方部分を浸浸さ
    せる枠体を設けたことを特徴とするはんだ付け装
    置。 (2) 請求項(1)に記載のはんだ付け装置において
    、前記はんだ槽を下降させることにより前記枠体
    が前記はんだ融液から露出する昇降手段を設けた
    ものであるはんだ付け装置。
JP1990126473U 1990-11-30 1990-11-30 はんだ付け装置 Expired - Lifetime JPH0641723Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990126473U JPH0641723Y2 (ja) 1990-11-30 1990-11-30 はんだ付け装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990126473U JPH0641723Y2 (ja) 1990-11-30 1990-11-30 はんだ付け装置

Publications (2)

Publication Number Publication Date
JPH0483474U true JPH0483474U (ja) 1992-07-21
JPH0641723Y2 JPH0641723Y2 (ja) 1994-11-02

Family

ID=31874029

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990126473U Expired - Lifetime JPH0641723Y2 (ja) 1990-11-30 1990-11-30 はんだ付け装置

Country Status (1)

Country Link
JP (1) JPH0641723Y2 (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0244932U (ja) * 1988-09-19 1990-03-28
US4921156A (en) * 1987-11-05 1990-05-01 Ernst Hohnerlein Soldering apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4921156A (en) * 1987-11-05 1990-05-01 Ernst Hohnerlein Soldering apparatus
JPH02303675A (ja) * 1987-11-05 1990-12-17 Honelrein Ernst はんだ付け装置
JPH0244932U (ja) * 1988-09-19 1990-03-28

Also Published As

Publication number Publication date
JPH0641723Y2 (ja) 1994-11-02

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term