JPH048182B2 - - Google Patents
Info
- Publication number
- JPH048182B2 JPH048182B2 JP12684483A JP12684483A JPH048182B2 JP H048182 B2 JPH048182 B2 JP H048182B2 JP 12684483 A JP12684483 A JP 12684483A JP 12684483 A JP12684483 A JP 12684483A JP H048182 B2 JPH048182 B2 JP H048182B2
- Authority
- JP
- Japan
- Prior art keywords
- sandblasting
- pattern
- resin composition
- weight
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011342 resin composition Substances 0.000 claims description 26
- 238000005488 sandblasting Methods 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 23
- 238000005530 etching Methods 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 7
- 238000005507 spraying Methods 0.000 claims description 6
- 239000011521 glass Substances 0.000 description 10
- 239000000758 substrate Substances 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 4
- 229910052753 mercury Inorganic materials 0.000 description 4
- 239000002023 wood Substances 0.000 description 4
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000000016 photochemical curing Methods 0.000 description 3
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 3
- -1 polyethylene adipate Polymers 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 150000003673 urethanes Chemical class 0.000 description 3
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 150000002009 diols Chemical class 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910001507 metal halide Inorganic materials 0.000 description 2
- 150000005309 metal halides Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- 229910052724 xenon Inorganic materials 0.000 description 2
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 2
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 1
- DZZAHLOABNWIFA-UHFFFAOYSA-N 2-butoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCCCC)C(=O)C1=CC=CC=C1 DZZAHLOABNWIFA-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical group C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 239000011951 cationic catalyst Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M methacrylate group Chemical group C(C(=C)C)(=O)[O-] CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 150000004291 polyenes Chemical class 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000921 polyethylene adipate Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 229920006295 polythiol Polymers 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
- B24C1/04—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for treating only selected parts of a surface, e.g. for carving stone or glass
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
Description
【発明の詳細な説明】
本発明はサンドブラストにより、ガラス製品や
木工製品などに段彫のある彫刻模様を形成する方
法に関し、さらに詳しくいえば、基板上に少なく
とも２種の耐サンドブラスト性の異なる硬化した
樹脂のパターンを形成させたのち、該パターンの
上からサンドブラストを吹き付けて食刻する方法
に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for forming stepped carved patterns on glass products, wood products, etc. by sandblasting. The present invention relates to a method of forming a resin pattern, and then etching the pattern by spraying sandblasting over the pattern.
従来、ガラス製品や木工製品の表面に所望の絵
柄や文字を食刻するには、これらの表面に耐サン
ドブラスト材料により所望の絵柄や文字に対応す
るパターンを形成させ、サンドブラストを吹き付
けて食刻する方法が行われている。 Conventionally, in order to engrave a desired pattern or text on the surface of a glass product or wood product, a pattern corresponding to the desired pattern or text is formed on the surface using a sandblasting-resistant material, and then the pattern is etched by sandblasting. method is being done.
ところで、最近の高級化志向や個性化志向に伴
い、段彫法による立体感の優れた食刻模様に対す
る要望が高まつてきている。この段彫法は、精密
でありかつ再現性がよく、その上コストが低いこ
とが必要であつて、従来(1)サンドブラストの操作
条件、例えばサンドブラスト吹き付ける圧力や時
間などを変える方法、(2)パターンを形成したフイ
ルム状の耐サンドブラスト材を基板表面上に貼り
付け、サンドブラストを吹き付けて第１回目の食
刻をしたのち、さらに別のサンドブラスト材を貼
り替えて第２回目の食刻を行い、必要ならばこの
操作を繰り返して段彫のある食刻模様を得る方法
がとられている。 By the way, with the recent trend towards luxury and individualization, there is an increasing demand for etched patterns with excellent three-dimensionality created by the step engraving method. This step engraving method requires precision, good reproducibility, and low cost. Conventional methods include (1) changing the operating conditions of sandblasting, such as sandblasting pressure and time, and (2) A film-like sandblasting resistant material with a pattern formed thereon is pasted onto the substrate surface, sandblasting is applied to the substrate for first etching, and then another sandblasting material is pasted and a second etching is performed. If necessary, this operation is repeated to obtain an etched pattern with steps.
しかしながら、(1)の方法においては精度の良い
再現性が得られず、また(2)の方法においては同じ
プロセスを繰り返す必要があつて、極めてわずら
わしいという欠点がある。 However, method (1) does not provide highly accurate reproducibility, and method (2) requires repeating the same process, which is extremely troublesome.
本発明者らは、このような事情に鑑み、精密で
あつて再現性がよく、かつ生産性が高く、コスト
の低いサンドブラストによる段彫のある彫刻法を
提供すべく鋭意研究を重ねた結果、耐サンドブラ
スト性の異なる少なくとも２種の硬化した樹脂の
パターンを形成し、１回のサンドブラストの吹き
付けで食刻することにより、その目的を達成しう
ることを見出し、この知見に基づいて本発明を完
成するに至つた。 In view of these circumstances, the inventors of the present invention have conducted extensive research to provide a step-carved engraving method using sandblasting that is precise, has good reproducibility, is highly productive, and is low in cost. It was discovered that the objective could be achieved by forming patterns of at least two types of hardened resins with different sandblasting resistance and etching them with a single sandblasting blast, and based on this knowledge, the present invention was completed. I came to the conclusion.
すなわち、本発明は、基材表面に、未硬化状態
の少なくとも２種の硬化性樹脂組成物により所定
のパターンを形成させ、次いでこれを硬化処理し
て部分的に耐サンドブラスト性が異なる硬化した
樹脂パターンを形成させたのち、該パターンの上
からサンドブラストを吹き付けて食刻することを
特徴とするサンドブラストによる彫刻法を提供す
るものである。 That is, the present invention forms a predetermined pattern on the surface of a base material using at least two types of curable resin compositions in an uncured state, and then cures this to form cured resins having partially different sandblasting resistance. The present invention provides an engraving method using sandblasting, which is characterized in that after a pattern is formed, sandblasting is applied onto the pattern for etching.
本発明方法において基材表面に、未硬化状態の
硬化性樹脂組成物により所定のパターンを形成す
る方法として、スクリーン印刷法、グラビア印刷
法、型紙を用いる吹き付け塗布法など任意の方法
を用いることができる。これらの方法において共
通していることは厚膜を形成しうることである。
また、これらの方法のなかで特に好ましいものは
スクリーン印刷法である。 In the method of the present invention, any method can be used to form a predetermined pattern on the surface of the substrate using the curable resin composition in an uncured state, such as screen printing, gravure printing, and spray coating using a paper pattern. can. What these methods have in common is that they can form thick films.
Among these methods, screen printing is particularly preferred.
本発明方法においては、前記の方法によつて、
未硬化状態の耐サンドブラスト性の異なる少なく
とも２種の硬化性樹脂組成物を形成させ、次いで
硬化処理することによつて、耐サンドブラスト性
の異なる少なくとも２種の硬化した樹脂パターン
を形成させる。 In the method of the present invention, by the method described above,
At least two types of curable resin compositions having different sandblasting resistance are formed in an uncured state, and then a curing treatment is performed to form at least two types of cured resin patterns having different sandblasting resistance.
本発明方法において用いる前記の硬化性樹脂組
成物としては、光硬化性樹脂組成物と熱硬化性樹
脂組成物があるが、好ましくは光硬化性樹脂組成
物である。 The curable resin composition used in the method of the present invention includes a photocurable resin composition and a thermosetting resin composition, and preferably a photocurable resin composition.
この光硬化性樹脂組成物としては、例えば、(1)
末端にアクリレート基又はメタクリレート基をも
つウレタンプレポリマー、不飽和モノマー及び光
重合開始剤を光硬化成分とするもの、
(2) 多官能アクリレート型不飽和化合物とアミン
との付加反応により得られるプレポリマー、不
飽和モノマー及び光重合開始剤を光硬化成分と
するもの、
(3) 多官能エポキシ樹脂、単官能エポキシ化合物
及び光開始カチオン触媒を光硬化成分とするも
の、
(4) ポリエン、ポリチオール及び光重合開始剤を
光硬化成分とするもの
などの光硬化性樹脂組成物を挙げることができ
る。 As this photocurable resin composition, for example, (1)
Urethane prepolymers with acrylate or methacrylate groups at the ends, those containing unsaturated monomers and photopolymerization initiators as photocuring components, (2) Prepolymers obtained by addition reaction of polyfunctional acrylate-type unsaturated compounds and amines. (3) Products containing polyfunctional epoxy resins, monofunctional epoxy compounds, and photoinitiated cationic catalysts as photocuring components; (4) Polyenes, polythiols, and photocuring components. Examples include photocurable resin compositions containing a polymerization initiator as a photocurable component.
硬化性樹脂組成物の硬化処理は、光硬化性樹脂
を用いた場合は、高圧水銀灯、メタルハライド含
有高圧水銀灯、超高圧水銀灯、キセノン高圧水銀
灯、キセノンアークなどを用いて紫外線照射する
ことによつて行うことができるし、熱硬化性樹脂
を用いた場合は、電気炉、赤外線炉などを用いて
加熱することによつて行うことができる。 When a photocurable resin is used, the curing treatment of the curable resin composition is carried out by irradiating it with ultraviolet rays using a high-pressure mercury lamp, a metal halide-containing high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a xenon high-pressure mercury lamp, a xenon arc, etc. When a thermosetting resin is used, it can be carried out by heating using an electric furnace, an infrared furnace, or the like.
また、本発明方法において用いる基材として
は、例えばガラス製品、木工製品、陶磁製品、金
属製品、プラスチツク製品などを挙げることがで
きる。 Furthermore, examples of the substrate used in the method of the present invention include glass products, wood products, ceramic products, metal products, plastic products, and the like.
前記のようにして基材表面に、耐サンドブラス
ト性が異なる少なくとも２種の硬化した樹脂パタ
ーンを形成させたのち、この上からサンドブラス
トを吹き付けて基材の食刻を行う。このサンドブ
ラストとしては、例えば天然ケイ砂、ガーネツト
などの天然研磨材、炭化ケイ素、溶融アルミナな
どの人工研磨材などが用いられる。これらのサン
ドブラストは、粒径30〜500μｍの範囲のものが
好ましい。 After at least two types of cured resin patterns having different sandblasting resistance are formed on the surface of the substrate as described above, the substrate is etched by spraying sandblast onto the patterns. As this sandblasting, for example, natural abrasives such as natural silica sand and garnet, and artificial abrasives such as silicon carbide and fused alumina are used. These sand blasts preferably have a particle size in the range of 30 to 500 μm.
これらのサンドブラストは、高圧空気や高圧液
体に担送させて基材表面に吹き付けられる。この
際の吹き付け圧力としては、通常２〜６Kg／cm2の
範囲が用いられる。 These sandblasts are carried by high-pressure air or high-pressure liquid and are blown onto the surface of the base material. The spraying pressure at this time is usually in the range of 2 to 6 kg/cm 2 .
このようなサンドブラストによる食刻の条件は
基材の種類や食刻模様によつて異なることは当然
なことである。 Naturally, the conditions for such sandblasting etching vary depending on the type of substrate and the etching pattern.
本発明方法においては、このサンドブラストの
吹き付けのみによつても十分に実用に供しうる食
刻が得られるが、所望ならばさらに薬品処理を施
して食刻の効果の向上、あるいは表面改質をはか
ることができる。例えば基材としてガラスを用い
た場合に、フツ酸と濃硫酸により腐食したり、あ
るいはプリント回路形成の場合に塩化第二銅又は
塩化第二鉄の酸性水溶液で表面に露出する銅など
を溶解除去することができる。 In the method of the present invention, etching sufficient for practical use can be obtained by sandblasting alone, but if desired, chemical treatment may be further applied to improve the etching effect or to modify the surface. be able to. For example, when glass is used as a base material, it corrodes with hydrofluoric acid and concentrated sulfuric acid, or when forming a printed circuit, copper exposed on the surface is dissolved and removed with an acidic aqueous solution of cupric chloride or ferric chloride. can do.
このようにして、基材表面の食刻が完了したな
らば、次いで不要になつた表面上に残存する硬化
樹脂のパターンを除去する必要がある。この除去
は、例えば研磨機や刷毛を用いて機械的に除去す
るか適当な溶剤を用いて、溶解又は膨潤して除去
するかあるいはプラズマ処理などにより揮散させ
て除去することによつて行うことができる。 Once etching of the substrate surface is completed in this manner, it is then necessary to remove the pattern of cured resin remaining on the surface that is no longer needed. This removal can be carried out, for example, by mechanical removal using a polisher or brush, by dissolving or swelling with an appropriate solvent, or by volatilization by plasma treatment, etc. can.
本発明方法によると、ガラス製品、木工製品、
陶磁製品、金属製品、プラスチツク製品などの表
面に、精密でありかつ再現性のよい段彫のある彫
刻模様を生産性高く、低コストで得ることができ
るので、本発明方法は工業的な段彫法として好適
である。 According to the method of the present invention, glass products, wood products,
The method of the present invention is suitable for industrial step engraving because it is possible to obtain precise and reproducible stepped engraving patterns on the surfaces of ceramic products, metal products, plastic products, etc. with high productivity and at low cost. suitable as a law.
次に実施例によつて本発明をさらに詳細に説明
する。 Next, the present invention will be explained in more detail with reference to Examples.
実施例
次のようにして３種の耐サンドブラスト性の異
なる光硬化性樹脂組成物Ａ、Ｂ及びＣを調製し
た。Example Three types of photocurable resin compositions A, B, and C having different sandblasting resistance were prepared as follows.
光硬化性樹脂組成物Ａの調製
エチレンオキシド−プロピレンオキシド共重合
体（エチレンオキシド単位35重量％）のブロツク
共重合体ジオール（分子量2000）100重量部とポ
リエチレンアジペートジオール（分子量2000）
100重量部とトリレンジイソシアナート26重量部
と0.5重量部のジブチルチンジラウレートとを混
合溶解し、70℃で２時間反応させて両末端にイソ
シアナート基を残し、これに15重量部の２−ヒド
ロキシエチルメタクリレートと0.025重量部の２，
６−ジ−ｔ−ブチル−ｐ−クレゾールを加え、さ
らに70℃で２時間反応させて不飽和ウレタンプレ
ポリマーを製造した。Preparation of photocurable resin composition A 100 parts by weight of block copolymer diol (molecular weight 2000) of ethylene oxide-propylene oxide copolymer (ethylene oxide unit 35%) and polyethylene adipate diol (molecular weight 2000)
100 parts by weight of tolylene diisocyanate, 26 parts by weight of tolylene diisocyanate, and 0.5 parts by weight of dibutyltin dilaurate were mixed and dissolved, and reacted at 70°C for 2 hours to leave isocyanate groups at both ends. hydroxyethyl methacrylate and 0.025 parts by weight of 2,
6-di-t-butyl-p-cresol was added and the mixture was further reacted at 70°C for 2 hours to produce an unsaturated urethane prepolymer.
このようにして得た不飽和ウレタンプレポリマ
ー100重量部、２−ヒドロキシエチルメタクリレ
ート50重量部、フタル酸モノ（２−ヒドロキシエ
チルメタクリレート）エステル50重量部、２，２
−ジメトキシフエニルアセトフエノン3.0重量部、
レベリング剤・デイスパロン＃1970（楠本化成(株)
製）２重量部及びフタロシアニングリーン0.3重
量部を混合し、粘度700ポイズ（Ｂ型粘度計を用
いて25℃で測定）の光硬化性樹脂組成物Ａを調製
した。 100 parts by weight of the unsaturated urethane prepolymer thus obtained, 50 parts by weight of 2-hydroxyethyl methacrylate, 50 parts by weight of phthalic acid mono(2-hydroxyethyl methacrylate) ester, 2,2
- 3.0 parts by weight of dimethoxyphenylacetophenone,
Leveling agent/Disparon #1970 (Kusumoto Kasei Co., Ltd.)
A photocurable resin composition A having a viscosity of 700 poise (measured at 25° C. using a B-type viscometer) was prepared by mixing 2 parts by weight of Phthalocyanine Green.
光硬化性樹脂組成物Ｂの調製
前記の樹脂組成物Ａにおける不飽和ウレタンプ
レポリマー50重量部、２−ヒドロキシエチルメタ
クリレート50重量部、フタル酸モノ（２−ヒドロ
キシエチルメタクリレート）エステル100重量部、
２，２−ジメトキシフエニルアセトフエノン3.0
重量部、レベリング剤・デイスパロン＃19702重
量部及びフタロシアニングリーン0.3重量部を混
合し、粘度（Ｂ型粘度計を用いて25℃で測定）
300ポイズの光硬化性樹脂組成物Ｂを調製した。Preparation of photocurable resin composition B 50 parts by weight of the unsaturated urethane prepolymer in the resin composition A, 50 parts by weight of 2-hydroxyethyl methacrylate, 100 parts by weight of phthalic acid mono(2-hydroxyethyl methacrylate) ester,
2,2-dimethoxyphenylacetophenone 3.0
Mix parts by weight, leveling agent Disparon #19702 and 0.3 parts by weight of Phthalocyanine Green, and viscosity (measured at 25°C using a B-type viscometer)
A 300 poise photocurable resin composition B was prepared.
光硬化性樹脂組成物Ｃの調製
APRG−４（旭化成工業(株)製）100重量部、レ
ベリング剤・デイスパロン＃1970 １重量部、フ
タロシアニングリーン0.15重量部及び光重合開始
剤のベンゾインブチルエーテル２重量部を混合
し、粘度（Ｂ型粘度型を用いて25℃で測定）120
ポイズの光硬化性樹脂組成物Ｃを調製した。Preparation of photocurable resin composition C 100 parts by weight of APRG-4 (manufactured by Asahi Kasei Industries, Ltd.), 1 part by weight of leveling agent Disparon #1970, 0.15 parts by weight of phthalocyanine green, and 2 parts by weight of benzoin butyl ether as a photopolymerization initiator. The viscosity (measured at 25℃ using Type B viscosity type) is 120.
A Poise photocurable resin composition C was prepared.
これらの樹脂組成物の耐サンドブラスト性は、
Ａ＞Ｂ＞Ｃの順である。 The sandblasting resistance of these resin compositions is
The order is A>B>C.
次に、パターンのみ異なる200メツシユのポリ
エステルスクリーン版（乳剤厚30μｍ）を３種
（Ｘ、Ｙ、Ｚ）用意し、まず樹脂組成物Ａを用い
てパターンＸのスクリーン版でガラス板上に印刷
して露光する。次に樹脂組成物Ｂを用いてパター
ンＹのスクリーン版で前記のガラス版上に印刷し
て露光する。次いで樹脂組成物Ｃを用いてパター
ンＺのスクリーン版で前記のガラス板に印刷して
露光する。それぞれの露光条件は共通であり、
120W／cmの３灯式のメタルハライドランプを用
いコンベアスピード６ｍ／minで露光した。また
各Ａ、Ｂ、Ｃの樹脂厚みはおおよそ50μｍであつ
た。 Next, three types (X, Y, Z) of 200 mesh polyester screen plates (emulsion thickness 30 μm) with different patterns were prepared, and first, using resin composition A, the screen plates with pattern X were printed on a glass plate. and expose. Next, resin composition B is printed on the glass plate with a screen plate having pattern Y and exposed. Next, the resin composition C is printed on the glass plate using a screen plate having a pattern Z and exposed to light. The exposure conditions for each are common,
Exposure was carried out using a 120 W/cm triple metal halide lamp at a conveyor speed of 6 m/min. Further, the resin thickness of each of A, B, and C was approximately 50 μm.
この部分的に耐サンドブラスト性の異なる樹脂
膜から成るマスクを通して、４Kg／cm2の空気圧で
200メツシユのアランダムを60秒間吹き付けたの
ち、５重量％の苛性ソーダ水溶液で浸漬振動させ
て剥離したところ、ガラス板上に繊細な図柄の段
彫模様を得ることができた。 Through this mask partially made of a resin film with different sandblasting resistance, an air pressure of 4 kg/cm 2 is applied.
After spraying 200 mesh alundum for 60 seconds, the glass plate was peeled off by immersion and vibration in a 5% by weight aqueous solution of caustic soda, and a delicate stepped pattern was obtained on the glass plate.
Claims (1)
硬化性樹脂組成物により所定のパターンを形成さ
せ、次いでこれを硬化処理して部分的に耐サンド
ブラスト性が異なる硬化した樹脂パターンを形成
させたのち、該パターンの上からサンドブラスト
を吹き付けて食刻することを特徴とするサンドブ
ラストによる彫刻法。 ２ 硬化性樹脂組成物が光硬化性樹脂組成物であ
る特許請求の範囲第１項記載の方法。[Scope of Claims] 1 A predetermined pattern is formed on the surface of a base material using at least two types of curable resin compositions in an uncured state, and then this is subjected to a curing treatment to partially cure the resin composition with different sandblasting resistance. An engraving method using sandblasting, which comprises forming a resin pattern and then etching it by spraying sandblast over the pattern. 2. The method according to claim 1, wherein the curable resin composition is a photocurable resin composition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12684483A JPS6020861A (en) | 1983-07-12 | 1983-07-12 | Carving method by sand blast |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12684483A JPS6020861A (en) | 1983-07-12 | 1983-07-12 | Carving method by sand blast |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6020861A JPS6020861A (en) | 1985-02-02 |
| JPH048182B2 true JPH048182B2 (en) | 1992-02-14 |
Family
ID=14945265
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12684483A Granted JPS6020861A (en) | 1983-07-12 | 1983-07-12 | Carving method by sand blast |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6020861A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE69325123T2 (en) * | 1992-03-23 | 1999-11-18 | Koninkl Philips Electronics Nv | Method of making a plate of an electrically insulating material with a pattern of holes or cavities for use in display devices |
| BE1007894A3 (en) * | 1993-12-20 | 1995-11-14 | Philips Electronics Nv | Method for manufacturing a plate of non-metallic materials with a pattern of holes and / or cavities. |
| FR2802843B1 (en) * | 1999-12-28 | 2002-03-22 | Delta Thermique | PROCESS FOR DEFROSTING GLASS ITEMS AND GLASS ITEMS DEFROSTED BY THIS PROCESS |
-
1983
- 1983-07-12 JP JP12684483A patent/JPS6020861A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6020861A (en) | 1985-02-02 |
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