JPH0481387U

JPH0481387U -

Info

Publication number: JPH0481387U
Application number: JP12305290U
Authority: JP
Priority date: 1990-11-22
Filing date: 1990-11-22
Publication date: 1992-07-15

Description

[Brief explanation of the drawing]

第１図は本考案のＩＣソケツトの実装を示す斜
視図、第２図は本考案のＩＣソケツトの要部の斜
視図、第３図ａは第１図の−断面図、第３図
ｂは第１図の−断面図、第４図は本考案のＩ
Ｃソケツトの各面を表す図、第５図は導通接触子
の各面を表す図および斜視図、第６図は本考案の
ＩＣソケツトの係合部を示す拡大斜視図、第７図
は既存の回路に新たな回路を追加する場合の回路
図、第８図は既存の技術で基板に実装済みのＩＣ
のリードに配線を直接半田付けした状態の斜視図
、第９図は本考案のＩＣソケツトを用いた場合の
斜視図、第１０図は本考案の接続片に孔を開けて
そこに配線を接続した状態を示す斜視図、第１１
図は本考案のＩＣソケツトにスペーサを嵌める状
態を説明する斜視図、第１２図は従来のマザーボ
ードにサブボードを取付けた状態の斜視図、第１
３図は第１２図の正面図、第１４図はスペーサを
介在させてマザーボードにサブボートを取付けた
状態の正面図、第１５図は接続片間に電子部品を
取付けた状態を示すＩＣソケツトの斜視図である
。６……係合爪、３……絶縁基体、２……リード
、７……導通接触子、７ａ……接続片、７ｂ……
接触片、４１……電子部品、２１……スペーサ。 Fig. 1 is a perspective view showing the mounting of the IC socket of the present invention, Fig. 2 is a perspective view of the main parts of the IC socket of the present invention, Fig. 3a is a cross-sectional view of Fig. 1, and Fig. 3b is a Figure 1 is a cross-sectional view, and Figure 4 is the I of the present invention.
Figure 5 is a diagram showing each side of the C socket, Figure 5 is a diagram and perspective view showing each side of the conductive contact, Figure 6 is an enlarged perspective view showing the engaging part of the IC socket of the present invention, and Figure 7 is the existing one. A circuit diagram when adding a new circuit to the circuit shown in Figure 8 is an IC already mounted on the board using existing technology.
Figure 9 is a perspective view of the IC socket of the present invention when the wiring is soldered directly to the lead, Figure 10 is a perspective view of the IC socket of the present invention with holes drilled in the connection piece of the present invention and wiring connected there. 11th perspective view showing the state in which
The figure is a perspective view illustrating the state in which a spacer is fitted into the IC socket of the present invention, FIG. 12 is a perspective view of a conventional motherboard with a subboard attached, and FIG.
Figure 3 is a front view of Figure 12, Figure 14 is a front view of the sub-board attached to the motherboard with a spacer interposed, and Figure 15 is a perspective view of the IC socket with electronic components installed between the connecting pieces. It is a diagram. 6... Engaging claw, 3... Insulating base, 2... Lead, 7... Continuity contact, 7a... Connection piece, 7b...
Contact piece, 41...Electronic component, 21...Spacer.

Claims

[Claims for Utility Model Registration] (1) An insulating base that is placed on an IC and is provided with protruding engaging claws that engage the side surface where the leads of the IC are not attached, at a position corresponding to each lead of the IC. An IC socket in which a conductive contact consisting of a plate-shaped contact piece that contacts a lead and a plate-shaped or pin-shaped connecting piece is provided vertically through an insulating base. (2) The IC socket according to claim 1, wherein a spacer is attached to a conductive contact provided above the insulating base.