JPH0480802A - Nc device for laser beam machining - Google Patents

Abstract

PURPOSE:To enable a worker to omit a troublesome machining condition setting job by providing a means which selects or operate with interpolation the optimum machining conditions by reference to a machining condition table and a commanding machining speed. CONSTITUTION:A machining condition storage part 2 stores the machining conditions for each machining speed into a machining condition table where the machining conditions are hierarchically branched with the material and the plate thickness defined as the directories. A part program analyzing part 3 selects the data on the material and the plate thickness out of an input part program and then decides the best one of machining speeds instructed from a machining condition deciding part 4 under the machining conditions. When a machining speed is commanded and changed, the machining conditions are selected as long as the instructed speed is contained in a speed table for machining conditions. Meanwhile the optimum machining conditions are calculated from the numerical data by an interpolation arithmetic if the instructed speed is coincident with a middle point between both tables. Thus the most approximate data can be selected in regard of the type of gas, etc.

Description

[Detailed description of the invention] Industrial applications The present invention relates to an NC device for a laser processing machine.

Conventional technology Conventionally, when processing sheet metal with a laser, the laser output is 9
Laser processing conditions such as frequency, duty, and assist pressure are changed each time depending on the command speed, the material and thickness of the workpiece, and the processing speed commanded by the part program.

Problems that the invention aims to solve However, in the conventional method described above, the thickness of the workpiece.

It is fine as long as the material and machining speed are the same, but if the thickness, material, or machining speed of the workpiece changes, it is necessary to reset all machining condition settings in the part program.

Furthermore, when creating a part program for laser machining, it is necessary to always instruct the machining conditions to be optimized based on the material, plate thickness, and machining speed of the workpiece.

It is an object of the present invention to solve the above-mentioned conventional problems and to provide means that can automatically determine optimal processing conditions by inputting the above-mentioned conditions.

Means for Solving the Problems In order to achieve the above object, the NC device for a laser processing machine of the present invention has an output control function of a laser oscillator and performs laser processing on a workpiece. The machine is configured to include a machining condition table having a directory of a plurality of conditions of the workpiece, and means for selecting or interpolating optimum machining conditions from the machining condition table at a commanded machining speed.

According to the above configuration, when processing a workpiece using the NC machine device for a laser processing machine, the present invention can search the processing condition table based on the commanded processing speed by simply inputting the material and thickness of the sheet metal, for example. Laser processing can be performed under optimal processing conditions.

EXAMPLE An example of the present invention will be described below with reference to FIGS. 1 to 5.

FIG. 1 is a block diagram showing the structure of an NC device for a laser processing machine according to an embodiment of the present invention.

The part program file storage section 1 is a storage means such as a RAM that stores a part program for laser processing.

An example of the part program is shown in FIG.

As shown in FIGS. 3 and 4, the machining condition storage unit 2 stores the laser machining conditions on a hierarchically branched machining condition table with material and plate thickness as directories, and stores nine laser output frequencies and duties for each machining speed.

Stores machining conditions such as assist gas pressure.

The part program analysis unit 3 selects the material and plate thickness data shown in FIG. 4 from the input part program, and further determines the optimum machining conditions from the machining speed commanded by the machining condition determining unit 4. It is a means.

The above are the main parts of the NC device. Below, the servo 5 is a device for moving each axis of the machine tool, and the laser 8 is a laser machining device.
This is a laser oscillator for performing.

It has the above configuration, and its operation will be explained next.

First, the part program is analyzed and the laser processing machine is operated as before. As shown in 1 in Fig. 2, the material and thickness of the workpiece are selected using the part program. Piercing is performed in step 2, and the external shape is processed in step 3. At that time, the commanded speed determines the cutting conditions. When the machining speed is changed as in 4, machining condition selection is performed again.

Next, the machining condition table will be explained using FIGS. 3 and 4.

Figure 3 shows an example of a directory of processing conditions for sheet metal cutting, with up to 32 types depending on the material.
Up to 16 types of material and plate thickness can be selected.

FIG. 4 shows data in the directory shown in FIG. 3, each of which has piercing conditions and cutting conditions. Furthermore, the cutting conditions include 10 levels of data combinations as machining speeds, and machining is performed while determining which data combination to adopt based on the command machining speed.

First, machining conditions are selected using the part program G22. The material is selected by address I of the G code, and the plate thickness is selected by 1. Since the minimum unit for plate thickness selection here is 0.1 mm, a plate thickness of 1.2 mm is selected at J12. After that, when the machining speed is selected, the optimum conditions are determined from the machining condition table and are issued as commands to the laser oscillator.

FIG. 5 shows the processing flow for determining the processing conditions.

First, the sheet metal material selected by the part program,
Select plate thickness. This is G22 by part program
is executed every time a command is issued. Next, when the machining speed is commanded and there is a change in speed, if the commanded speed exists in the speed table of the example 10-step machining conditions, that machining condition is selected, and the commanded speed is If it is in between, the numeric data is processed by interpolation,
Calculate the optimum processing conditions and select the closest selection data such as gas type.

Note that the above-mentioned processing condition table, for example, the combinations of material types, plate thickness types, and processing conditions are merely examples, and may be changed as necessary.

Note that although the above example uses the case of cutting sheet metal, the material is not limited to metal, and may be any material such as wood, plasticaf, etc., and may also be three-dimensional. In addition, when machining is performed to the middle of the material thickness of the workpiece instead of cutting, the machining depth may be used instead of the plate thickness in the example of the directory of machining conditions shown in FIG.

As described in detail, the NC device for a laser processing machine equipped with a means for selecting or interpolating optimum processing conditions from a processing condition table and a commanded processing speed according to the present invention can Once the conditions are set, the machining conditions will be automatically set even when the machining speed changes, eliminating the need for the operator to set troublesome machining conditions), making it easy for anyone to create programs for laser processing machines. This provides an excellent means of doing so.

[Brief explanation of drawings]

FIG. 1 is a block diagram of an NC device for a laser processing machine according to an embodiment of the present invention, FIG. 2 is a diagram showing a list showing an example of a part program, FIG. 3 is a directory structure diagram of processing conditions, and FIG. This figure is a machining condition table diagram, and FIG. 5 is a PAD diagram of a process for determining optimal machining conditions from a set speed. 1... Part program file storage section, 2.
...Machining condition storage unit, 3...Part program analysis unit, 4...Machining condition determination unit, 6...
...Servo, 6...Laser oscillator. Name of agent: Patent attorney Shigetaka Awano and 1 other famous confectionery diagram G9DX 1000. Yfooo CTOX 10. Y 10; Gdo 31 Pishireg (Do) Ton Toto; Extraction processing GOX/10. YfO; cotx doto, Yto Ft5oo: force 0 kōjo 芒卜rHISTORY-(4) Fig. 口αX/6 Fig.

Claims (2)

[Claims] (1) In an NC device for a laser processing machine that has a laser oscillator output control function and performs laser processing on a workpiece, there is a processing condition table containing a directory of multiple conditions of the workpiece, and a processing condition table based on the processing condition table. An NC device for a laser processing machine, comprising means for selecting or interpolating optimum processing conditions. (2) The NC device for a laser processing machine according to claim 1, wherein the workpiece is plate-shaped, and the plurality of conditions for the workpiece are material and plate thickness.