JPH04799A - Electronic component mounting apparatus - Google Patents
Electronic component mounting apparatusInfo
- Publication number
- JPH04799A JPH04799A JP2014999A JP1499990A JPH04799A JP H04799 A JPH04799 A JP H04799A JP 2014999 A JP2014999 A JP 2014999A JP 1499990 A JP1499990 A JP 1499990A JP H04799 A JPH04799 A JP H04799A
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- suction
- electronic component
- vacuum
- state
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000001514 detection method Methods 0.000 claims description 30
- 238000001179 sorption measurement Methods 0.000 claims description 4
- 230000003028 elevating effect Effects 0.000 description 5
- 210000000078 claw Anatomy 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
［発明の目的コ
（産業上の利用分野）
本発明は、吸着手段により電子部品を真空吸着保持し、
基板上に搭載する電子部品実装装置に係り、特に吸着手
段の状態良否や電子部品の吸着状態の良否を判定する手
段を有する電子部品実装装置に関する。
（従来の技術）
従来の電子部品実装装置において吸着保持された電子部
品の吸着状態の良否判定は、吸着手段中心に対する電子
部品の位置ずれによって生じる吸着孔からのエア漏れを
真空度低下として真空センサにより検知し、その検知結
果を吸着状態の良否判定基準に適用する方法が用いられ
ていた。
（発明が解決しようとする課題）
しかし、上記従来の電子部品の吸着状態の良否判定では
、第４図（ｂ）に示すような吸着手段（以下、ノズルと
いう）の吸着孔をふさぐ状態で電子部品を吸着保持した
場合、電子部品が正常に吸着されなくても吸着状態から
「良」と判定され、基板に搭載されてしまうので、電子
部品の実装位置ずれや吸着位置すれ等が発生していた。
また、従来の電子部品実装装置には、ノズルが部品供給
部から部品を取り出す時や基板上に部品を搭載する時に
部品表面に接触するためノズルの先端が徐々に磨耗し、
部品搭載ミスを起こすなどの問題があったがこの磨耗状
態は目視で判断されたり、部品装着ミスによるトライの
状況によって判断される場合が多く、人手に頼っていた
。
さらに、従来の電子部品実装装置の吸着状態の良否判定
では、第８図に示すような真空吸着時にノズルに半田、
接着剤などの粘着性物質やごみなどを吸い込みノズルつ
まりを起こす場合、真空度が高くなり、部品を保持して
いなくても吸着保持していると判断することがあり、装
着安定性に欠くため、ノズルの状態を常に管理する必要
があった。
そこで、発明の目的は、上記問題点を鑑みて、電子部品
を真空吸着により保持させる場合に、電子部品の吸着状
態の良否を適確に判定したり、リズルの磨耗量の検知、
ノズルのつまり等のノズル状態の適確に判定できる電子
部品実装装置を提供することにある。
［発明の構成］
（課題を解決するための手段）
本発明は、上記目的を達成するために、［電子部品を真
空吸着保持する吸着手段と、この吸着手段及び前記電子
部品の有無を検出する有無検出手段と、前記吸着手段の
位置を検出する位置検出手段と、前記吸着手段の基準位
置を設定記憶する基準位置設定手段と、前記位置検出手
段からの検出信号と前記基準位置設定手段からの出力信
号とを比較演算する比較手段と、この比較手段からの出
力信号と前記有無検出手段からの検出信号とを基に、前
記吸着手段に真空吸着保持された前記電子部品の吸着状
態の良否及び前記吸着手段の状態の良否のうち少なくと
もどちらか一方を判断する判断手段とを具備した電子部
品実装装置」及び、
「少なくとも１つの吸着孔を有し、電子部品を真空吸着
保持する吸着手段と、この吸着手段及び前記電子部品の
有無を検出する有無検出手段と、前記吸着手段の真空状
態を検出する真空検出手段と、前記有無検出手段からの
検出信号と前記真空検出手段からの検出信号を基に、前
記吸着手段の吸着孔の状態を判定する判定手段とを具備
した電子部品実装装置」を提供する。
（作用）
このように構成された電子部品実装装置は、予め設定記
憶された吸着手段の上下基準位置等の情報により、吸着
手段の基準位置と電子部品を真空吸着した吸着手段り実
検出位置とを比較し、両者が同−或いは両者の差が許容
範囲で、かつ吸着手段に電子部品が吸着されたことを検
出したとき電子部品が正常に吸着手段に吸着されたと判
定する。また、予め設定記憶された他の吸着手段の基準
位置情報により、第２の吸着手段の基準位置と吸着手段
の実検出位置とを比較し、両者の間に差が生じ、かつ吸
着手段に電子部品が吸着されていないことを検出したと
き、その差を吸着手段先端部の磨耗量として算出できる
。更に、電子部品が吸着されていないことを検出したと
き真空状態を検出した場合、吸着手段の吸着孔の異常を
検知することができる。
（実施例）
本発明の一実施例を図面を用いて説明する。
第１図及び第２図に示すように、本実施例の電子部品実
装装置のヘッド部は、電子部品の供給部と基板との間を
移動する移動体１には、基枠２が固定されている。この
基枠２の側部に取付けられた軸受装置３には、外軸４が
回転可能に挿通支持されており、この外軸４に内軸５が
スプライン係合により上下動可能に挿通支持されている
。なお、外軸４はプーリ６に掛けられるベルトを介して
モータ（いずれも図示せず）により回転されるようにな
っており、その外軸４の回転は内軸５にスプライン係合
によって伝達される。
上記内軸５の下端部には、電子部品をいわゆる真空吸引
により吸着するノズル７が取付けられており、そのノズ
ル７は内輪５の上端部に取付けられる吸気装置としての
真空発生装置Ａに接続されるようになっている。また、
外軸４の下端部にはガイド盤８が取付けられており、そ
のガイド盤８の下面にはノズル７に吸着された電子部品
の位置決めを行うための位置決め部材たる４個の爪部材
９が前後方向及び左右方向に移動可能に支持され、また
、その外側には、ノズル７及びノズル７に真空吸着され
た電子部品Ｅを検出する有無検出器１０が設けられてい
る。これら爪部材９は、ガイド盤８の上部のレバー支え
１１に軸１２を介して支持されたレバー１３に連結され
、このレバー１３の回動により前後方向及び左右方向に
移動される。
一方、基枠２の後部には、減速機を内蔵した第１及び第
２のモータ１４及び１５が取付けられており、その回転
軸１４ａ、１５ａは基枠２の前部に配設された第１及び
第２のカム軸１６及び１７にカップリング１６ａ、１７
ａにより連結されている。そして、第１及び第２のカム
軸１６及び１７には、略円形をなす第１及び第２のカム
１８及び１９が偏心状態に取付けられている。この第１
及び第２のカム１８及び１９に接触する第１及び第２の
カムフォロアたる第１及び第２のローラ２０及び２１は
、第１及び第２のアーム２２及び２３に設けられている
。この第１及び第２のアーム２２及び２３は、基枠２の
上下両側に軸２４及び２５により回動可能に支持され、
引張りコイルばね２６及び２７により第１及び第２のロ
ーラ２０及び２１を第１及び第２のカム１８及び１９に
押し付ける方向に回動付勢されている。そして、第１及
び第２のアーム２２及び２３の一端部にはローラ２８及
び２９か設けられている。このうち第１のアーム２２の
ローラ２８は内軸５の上方部に取付けられた第１の受は
リング３０の上下両フランジ３０ａ及び３０ｂ間に配置
されている。また、第２のアーム２３のローラ２９は外
軸４の下方部に上下動可能に支持された第２の受はリン
グ３１の上下両フランジ３１ａ及び３１ｂ間に配置され
ている。この第２の受はリング３１の下方には、外軸４
に上下動可能に支持された昇降リング３２が配置されて
おり、この昇降リング３２と第２の受はリング３１との
間には、外軸４に挿入保持された圧縮コイルばね３３に
よって連結されている。
そして、昇降リング３２に取付けられた膨突子３４をレ
バー１３に連結し、昇降リング３２の上下動に応動して
レバー１３が回動するように構成されている。従って、
第１のカム１８の回転に伴う第１のローラ２０の変位は
、変位伝達手段すなわち第１のアーム２２、第１の受は
リング３０．内軸５を介してノズル７に伝達されてこの
ノズル７が上下動し、また第２のカム１９の回転に伴う
第２のローラ２１の変位は、変位伝達手段すなわち第２
のアーム２３、第２の受はリング３１、圧縮コイルばね
３３、昇降リング３２、レバー１３を介して爪部材９に
伝達されてこの爪部材９が前後方向及び左右方向に移動
するようになっている。
また、第１の受はリング３０の上フランジ３０ａの上端
部にベルトガイド３５を設け、このベルトガイド３５に
ベルト３６を通し、このベルト３６を介して内軸５の上
下移動量を検出し、間接的にノズル７の位置を検出する
上下位置検出器３７を有している。さらに、真空状態を
検出する真空検出器３８が、真空発生装置Ａに設けられ
ている。
そして、有無検出器］０．上下位置検出器３７゜真空検
出器３８からの各検出信号を基に、電子部品の吸着姿勢
の良否、ノズル状態の良否等を判定する判定手段３９及
び各種情報を入力記憶する記憶手段４０がマイクロコン
ピュータなどで構成された制御装置内に設けられている
。
このように構成されたものにおいては、以下のように電
子部品の吸着姿勢の良否、ノズル状態の良否等が判定さ
れる。
まず、電子部品の吸着状態の良否判定について、第３図
及び第４図を用いて説明する。
予め初期状態の第１のモータ１４の回転角度とこの角度
に対応したノズル７の位置を上下位置検出器３７を介し
て記憶手段４０に記憶させる。このとき、第１のモータ
１４の回転角度とノズル７の上下位置を一致させている
。次に、有無検出器１０によりノズル７に電子部品が吸
着されているか否かを検出する。そして、電子部品がノ
ズル７に吸着されていることを検出した場合、記憶手段
４０に記憶された電子部品を正常に吸着したときのノズ
ル７の基準位置（ａ）のデータを呼び出す。
さらに、実際に電子部品を吸着したノズル７の位置（ｂ
）を上下位置検出器３７により検出する。
その後、呼び出されたノズル７の基準位置（ａ）のデー
タとノズル７の位置（ｂ）の検出値とを比較し、両者が
一致したときはノズル７に電子部品が正常に吸着されて
いると判定し、一致しないときは正常に吸着されていな
いと判定する。なお、この判定においては、両者の差に
許容範囲をもたせ、その範囲内に両者の差があるときは
正常に吸着されているとしても良い。
次に、ノズル７の状態良否の判定について、第５図乃至
第８図を用いて説明する。
第５図及び第６図を用いて、ノズル７の先端磨耗による
状態良否判定について述べる。
まず、予め電子部品を吸着していない状態でノズル７の
先端に磨耗が生じていないときのノズル７の基準位置（
ａ）のデータを記憶手段４０に記憶させる。次に、有無
検出器１０によりノズル７に電子部品が吸着されていな
いことを確認する。
電子部品がノズル７に吸着されていない状態を確認した
ら、ノズル７の実基準位置（ｂ）を上下位置検出器３７
により検出する。その後、判定手段３９は記憶手段４０
に記憶されたノズル７の基準位置（ａ）のデータを呼び
出し、上下位置検出器３７からのノズル７の実基準位置
の検出値と比較し、両者の差Ｂを算出する。この差Ｂが
ノズル磨耗量である。そして、このノズル磨耗量Ｂを摩
耗量許容限度値りと比較し、ノズル磨耗量Ｂがこの許容
値限度以内にあれば、ノズル７の交換が不要であり、許
容値限度外であればノズル７を交換すると判定する。
次に、第７図及び第８図を用いて、ノズル７のつまり状
態の判定について述べる。
まず、有無検出器１０により電子部品がノズル７に吸着
されていないことを確認する。次に、真空検出器３８に
よりノズル７の真空度を検出する。
そして、判定手段３９は、有無検出器１０と真空検出器
３８とからの検出信号を基に、ノズル７に電子部品が吸
着されていないにもかかわらず、所定の真空度を検出し
た場合、ノズル７に形成された孔Ｈが何らかの原因でつ
まっていると判定する。
［発明の効果］
以上述べたように、本発明によれば以下の効果を奏する
。
（１）吸着手段の高さ位置情報を把握し、部品吸着後の
吸着手段の高さと比較することにより、電子部品の吸着
状態の良否を適確に判定できるので、部品が正しく位置
規制された部品のみを基板に実装するため安定性が増し
、装着ミスが少なくなる。
（２）吸着手段の先端の磨耗を検出し、管理することに
より目視による判断または、これを原因とした装着ミス
を事前に防止することができる。
（３）吸着手段のつまりを検出することにより、吸着手
段内径の変化による影響を排除し、部品取り込みを確実
に検知し部品の装着安定性を保つことができる。[Purpose of the Invention (Industrial Application Field) The present invention provides a method for holding electronic components by vacuum suction using a suction means,
The present invention relates to an electronic component mounting apparatus mounted on a board, and particularly to an electronic component mounting apparatus having a means for determining whether the state of a suction means is good or not, or whether the electronic component is suctioned properly. (Prior art) In a conventional electronic component mounting apparatus, the suction state of an electronic component held by suction is judged to be good or bad by using a vacuum sensor, which detects air leakage from the suction hole caused by positional deviation of the electronic component with respect to the center of the suction means and detects a decrease in the degree of vacuum. A method has been used in which the detection result is used as a criterion for determining whether the suction state is good or bad. (Problem to be Solved by the Invention) However, in the above-mentioned conventional judgment of the suction state of electronic components, it is difficult to detect the electronic components by blocking the suction hole of the suction means (hereinafter referred to as a nozzle) as shown in FIG. 4(b). When a component is held by suction, even if the electronic component is not properly suctioned, it is determined to be "good" based on the suction condition and is mounted on the board, so there is no risk of misalignment of the mounting position of the electronic component or misalignment of the suction position. Ta. In addition, in conventional electronic component mounting equipment, the tip of the nozzle gradually wears out because the nozzle comes into contact with the surface of the component when taking out the component from the component supply section or mounting the component on the board.
There were problems such as mistakes in parts placement, but the state of wear was often judged visually or based on the trial situation due to mistakes in parts placement, and relied on manual labor. Furthermore, in determining the quality of suction in conventional electronic component mounting equipment, solder is applied to the nozzle during vacuum suction as shown in Figure 8.
If the nozzle is clogged due to suction of sticky substances such as adhesives or dust, the degree of vacuum will be high and it may be determined that the part is being held by suction even if it is not, resulting in a lack of mounting stability. , it was necessary to constantly manage the condition of the nozzle. SUMMARY OF THE INVENTION In view of the above-mentioned problems, it is an object of the present invention to accurately determine whether the suction state of electronic components is good or bad, to detect the amount of wear on the rizzle, when electronic components are held by vacuum suction,
An object of the present invention is to provide an electronic component mounting apparatus that can accurately determine nozzle conditions such as nozzle clogging. [Structure of the Invention] (Means for Solving the Problem) In order to achieve the above object, the present invention provides a suction means for holding an electronic component by vacuum suction, and a method for detecting the presence or absence of the suction means and the electronic component. presence detection means; position detection means for detecting the position of the suction means; reference position setting means for setting and storing a reference position of the suction means; and a detection signal from the position detection means and a detection signal from the reference position setting means. Comparing means for comparing and calculating the output signal, and determining whether the adsorption state of the electronic component held by vacuum suction by the suction means is good or bad, based on the output signal from the comparison means and the detection signal from the presence/absence detection means. ``An electronic component mounting apparatus comprising a determination means for determining at least one of whether the state of the suction means is good or bad,'' and ``A suction means having at least one suction hole and holding an electronic component by vacuum suction; A presence/absence detection means for detecting the presence or absence of the suction means and the electronic component, a vacuum detection means for detecting the vacuum state of the suction means, and a detection signal from the presence/absence detection means and a detection signal from the vacuum detection means. and determining means for determining the state of the suction hole of the suction means.'' (Function) The electronic component mounting apparatus configured as described above uses information such as the upper and lower reference positions of the suction means that are set and stored in advance to determine the reference position of the suction means and the actual detection position of the suction means that vacuum-suctioned the electronic component. are compared, and when both are the same or the difference between the two is within an allowable range, and it is detected that the electronic component has been suctioned by the suction means, it is determined that the electronic component has been normally suctioned by the suction means. In addition, the reference position of the second suction means and the actual detection position of the suction means are compared using the reference position information of other suction means set and stored in advance. When it is detected that the component is not suctioned, the difference can be calculated as the amount of wear on the tip of the suction means. Furthermore, if a vacuum state is detected when it is detected that the electronic component is not being sucked, it is possible to detect an abnormality in the suction hole of the suction means. (Example) An example of the present invention will be described using the drawings. As shown in FIGS. 1 and 2, in the head section of the electronic component mounting apparatus of this embodiment, a base frame 2 is fixed to a movable body 1 that moves between an electronic component supply section and a board. ing. An outer shaft 4 is rotatably inserted into and supported by a bearing device 3 attached to the side of the base frame 2, and an inner shaft 5 is inserted into and supported by the outer shaft 4 so as to be movable up and down by spline engagement. ing. The outer shaft 4 is rotated by a motor (none of which is shown) via a belt that is hung around a pulley 6, and the rotation of the outer shaft 4 is transmitted to the inner shaft 5 through spline engagement. Ru. A nozzle 7 is attached to the lower end of the inner shaft 5 to adsorb electronic components by so-called vacuum suction, and the nozzle 7 is connected to a vacuum generator A as a suction device attached to the upper end of the inner ring 5. It has become so. Also,
A guide plate 8 is attached to the lower end of the outer shaft 4, and on the lower surface of the guide plate 8, four claw members 9, which are positioning members for positioning the electronic components sucked by the nozzle 7, are arranged at the front and rear. The nozzle 7 is supported to be movable in the left and right directions, and a presence/absence detector 10 for detecting the nozzle 7 and the electronic component E vacuum-adsorbed by the nozzle 7 is provided on the outside thereof. These claw members 9 are connected to a lever 13 supported by a lever support 11 on the upper part of the guide plate 8 via a shaft 12, and are moved in the front-rear direction and left-right direction by rotation of the lever 13. On the other hand, first and second motors 14 and 15 each having a built-in speed reducer are attached to the rear part of the base frame 2, and their rotating shafts 14a and 15a are connected to the motors 14 and 15 provided at the front part of the base frame 2. Couplings 16a and 17 are connected to the first and second camshafts 16 and 17.
connected by a. First and second cams 18 and 19 each having a substantially circular shape are eccentrically attached to the first and second cam shafts 16 and 17. This first
First and second rollers 20 and 21, which are first and second cam followers that contact the second cams 18 and 19, are provided on first and second arms 22 and 23. The first and second arms 22 and 23 are rotatably supported by shafts 24 and 25 on both upper and lower sides of the base frame 2,
The first and second rollers 20 and 21 are rotationally biased by tension coil springs 26 and 27 in a direction to press them against the first and second cams 18 and 19. Rollers 28 and 29 are provided at one ends of the first and second arms 22 and 23. Of these, the roller 28 of the first arm 22 is attached to the upper part of the inner shaft 5, and the first receiver is disposed between the upper and lower flanges 30a and 30b of the ring 30. Further, the roller 29 of the second arm 23 is supported on the lower part of the outer shaft 4 so as to be movable up and down.A second support is disposed between the upper and lower flanges 31a and 31b of the ring 31. This second receiver is located below the ring 31 on the outer shaft 4.
An elevating ring 32 supported so as to be movable up and down is arranged, and the elevating ring 32 and the second support are connected with the ring 31 by a compression coil spring 33 inserted and held in the outer shaft 4. ing. The expansion member 34 attached to the elevating ring 32 is connected to the lever 13 so that the lever 13 rotates in response to the vertical movement of the elevating ring 32. Therefore,
The displacement of the first roller 20 due to the rotation of the first cam 18 is transmitted by a displacement transmitting means, that is, a first arm 22, and a first receiver is a ring 30. The nozzle 7 is moved up and down by being transmitted to the nozzle 7 via the inner shaft 5, and the displacement of the second roller 21 accompanying the rotation of the second cam 19 is transmitted to the nozzle 7 through the displacement transmission means, that is, the second
The arm 23 and the second receiver are transmitted to the claw member 9 via the ring 31, the compression coil spring 33, the elevating ring 32, and the lever 13, so that the claw member 9 moves in the front-back and left-right directions. There is. In addition, the first receiver is provided with a belt guide 35 at the upper end of the upper flange 30a of the ring 30, a belt 36 is passed through this belt guide 35, and the vertical movement amount of the inner shaft 5 is detected via this belt 36. It has a vertical position detector 37 that indirectly detects the position of the nozzle 7. Further, the vacuum generator A is provided with a vacuum detector 38 for detecting the vacuum state. and presence/absence detector]0. Based on the detection signals from the vertical position detector 37 and the vacuum detector 38, a determination means 39 for determining whether the suction position of the electronic component is good or not, the condition of the nozzle, etc., and a storage means 40 for inputting and storing various information are microscopic. It is installed in a control device composed of a computer or the like. In the device configured as described above, the quality of the suction posture of the electronic component, the quality of the nozzle condition, etc. are determined as follows. First, the quality determination of the suction state of electronic components will be explained using FIGS. 3 and 4. The rotation angle of the first motor 14 in the initial state and the position of the nozzle 7 corresponding to this angle are stored in advance in the storage means 40 via the vertical position detector 37. At this time, the rotation angle of the first motor 14 and the vertical position of the nozzle 7 are made to match. Next, the presence/absence detector 10 detects whether an electronic component is attracted to the nozzle 7 or not. When it is detected that the electronic component is attracted to the nozzle 7, the data of the reference position (a) of the nozzle 7 when the electronic component was normally attracted is called out, which is stored in the storage means 40. Furthermore, the position of the nozzle 7 that actually attracted the electronic component (b
) is detected by the vertical position detector 37. After that, the data of the reference position (a) of the called nozzle 7 is compared with the detected value of the position (b) of the nozzle 7, and when the two match, it is determined that the electronic component is normally attracted to the nozzle 7. If they do not match, it is determined that the adsorption is not normal. Note that in this determination, a tolerance range may be set for the difference between the two, and if the difference between the two is within that range, it may be assumed that the adsorption is normal. Next, the determination of whether the condition of the nozzle 7 is good or bad will be explained using FIGS. 5 to 8. Determination of the condition of the nozzle 7 based on wear at the tip will be described with reference to FIGS. 5 and 6. First, the reference position (
The data of a) is stored in the storage means 40. Next, the presence/absence detector 10 confirms that no electronic component is attracted to the nozzle 7 . After confirming that no electronic components are attracted to the nozzle 7, the actual reference position (b) of the nozzle 7 is detected by the vertical position detector 37.
Detected by. Thereafter, the determination means 39 uses the storage means 40
The data of the reference position (a) of the nozzle 7 stored in is called up and compared with the detected value of the actual reference position of the nozzle 7 from the vertical position detector 37, and the difference B between the two is calculated. This difference B is the amount of nozzle wear. Then, this nozzle wear amount B is compared with the wear amount allowable limit value, and if the nozzle wear amount B is within this allowable value limit, there is no need to replace the nozzle 7, and if it is outside the allowable value limit, the nozzle 7 It is determined that it should be replaced. Next, determination of the clogging state of the nozzle 7 will be described using FIGS. 7 and 8. First, it is confirmed by the presence/absence detector 10 that no electronic component is attracted to the nozzle 7 . Next, the degree of vacuum in the nozzle 7 is detected by the vacuum detector 38. Based on the detection signals from the presence/absence detector 10 and the vacuum detector 38, the determining means 39 determines whether a predetermined degree of vacuum is detected even though no electronic component is attracted to the nozzle 7. It is determined that the hole H formed in 7 is clogged for some reason. [Effects of the Invention] As described above, the present invention provides the following effects. (1) By grasping the height position information of the suction means and comparing it with the height of the suction means after picking up the component, it is possible to accurately judge whether the suction state of the electronic component is good or bad, so that the position of the component is correctly regulated. Since only the components are mounted on the board, stability is increased and mounting errors are reduced. (2) By detecting and managing the wear of the tip of the suction means, it is possible to make a visual judgment or to prevent mounting errors caused by this in advance. (3) By detecting clogging of the suction means, it is possible to eliminate the influence of changes in the inner diameter of the suction means, reliably detect component intake, and maintain component mounting stability.
第１図は本発明の一実施例を示す正面図、第２図は本発
明の一実施例を示す側面図、第３図及び第４図は本発明
の一実施例である電子部品の吸着状態の良否判定を示す
図、第５図及び第６図は本発明の一実施例であるノズル
の先端磨耗による状態良否判定を示す図、第７図及び第
８図は本発明の一実施例であるノズルのつまり状態の判
定を示す図である。
７・・・ノズル、 １０・・・有無検出器。
３７・・・上下位置検出器、 ３８・・・真空検出器
。
３９・・・判定手段、 ４０・・・記憶手段代理人
弁理士 則 近 憲 佑
同 第 子 丸 健第
図
第８図
第２図
第Ｊ図
第７図
第
図
（α）
（ｂ）
第４図
（α）
ｔｂン
第６図
第８図
ヰ寺ｌ午庁長官
殿
平成
年
月
日
１、事件の表示
平成
２年！を寺言午願第１４９９９号
２゜
発明の名称
電子部品実装装置
３゜
補正をする者
事件との間イ系
特ｊ′＋比願人
株式会社
東芝
４゜
代
理
人
平成
３年
７月３０日
く発ｊム日）
６゜
補正の対象
明細書の図面の簡単な説明の欄
７、補正の内容
（１）明細書の図面の簡単な説明の欄をｇｌ１紙の通り
補正する。
以 上
別紙Fig. 1 is a front view showing an embodiment of the present invention, Fig. 2 is a side view showing an embodiment of the invention, and Figs. 3 and 4 are suction of electronic components as an embodiment of the invention. FIGS. 5 and 6 are diagrams showing how to determine whether the condition is good or bad based on abrasion of the tip of a nozzle, which is an embodiment of the present invention. FIGS. FIG. 3 is a diagram illustrating determination of a clogged state of a nozzle. 7... Nozzle, 10... Presence/absence detector. 37...Vertical position detector, 38...Vacuum detector. 39... Judgment means, 40... Storage means agent
Patent Attorney Noriyuki Chika Ken Yudo No. 8 Director General of the Agency, 1998, Incident Display 1990! Teragon Gohan No. 14999 2゜Name of the Invention Electronic Component Mounting Device 3゜Amendment between the case and the case of the person making the amendment 6゜Brief explanation of drawings column 7 of the specification to be amended, contents of the amendment (1) The column of brief explanation of drawings of the specification is amended as per GL1 paper. Attachment above
第１図は本発明の一実施例を示す正面図、第２図は本発
明の一実施例を示す側面図、第３図及び第４図は本発明
の一実施例である電子部品の吸着状態の良否判定を示す
図、第５図及び第６図は本発明の一実施例であるノズル
の先端磨耗による状態良否判定を示す図、第７図及び第
８図は本発明の一実施例であるノズルのつまり状態の判
定を示す図、第９図は本発明の一実施例であるノズルの
つまり状態の判定を示すフローチャートである。Fig. 1 is a front view showing an embodiment of the present invention, Fig. 2 is a side view showing an embodiment of the invention, and Figs. 3 and 4 are suction of electronic components as an embodiment of the invention. FIGS. 5 and 6 are diagrams showing how to determine whether the condition is good or bad based on abrasion of the tip of a nozzle, which is an embodiment of the present invention. FIGS. FIG. 9 is a flowchart showing the determination of the clogged nozzle according to an embodiment of the present invention.
Claims (2)
手段及び前記電子部品の有無を検出する有無検出手段と
、前記吸着手段の位置を検出する位置検出手段と、前記
吸着手段の基準位置を設定記憶する基準位置設定手段と
、前記位置検出手段からの検出信号と前記基準位置設定
手段からの出力信号とを比較演算する比較手段と、この
比較手段からの出力信号と前記有無検出手段からの検出
信号とを基に、前記吸着手段に真空吸着保持された前記
電子部品の吸着状態の良否及び前記吸着手段の状態の良
否のうち少なくともどちらか一方を判断する判断手段と
を具備したことを特徴とする電子部品実装装置。1. A suction means for holding an electronic component by vacuum suction, a presence detection means for detecting the presence or absence of the suction means and the electronic component, a position detection means for detecting the position of the suction means, and a reference position of the suction means is set and stored. a reference position setting means for comparing a detection signal from the position detection means and an output signal from the reference position setting means; and a comparison means for comparing and calculating an output signal from the comparison means and a detection signal from the presence/absence detection means. and determining means for determining at least one of the adsorption state of the electronic component held by the suction means by vacuum suction and the quality of the suction means based on the above. Electronic component mounting equipment.
着保持する吸着手段と、この吸着手段及び前記電子部品
の有無を検出する有無検出手段と、前記吸着手段の真空
状態を検出する真空検出手段と、前記有無検出手段から
の検出信号と前記真空検出手段からの検出信号を基に、
前記吸着手段の吸着孔の状態を判定する判定手段とを具
備したことを特徴とする電子部品実装装置。2. A suction means having at least one suction hole and holding an electronic component by vacuum suction, a presence/absence detection means for detecting the presence or absence of the suction means and the electronic component, and a vacuum detection means for detecting a vacuum state of the suction means. , based on the detection signal from the presence/absence detection means and the detection signal from the vacuum detection means,
An electronic component mounting apparatus comprising: determination means for determining the state of the suction hole of the suction means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014999A JP2790694B2 (en) | 1990-01-26 | 1990-01-26 | Electronic component mounting equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014999A JP2790694B2 (en) | 1990-01-26 | 1990-01-26 | Electronic component mounting equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04799A true JPH04799A (en) | 1992-01-06 |
| JP2790694B2 JP2790694B2 (en) | 1998-08-27 |
Family
ID=11876620
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014999A Expired - Fee Related JP2790694B2 (en) | 1990-01-26 | 1990-01-26 | Electronic component mounting equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2790694B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000156600A (en) * | 1998-11-20 | 2000-06-06 | Matsushita Electric Ind Co Ltd | Component mounting machine |
| JP2002280795A (en) * | 2001-03-19 | 2002-09-27 | Matsushita Electric Ind Co Ltd | Mounting machine |
| DE102021111842A1 (en) | 2020-05-15 | 2021-11-18 | Toyota Jidosha Kabushiki Kaisha | Fuel cell stack |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7198188B2 (en) * | 2019-09-30 | 2022-12-28 | シチズンファインデバイス株式会社 | Work holding device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63186499A (en) * | 1987-01-29 | 1988-08-02 | 株式会社日立製作所 | Automatic correction of wear of attraction nozzle in electronic parts mounter |
| JPH01228735A (en) * | 1988-03-07 | 1989-09-12 | Yamagata Kashio Kk | Method of determining suck-up state of part in electronic parts installing machine |
-
1990
- 1990-01-26 JP JP2014999A patent/JP2790694B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63186499A (en) * | 1987-01-29 | 1988-08-02 | 株式会社日立製作所 | Automatic correction of wear of attraction nozzle in electronic parts mounter |
| JPH01228735A (en) * | 1988-03-07 | 1989-09-12 | Yamagata Kashio Kk | Method of determining suck-up state of part in electronic parts installing machine |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000156600A (en) * | 1998-11-20 | 2000-06-06 | Matsushita Electric Ind Co Ltd | Component mounting machine |
| JP2002280795A (en) * | 2001-03-19 | 2002-09-27 | Matsushita Electric Ind Co Ltd | Mounting machine |
| DE102021111842A1 (en) | 2020-05-15 | 2021-11-18 | Toyota Jidosha Kabushiki Kaisha | Fuel cell stack |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2790694B2 (en) | 1998-08-27 |
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