JPH0479443B2 - - Google Patents
Info
- Publication number
- JPH0479443B2 JPH0479443B2 JP59139808A JP13980884A JPH0479443B2 JP H0479443 B2 JPH0479443 B2 JP H0479443B2 JP 59139808 A JP59139808 A JP 59139808A JP 13980884 A JP13980884 A JP 13980884A JP H0479443 B2 JPH0479443 B2 JP H0479443B2
- Authority
- JP
- Japan
- Prior art keywords
- contact material
- electrical contact
- composite electrical
- base material
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 69
- 239000002131 composite material Substances 0.000 claims description 23
- 239000010409 thin film Substances 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000005096 rolling process Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 229910000510 noble metal Inorganic materials 0.000 claims description 8
- 238000007747 plating Methods 0.000 claims description 7
- 238000004544 sputter deposition Methods 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 description 6
- 238000000137 annealing Methods 0.000 description 3
- 238000010301 surface-oxidation reaction Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 229910017518 Cu Zn Inorganic materials 0.000 description 1
- 229910017752 Cu-Zn Inorganic materials 0.000 description 1
- 229910017943 Cu—Zn Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
Landscapes
- Manufacture Of Switches (AREA)
- Contacts (AREA)
Description
（産業上の利用分野）
本発明は、各種電気機器、電子機器等に装備さ
れるスイツチ、リレー、コネクター、ブラシ、ス
リツプリング等に用いられる複合電気接点材の製
造方法に係り、特にBe−Cuをベース材とする複
合電気接点材の製造方法の改良に関する。
（従来技術とその問題点）
複合電気接点材の一つとして、従来よりBe−
Cuをベース材とする複合電気接点材があり、こ
の複合電気接点材を作る際には、Be−Cuのベー
ス材に接点材、例えばAg−PdやAu−Pt−Pd−
Ag−Cu−Zn等の貴金属又は貴金属合金若しくは
それらを主成分とする接点材を不活性又は還元性
雰囲気中で加熱・圧延して接合している。
然し、Be−Cuは非常に酸化し易く還元できな
い為、加熱により表面酸化が生じ、前記のような
接点材と接合すると、接合面が脆化し、接合強度
が不十分となり、接点材の剥がれ易い複合電気接
点材となる。
（発明の目的）
本発明は上記の問題を解消すべくなされたもの
で、Be−Cuのベース材から接点材が剥がれるこ
とのない複合電気接点材の製造方法を提供するこ
とを目的とするものである。
（発明の構成）
本発明の複合電気接点材の製造方法は、Be−
Cuのベース材にスパツタリングによるCu薄膜、
湿式めつきによるCu薄膜又はCu箔を介在して貴
金属又は貴金属合金若しくはそれらを主成分とす
る接点材を不活性又は還元性雰囲気中で加熱・圧
延して接合するものである。
本発明の複合電気接点材の製造方法に於いて、
Be−Cuのベース材と接点材との間にスパツタリ
ングによるCu薄膜、湿式めつきによるCu薄膜又
はCu箔を介在している理由は、該複合電気接点
材の製造時、Be−Cuのベース材とCuの接合に於
いて、Be−Cuのベース材に表面酸化が発生して
も接合後拡散現象によりCu中に酸素が固溶して
分散する為、接点材との接合面に酸素が凝集せ
ず、脆い層を作らず、接点材とCuとが強固に接
合され、またBe−Cuのベース材とCuとはCuが
Be−Cu中に拡散するので強固に接合され、従つ
てBe−Cuのベース材と接点材との接合強度は十
分に高いものとなるからである。
（実施例）
本発明の複合電気接点材の製造方法における各
種の実施例を図によつて説明する。第１図に示す
実施例の複合電気接点材１は、幅20mm、厚さ0.8
mmのBe2重量％−Cuより成る帯状ベース材の中央
部長手方向に、幅２mm、厚さ0.06mmのAg−Pd60
重量％より成る帯状接点材を予めその下面及び両
側面にスパツタリングによりCu薄膜を0.01mmコー
テイングした上で、窒素ガス雰囲気中の加熱炉で
600℃に加熱し、圧延して連続的に接合し、さら
に圧延、焼鈍を反復して、図示の如く幅20mm、厚
さ0.2mmの帯状ベース材２の中央部に、幅２mm、
厚さ0.015mmの帯状接点材３が厚さ0.002mmのCu薄
膜４を介して埋め込み接合された断面形状になさ
れているものである。
第２図に示す他の実施例の複合電気接点材１′
は、幅60mm、厚さ1.0mmのBe2重量％−Cuより成
る帯状ベース材の左右両側部長手方向に、幅８
mm、厚さ1μｍの湿式めつきによりCu薄膜を設け、
そしてこのCu薄膜の上に幅４mm、厚さ0.1mmの
Au10−Pt10−Pd35−Ag30−Cu14−Zn1より成る
帯状接点材を配して、窒素ガス雰囲気中の加熱炉
内で、600℃に加熱し圧延して連続的に接合し、
さらに圧延、焼鈍を反復して図示の如く、幅60
mm、厚さ0.2mmの帯状ベース材２′の左右両側部
に、幅４mm、厚さ0.02mmの帯状接点材３′が厚さ
0.2μｍのCu薄膜４′を介して埋め込み接合された
断面形状になされているものである。
第３図に示す更に他の実施例の複合電気接点材
１″は、幅30mm、厚さ0.8mmのBe2重量％−Cuより
なる帯状ベース材の中央部長手方向に、幅30mm、
厚さ0.03mmのCu箔テープを配し、その上に幅30
mm、厚さ0.06mmのAg−Pd60重量％より成る帯状
接点材を配し、この三者をArガス雰囲気中の加
熱炉で600℃で加熱して同時に圧延して連続的に
接合し、さらに圧延、焼鈍を反復して、図示の如
く幅30mm、厚さ0.2mmの帯状ベース材２″の上に幅
30mm、厚さ0.008mmのCu箔テープ４″を介して幅30
mm、厚さ0.015mmの帯状接点材３″が接合された断
面形状になされているものである。
（作用）
上記の如く構成された各実施例に示されるよう
に本発明の複合電気接点材の製造方法は、Be−
Cuのベース材にスパツタリングによるCu薄膜、
湿式めつきによるCu薄膜又はCu箔を介在して接
点材が不活性又は還元性雰囲気中で加熱、圧延し
て接合されているので、接点材との接合面には脆
弱な酸化物の層が無く、またBe−Cuのベース材
とCuとはCuがBe−Cu中に拡散するので接点材は
強固に接合されて、著しく接合強度が高くなつて
いる。
因みに上記実施例１、２、３の複合電気接点材
と、中間にCuを介在しないで上記実施例と同様
に製造して得た従来例１、２、３の複合電気接点
材とを夫々折り曲げ試験し、且つ剥離試験にて帯
状接点材の接合強度を測定した処、下記の表に示
すような結果を得た。
(Industrial Application Field) The present invention relates to a method for manufacturing composite electrical contact materials used for switches, relays, connectors, brushes, slip rings, etc. installed in various electrical devices, electronic devices, etc. This invention relates to improvements in the manufacturing method of composite electrical contact materials using as a base material. (Prior art and its problems) Be-
There is a composite electrical contact material that uses Cu as a base material, and when making this composite electrical contact material, a contact material such as Ag-Pd or Au-Pt-Pd-
Noble metals such as Ag-Cu-Zn, noble metal alloys, or contact materials mainly composed of these are joined by heating and rolling in an inert or reducing atmosphere. However, since Be-Cu is highly oxidizable and cannot be reduced, heating causes surface oxidation, and when bonded to contact materials such as those mentioned above, the bonded surface becomes brittle, the bonding strength is insufficient, and the contact material is likely to peel off. Becomes a composite electrical contact material. (Object of the Invention) The present invention was made to solve the above problems, and an object of the present invention is to provide a method for manufacturing a composite electrical contact material in which the contact material does not peel off from the Be-Cu base material. It is. (Structure of the Invention) The method for manufacturing a composite electrical contact material of the present invention includes Be-
Cu thin film by sputtering on Cu base material,
This method involves heating and rolling noble metals, noble metal alloys, or contact materials containing these as main components in an inert or reducing atmosphere with Cu thin films or Cu foils interposed by wet plating. In the method for manufacturing a composite electrical contact material of the present invention,
The reason for interposing a Cu thin film by sputtering, a Cu thin film by wet plating, or a Cu foil between the Be-Cu base material and the contact material is that when manufacturing the composite electrical contact material, the Be-Cu base material When bonding Be-Cu to Cu, even if surface oxidation occurs on the Be-Cu base material, oxygen is dissolved and dispersed in Cu due to post-bonding diffusion phenomenon, so oxygen aggregates on the bonding surface with the contact material. The contact material and Cu are firmly bonded without forming a brittle layer, and the base material of Be-Cu and Cu are
This is because it diffuses into the Be-Cu, resulting in a strong bond, and therefore the bonding strength between the Be-Cu base material and the contact material is sufficiently high. (Examples) Various examples of the method for manufacturing a composite electrical contact material of the present invention will be described with reference to the drawings. The composite electrical contact material 1 of the embodiment shown in FIG. 1 has a width of 20 mm and a thickness of 0.8 mm.
Ag-Pd60 with a width of 2 mm and a thickness of 0.06 mm in the longitudinal direction of the strip base material made of mm Be2 weight%-Cu
% by weight, was coated with a Cu thin film of 0.01 mm on the bottom and both sides by sputtering, and then heated in a heating furnace in a nitrogen gas atmosphere.
By heating to 600°C, rolling and continuously joining, and repeating rolling and annealing, as shown in the figure, a 2mm wide,
It has a cross-sectional shape in which a band-shaped contact material 3 with a thickness of 0.015 mm is embedded and bonded via a Cu thin film 4 with a thickness of 0.002 mm. Composite electrical contact material 1' of another embodiment shown in FIG.
is a width of 8 mm in the longitudinal direction on both left and right sides of a strip base material made of Be2 wt%-Cu with a width of 60 mm and a thickness of 1.0 mm.
A thin Cu film is applied by wet plating with a thickness of 1 μm.
Then, on this Cu thin film, a 4mm wide and 0.1mm thick
A strip contact material made of Au10−Pt10−Pd35−Ag30−Cu14−Zn1 is arranged, heated to 600°C in a heating furnace in a nitrogen gas atmosphere, rolled, and continuously joined.
Further rolling and annealing are repeated until the width is 60 mm as shown in the figure.
A strip-shaped contact material 3' with a width of 4 mm and a thickness of 0.02 mm is placed on both left and right sides of the strip-shaped base material 2' with a width of 4 mm and a thickness of 0.2 mm.
It has a cross-sectional shape in which it is embedded and bonded via a 0.2 μm Cu thin film 4'. Composite electrical contact material 1'' of still another embodiment shown in FIG.
A Cu foil tape with a thickness of 0.03 mm is placed, and a width of 30 mm is placed on top of it.
A band-shaped contact material made of Ag-Pd 60% by weight with a thickness of 0.06 mm and a thickness of By repeating rolling and annealing, a strip with a width of 30 mm and a thickness of 0.2 mm is placed on a 2" strip base material as shown in the figure.
30mm, width 30 through 0.008mm thick Cu foil tape 4″
The composite electrical contact material of the present invention has a cross-sectional shape in which strip-shaped contact materials 3" having a thickness of 0.015 mm and a thickness of 0.015 mm are joined together. The manufacturing method of Be-
Cu thin film by sputtering on Cu base material,
Since the contact material is bonded by heating and rolling in an inert or reducing atmosphere with a Cu thin film or Cu foil interposed by wet plating, there is a fragile oxide layer on the bonding surface with the contact material. Moreover, since the base material of Be-Cu and Cu diffuse into Be-Cu, the contact material is firmly bonded, and the bonding strength is significantly increased. Incidentally, the composite electrical contact materials of Examples 1, 2, and 3 above and the composite electrical contact materials of Conventional Examples 1, 2, and 3, which were produced in the same manner as in the above Examples without intervening Cu, were bent, respectively. When testing and measuring the bonding strength of the strip contact material in a peel test, the results shown in the table below were obtained.
【表】
上記の表で明らかなように実施例１、２、３の
複合電気接点材は、Cuを介在しないでBe−Cuの
帯状ベースに帯状接点材を直かに接合した従来例
１、２、３の複合電気接点材に比べ、折り曲げ試
験で接点材が全く剥離せず、数値的にも著しく接
合強度が高いことが判る。
尚、上記実施例は帯状の複合電気接点材の場合
であるがこれに限るものではない。
（発明の効果）
以上詳記した通り本発明の複合電気接点材の製
造方法は、Be−Cuのベース材にスパツタリング
によるCu薄膜、湿式めつきによるCu薄膜又はCu
箔を介在して貴金属又は貴金属合金若しくはそれ
らを主成分とする接点材を不活性又は還元性雰囲
気中で加熱・圧延して接合されて成るものである
から、接点材の接合面にはBe−Cuの表面酸化に
よる酸化物の脆い層が形成されておらず、また
CuはBe−Cu中に拡散していて、Be−Cuのベー
ス材と接点材との接合強度が著しく高いものであ
り、しかもCuがBe−Cu中に拡散していてもBe−
Cuのベース材としての特性に変わりが無いとい
う効果があり、Be−Cuのベース材に接点材を直
かに接合して成る従来の複合電気接点材にとつて
代わることのできる画期的なものと云える。[Table] As is clear from the above table, the composite electrical contact materials of Examples 1, 2, and 3 are the conventional example 1, in which the strip contact material was directly bonded to the Be-Cu strip base without Cu intervening; Compared to composite electrical contact materials No. 2 and 3, the contact material did not peel off at all in the bending test, and it can be seen from the numerical values that the bonding strength is significantly higher. Incidentally, although the above embodiment is a case of a band-shaped composite electrical contact material, the present invention is not limited to this. (Effects of the Invention) As detailed above, the method for manufacturing a composite electrical contact material of the present invention includes a Cu thin film formed by sputtering on a Be-Cu base material, a Cu thin film formed by wet plating, or a Cu thin film formed by wet plating on a Be-Cu base material.
Since it is made by heating and rolling noble metals, noble metal alloys, or contact materials containing these as main components in an inert or reducing atmosphere with a foil interposed, Be- No brittle layer of oxide is formed due to surface oxidation of Cu, and
Cu is diffused into Be-Cu, and the bonding strength between the base material of Be-Cu and the contact material is extremely high.
It has the effect of keeping the properties of Cu as a base material unchanged, and is an innovative product that can replace the conventional composite electrical contact material made by directly bonding the contact material to the Be-Cu base material. It can be said that it is a thing.
第１図乃至第３図は夫々本発明の複合電気接点
材の実施例を示す断面図である。
1 to 3 are cross-sectional views showing examples of the composite electrical contact material of the present invention.
Claims (1)
Cu薄膜、湿式めつきによるCu薄膜又はCu箔を介
在して貴金属又は貴金属合金若しくはそれらを主
成分とする接点材を不活性又は還元性雰囲気中で
加熱・圧延して接合することを特徴とする複合電
気接点材の製造方法。1 Sputtering on Be-Cu base material
It is characterized by bonding noble metals, noble metal alloys, or contact materials containing these as main components by heating and rolling in an inert or reducing atmosphere via a Cu thin film, a Cu thin film by wet plating, or a Cu foil. Method for manufacturing composite electrical contact material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13980884A JPS6119014A (en) | 1984-07-06 | 1984-07-06 | Composite electric contact material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13980884A JPS6119014A (en) | 1984-07-06 | 1984-07-06 | Composite electric contact material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6119014A JPS6119014A (en) | 1986-01-27 |
| JPH0479443B2 true JPH0479443B2 (en) | 1992-12-16 |
Family
ID=15253917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13980884A Granted JPS6119014A (en) | 1984-07-06 | 1984-07-06 | Composite electric contact material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6119014A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5757422A (en) * | 1980-09-25 | 1982-04-06 | Tokuriki Honten Kk | Composite contact strip |
-
1984
- 1984-07-06 JP JP13980884A patent/JPS6119014A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5757422A (en) * | 1980-09-25 | 1982-04-06 | Tokuriki Honten Kk | Composite contact strip |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6119014A (en) | 1986-01-27 |
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