JPH0339798B2 - - Google Patents
Info
- Publication number
- JPH0339798B2 JPH0339798B2 JP58083157A JP8315783A JPH0339798B2 JP H0339798 B2 JPH0339798 B2 JP H0339798B2 JP 58083157 A JP58083157 A JP 58083157A JP 8315783 A JP8315783 A JP 8315783A JP H0339798 B2 JPH0339798 B2 JP H0339798B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- solder
- clad
- rolling
- tin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 88
- 229910000679 solder Inorganic materials 0.000 claims description 53
- 229910052802 copper Inorganic materials 0.000 claims description 26
- 239000010949 copper Substances 0.000 claims description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 25
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 18
- 238000005096 rolling process Methods 0.000 description 13
- 238000003466 welding Methods 0.000 description 8
- 230000003647 oxidation Effects 0.000 description 6
- 238000007254 oxidation reaction Methods 0.000 description 6
- 238000005253 cladding Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000956 alloy Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910001174 tin-lead alloy Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
- B23K35/007—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of copper or another noble metal
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Description
【発明の詳細な説明】
本発明は銅−半田クラツド材特に半導体用リー
ドフレームあるいは電気的接点材料として使用さ
れる銅−半田クラツド材に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to copper-solder clad materials, particularly copper-solder clad materials used as semiconductor lead frames or electrical contact materials.
従来、半導体用リードフレームあるいは電気的
接点材料の分野では、銅材（銅合金材を含む。以
下同じ。）が使用されることが多い。そして、こ
の銅材と共に予め銅材の一部に半田材を設けてな
る銅−半田クラツド材が使用されることがある。
この銅−半田クラツド材によれば、前記銅材と比
較して半田付性に優れているから、半田付けによ
つて半導体素子等を接続する場合に半田付け作業
を効率的に行うことができる。 BACKGROUND ART Conventionally, copper materials (including copper alloy materials; the same applies hereinafter) are often used in the field of semiconductor lead frames or electrical contact materials. In addition to this copper material, a copper-solder clad material in which a solder material is previously provided on a part of the copper material is sometimes used.
This copper-solder clad material has superior solderability compared to the copper material described above, so it is possible to efficiently perform soldering work when connecting semiconductor elements, etc. by soldering. .
ところで、半田材はそれ自信酸化されやすいと
いうだけでなく、酸化の程度によつて半田付性が
左右されるという面がある。特に、Pb含有量の
多い融点の高い耐熱半田については、酸化によつ
て表面に酸化鉛を主体とした酸化膜が形成されや
すく、この酸化膜の形成によつて著しく半田付性
が低下するという問題がある。 Incidentally, not only is the solder material itself easily oxidized, but also the solderability is influenced by the degree of oxidation. In particular, heat-resistant solders with a high melting point and high Pb content tend to form an oxide film mainly composed of lead oxide on the surface due to oxidation, and the formation of this oxide film significantly reduces solderability. There's a problem.
したがつて、このような耐熱半田を用いて圧延
により銅−半田クラツド材を製造する場合には、
銅材だけでなく、耐熱半田も酸化することにより
両材料の間に十分な接着が得られないことがあ
る。このことから、圧延により銅−半田クラツド
材を製造する場合には、それぞれの材料の表面に
形成された酸化膜をきれいに除去してから酸化し
ずらい保護雰囲気の下で圧延を行う必要がある。
また、クラツド材製造後においても耐熱半田は酸
化によりその表面が黒味を帯び、外観上商品価値
を低下させるだけでなく、傷が付きやすいなどの
問題を生じることがあるから、製品を保管するに
あたつては酸化しないように厳重に管理する必要
がある。 Therefore, when manufacturing a copper-solder clad material by rolling using such heat-resistant solder,
Not only the copper material but also the heat-resistant solder oxidizes, which may result in insufficient adhesion between the two materials. For this reason, when manufacturing copper-solder clad materials by rolling, it is necessary to thoroughly remove the oxide film formed on the surface of each material before rolling in a protective atmosphere that prevents oxidation. .
In addition, even after manufacturing the cladding material, the surface of the heat-resistant solder becomes blackish due to oxidation, which not only reduces the product value in terms of appearance but also causes problems such as being easily scratched, so please store the product. It is necessary to strictly control the process to prevent oxidation.
本発明の目的は、前記した従来技術の欠点を解
消し、製品の製造および保管を容易にし、銅材お
よび半田材の間に十分な接着を得ることができる
品質のよい銅−半田クラツド材を提供することに
ある。 The object of the present invention is to overcome the drawbacks of the prior art as described above, to facilitate product manufacture and storage, and to provide a high quality copper-solder clad material that can obtain sufficient adhesion between the copper material and the solder material. It is about providing.
すなわち、本発明の要旨とするところは、銅材
および該銅材の一部に設けられる半田材がそれら
の接合界面に存在する錫層を介して圧接−体化さ
れてなることを特徴とする銅−半田クラツド材に
ある。 That is, the gist of the present invention is characterized in that a copper material and a solder material provided on a part of the copper material are pressure-welded through a tin layer existing at the bonding interface between them. Copper-solder clad material.
上記錫層は、鉛あるいは鉛を主体とした半田合
金と比較して自然酸化しにくく、安定な金属表面
を長期にわたり維持することができる。 The tin layer is less likely to naturally oxidize than lead or a solder alloy mainly composed of lead, and can maintain a stable metal surface for a long period of time.
また、錫−鉛合金からなる半田材が他の金属部
材との接着において用いられるとき、この接着に
寄与するのは通常錫原子である。したがつて、少
なくとも銅材との接点界面に錫層が存在するよう
にされた上記銅−半田クラツド材によれば、該錫
層により十分な接着を容易に得ることができるの
で、製造が容易になるだけでなく品質の良いもの
を容易に得ることができる。さらに、この銅−半
田クラツド材の半田の表面にも錫層を存在させる
ことが可能であり、この場合には製品の酸化防止
に大きな効果があり、製品の保管を容易にするこ
とができる。 Further, when a solder material made of a tin-lead alloy is used for adhesion to another metal member, it is usually tin atoms that contribute to this adhesion. Therefore, according to the above-mentioned copper-solder clad material in which a tin layer is present at least at the contact interface with the copper material, sufficient adhesion can be easily obtained by the tin layer, making it easy to manufacture. Not only can you get the best quality products, but you can also easily obtain products of good quality. Furthermore, it is possible to have a tin layer on the surface of the solder of this copper-solder clad material, which has a great effect in preventing oxidation of the product and facilitates storage of the product.
次に添付図面により本発明銅−半田クラツド材
の実施例を説明する。 Next, examples of the copper-solder clad material of the present invention will be described with reference to the accompanying drawings.
第１図ａ，ｂはそれぞれ従来例としての銅−半
田クラツド材を示す。ａに示す銅−半田クラツド
材は一般にオーバーレイと呼ばれるものであり、
銅材１を母材とし、その上に全面に半田付２を圧
延圧接することによつて製造される。(b)に示す銅
−半田クラツド材は一般にインレイと呼ばれるも
のであり、母材としての銅材１の表面の一部に予
め溝を形成し、この溝に所定の大きさの半田材２
を埋設したあと該溝に半田材２を圧延圧接するこ
とによつて製造される。 Figures 1a and 1b respectively show conventional copper-solder clad materials. The copper-solder clad material shown in a is generally called an overlay.
It is manufactured by using a copper material 1 as a base material and rolling and pressure-welding the solder 2 on the entire surface thereof. The copper-solder clad material shown in (b) is generally called an inlay, in which a groove is formed in advance on a part of the surface of the copper material 1 as a base material, and a solder material 2 of a predetermined size is inserted into this groove.
It is manufactured by embedding the solder material 2 in the groove and then rolling and pressing the solder material 2 into the groove.
第２図ａ，ｂはそれぞれ本発明の実施例に係る
銅−半田クラツド材を示す。(a)に示すオーバーレ
イタイプの銅−半田クラツド材は、銅材１を母材
とし、この銅材１の上に全面に錫材３および半田
材２を配置し、これらを一体に圧延圧接すること
によつて製造される。(b)に示すインレイタイプ銅
−半田クラツド材は、母材としての銅材１の表面
の一部に予め溝を形成し、この溝に所定の大きさ
の錫材３および半田材２を埋設設し、これらを一
体に圧延圧接することによつて製造される。 Figures 2a and 2b show copper-solder cladding materials according to embodiments of the present invention, respectively. The overlay type copper-solder clad material shown in (a) uses a copper material 1 as a base material, and a tin material 3 and a solder material 2 are placed on the entire surface of the copper material 1, and these are rolled and pressure-welded together. Manufactured by In the inlay type copper-solder clad material shown in (b), a groove is formed in advance on a part of the surface of a copper material 1 as a base material, and a tin material 3 and a solder material 2 of a predetermined size are embedded in this groove. It is manufactured by rolling and welding these together.
このように錫材３を別部材によつて設ける以外
に、予め銅材および半田材のどちらか一方の面に
めつきすることによつて設けることもできる。 Instead of providing the tin material 3 as a separate member as described above, it can also be provided by plating the surface of either the copper material or the solder material in advance.
第３図ａ，ｂはそれぞれ本発明の他の実施例に
係る銅−半田クラツド材を示し、この場合ａに示
すオーバーレイタイプの銅−半田クラツド材は、
銅材１を母材とし、この銅材１の上に予めその両
面に錫材３を圧延圧接により一体化した半田材２
を配置し、前記銅材１および半田材２を圧延圧接
により一体化することによつて製造される。(b)に
示すインレイタイプの銅−半田クラツド材は、母
材としての銅材１の表面の一部に予め溝を形成
し、この溝内に予めその表面全体を錫めつき３′
を施してなる所定の大きさの半田材２を埋設し、
前記銅材１および半田材２を圧延圧接により一体
化して製造される。 3a and 3b respectively show copper-solder clad materials according to other embodiments of the present invention, in which case the overlay type copper-solder clad material shown in a is
A solder material 2 is formed by using a copper material 1 as a base material and integrating a tin material 3 on both sides of the copper material 1 by rolling pressure.
The copper material 1 and the solder material 2 are integrated by rolling and pressure welding. In the inlay type copper-solder clad material shown in (b), a groove is formed in advance on a part of the surface of the copper material 1 as the base material, and the entire surface is tinned in advance in this groove.
A solder material 2 of a predetermined size is buried,
It is manufactured by integrating the copper material 1 and the solder material 2 by rolling pressure welding.
圧延圧接は冷間で行うことができる。また、圧
延圧接後の接着の信頼性を高めるためには、圧延
圧接後に適当な温度で拡散焼鈍を行うとよい。 Roll welding can be performed cold. Further, in order to improve the reliability of adhesion after rolling and pressure welding, diffusion annealing may be performed at an appropriate temperature after rolling and pressure welding.
以上のように、本発明の銅−半田クラツド材に
よれば、銅材および半田材の接合界面に錫層を存
在させ、この錫層を介して銅材および半田材を圧
延圧接より一体化したから、錫層の効果的な拡散
作用（接着作用）により圧延圧接作業を容易に行
うことができると共に銅および半田が十分に接着
し品質のよい銅−半田クラツド材を容易に得るこ
とができる。 As described above, according to the copper-solder clad material of the present invention, a tin layer is present at the bonding interface between the copper material and the solder material, and the copper material and the solder material are integrated by rolling pressure through this tin layer. Therefore, due to the effective diffusion effect (adhesive effect) of the tin layer, the rolling pressure welding work can be easily performed, and the copper and solder can be sufficiently bonded, so that a high quality copper-solder clad material can be easily obtained.
さらに、このような銅−半田クラツド材の半田
材の表面に錫層を設けたものについては、前記錫
層の存在によつて半田材の酸化を防止することが
でき、この種製品の保管を容易なものとすること
ができるという効果がある。 Furthermore, in cases where a tin layer is provided on the surface of the solder material of such a copper-solder clad material, the presence of the tin layer can prevent the solder material from oxidizing, making it easier to store this type of product. This has the effect of making it easier.
第１図ａ，ｂはそれぞれ従来例に係るクラツド
材の断面図、第２図ａ，ｂはそれぞれ本発明の一
実施例に係るクラツド材の断面図、第３図ａ，ｂ
はそれぞれ本発明の他の実施例に係るクラツド材
の断面図である。
１：銅材、２：半田材、３：錫材、３′：錫め
つき。
Figures 1a and b are cross-sectional views of a cladding material according to a conventional example, Figures 2a and b are sectional views of a cladding element according to an embodiment of the present invention, and Figures 3a and b
3A and 3B are cross-sectional views of cladding materials according to other embodiments of the present invention, respectively. 1: Copper material, 2: Solder material, 3: Tin material, 3': Tin plating.
Claims (1)
がそれらの接合界面に存在する錫層を介して圧接
一体化されてなることを特徴とする銅−半田クラ
ツド材。1. A copper-solder clad material, characterized in that a copper material and a solder material provided on a part of the copper material are pressure-welded and integrated via a tin layer present at the bonding interface between them.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8315783A JPS59209500A (en) | 1983-05-12 | 1983-05-12 | Copper-solder clad material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8315783A JPS59209500A (en) | 1983-05-12 | 1983-05-12 | Copper-solder clad material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59209500A JPS59209500A (en) | 1984-11-28 |
| JPH0339798B2 true JPH0339798B2 (en) | 1991-06-14 |
Family
ID=13794406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8315783A Granted JPS59209500A (en) | 1983-05-12 | 1983-05-12 | Copper-solder clad material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59209500A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63141734A (en) * | 1986-12-04 | 1988-06-14 | 住友特殊金属株式会社 | Clad board |
| CN104400339B (en) * | 2014-10-28 | 2017-02-15 | 东莞市中一合金科技有限公司 | Processing technology for continuous strip compound solder band material and solder band material |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5474248A (en) * | 1977-11-24 | 1979-06-14 | Hitachi Cable Ltd | Clad solder |
-
1983
- 1983-05-12 JP JP8315783A patent/JPS59209500A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5474248A (en) * | 1977-11-24 | 1979-06-14 | Hitachi Cable Ltd | Clad solder |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59209500A (en) | 1984-11-28 |
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