JPH0479173A - Front/back foil connecting part - Google Patents
Front/back foil connecting partInfo
- Publication number
- JPH0479173A JPH0479173A JP2195384A JP19538490A JPH0479173A JP H0479173 A JPH0479173 A JP H0479173A JP 2195384 A JP2195384 A JP 2195384A JP 19538490 A JP19538490 A JP 19538490A JP H0479173 A JPH0479173 A JP H0479173A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- section
- back foil
- insulating body
- body section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011888 foil Substances 0.000 title claims abstract description 34
- 239000004020 conductor Substances 0.000 claims description 15
- 229910000679 solder Inorganic materials 0.000 abstract description 21
- 238000005476 soldering Methods 0.000 abstract description 6
- 239000000758 substrate Substances 0.000 abstract 1
- 239000012212 insulator Substances 0.000 description 16
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は電気回路の両面基板に実装する表裏箔接続部品
に係り、特に絶縁体が半田付けに有効な形をしている表
裏箔接続部品に関するものである。[Detailed Description of the Invention] Industrial Application Field The present invention relates to a front and back foil connection component mounted on a double-sided board of an electric circuit, and more particularly to a front and back foil connection component whose insulator has a shape that is effective for soldering. It is.
従来の技術
両面基板の部品実装方法は、先ず表裏箔接続部品をイン
サート機械にて挿入し、半田槽にて表面を半田付けする
。In the conventional method for mounting components on a double-sided board, first, front and back foil connecting components are inserted using an insert machine, and the surfaces are soldered using a solder bath.
以下、その構成について第２図を参照して説明する。す
なわち表裏箔接続部品１は絶縁体部２、導体部３，４か
らなっている。これを図に示すように両面基板６に挿入
する。ここでｓＩＬ、ｅ＋ｂは表面箔、了ａ、了すは裏
面箔である。このように表裏箔接続部品１を挿入した両
面基板６の表面をまず半田槽に浸け、半田付けを行う。The configuration will be explained below with reference to FIG. 2. That is, the front and back foil connection parts 1 are composed of an insulator section 2 and conductor sections 3 and 4. This is inserted into the double-sided board 6 as shown in the figure. Here, sIL and e+b are front foils, and Ryoa and Ryosu are back foils. The surface of the double-sided board 6 into which the front and back foil connecting parts 1 have been inserted in this manner is first immersed in a solder bath and soldered.
この時に表裏箔接続部品１と両面基板の表面箔６ ａ
＋ ６ ｂとが接続される。次に他電気部品がインサー
トされた後に両面基板１の裏面が半田槽にて半田付けさ
れて、電気部品が両面基板に半田付けされると同時に表
裏箔接続部品１と裏面箔７ａ 、７ｂが接続される。こ
のようにして表面箔６ａ 、 ６ｂと裏面箔７ａ、７ｂ
とがそれぞれ接続されていた。At this time, the front and back foil connecting parts 1 and the front foil 6 a of the double-sided board
+6b is connected. Next, after other electrical components are inserted, the back side of the double-sided board 1 is soldered in a solder bath, and at the same time the electrical components are soldered to the double-sided board, the front and back foil connecting parts 1 and the back foils 7a and 7b are connected. be done. In this way, the front foils 6a, 6b and the back foils 7a, 7b
were connected to each other.
発明が解決しようとする課題
このような従来の表裏箔接続部品では、初めに両面基板
５の表面を半田槽にて半田付けする場合、両面基板５は
半田槽内で加熱され、一定の方向に流れる半田と表面が
接する時、表裏箔接続部品１が半田槽内で、両面基板５
の進行方向に並行にインサートされている時は問題ない
が、両面基板６の進行方向に垂直にインサートされてい
る場合、表裏箔接続部品１の絶縁体部２両端の導体部３
と導体部４が半田の流れる性質により絶縁体部２を覆い
ながら流れて接続され、本来接続すべきでない箔が接続
されてしまうという課題があった１、本発明はこのよう
な課題を解決するもので、半田が絶縁体部上をブリッジ
してショートすることのない表裏箔接続部品を提供する
ことを目的とするものである。Problems to be Solved by the Invention In such conventional front and back foil connecting parts, when the front surface of the double-sided board 5 is first soldered in a soldering tank, the double-sided board 5 is heated in the soldering tank and soldered in a fixed direction. When the flowing solder comes into contact with the surface, the front and back foil connecting parts 1 are in the solder bath, and the double-sided board 5
There is no problem when inserted parallel to the traveling direction of the double-sided board 6, but when inserted perpendicular to the traveling direction of the double-sided board 6, the conductor parts 3 at both ends of the insulator part 2 of the front and back foil connection parts 1
Due to the flowing nature of the solder, the conductor part 4 was connected by flowing while covering the insulator part 2, and there was a problem that foils that should not be connected were connected.1, The present invention solves this problem. The object of the present invention is to provide a front and back foil connection component that does not cause short-circuits due to solder bridging on insulator parts.
課題を解決するだめの手段
本発明は上記目的を達成するために、表裏箔接続部品の
絶縁体部の太さをその両側にある導体部よシ太くした構
成による。Means for Solving the Problems In order to achieve the above object, the present invention has a structure in which the thickness of the insulator portion of the front and back foil connection parts is made thicker than the conductor portions on both sides thereof.
作用
本発明は上記の構成により、導体部より太い絶縁体部に
より半田の流れが妨げられ、半田はそのま＼直進せず、
下方あるいは絶縁体部側方に押し流されて、絶縁体部を
介したもう一方の導体部に直接到達し難くなる。Effect of the present invention With the above structure, the flow of solder is obstructed by the insulator part which is thicker than the conductor part, and the solder does not go straight.
The conductor is swept downward or to the side of the insulator, making it difficult to directly reach the other conductor through the insulator.
実施例 以下、本発明の一実施例を第１図に基づいて説明する。Example An embodiment of the present invention will be described below with reference to FIG.
第１図において第２図と同一部分には同一番号を付し、
説明を省略する。すなわち本発明の特徴は表裏箔接続部
品１の絶縁体部１１がその両側の導体部３，４より太く
なっていることである。In Figure 1, the same parts as in Figure 2 are given the same numbers.
The explanation will be omitted. That is, the feature of the present invention is that the insulator portion 11 of the front and back foil connection component 1 is thicker than the conductor portions 3 and 4 on both sides thereof.
このように、絶縁体部１１を太くすると、初めの両面基
板５の表面の半田付は時に、絶縁体部１１が半田が流れ
る方向の妨げになるため、半田はそのまま直進できずに
下方へ流れるか、あるいは絶縁体部１１の側方へ押し流
されることになる。このため、導体部３からすぐに導体
部４へ到達できない。この現象により、半田槽の半田部
を通過する際、半田のきれが良化し、導体部３と導体部
４のショートは防止できる。In this way, when the insulator part 11 is made thicker, the insulator part 11 sometimes obstructs the direction in which the solder flows when soldering the surface of the double-sided board 5 at the beginning, so that the solder cannot go straight but flows downward. Otherwise, it will be swept away to the side of the insulator section 11. Therefore, the conductor portion 4 cannot be reached immediately from the conductor portion 3. Due to this phenomenon, when the solder passes through the solder portion of the solder bath, the solder comes out better and short circuits between the conductor portions 3 and 4 can be prevented.
発明の効果
以上の実施例から明らかなように本発明によれば、表裏
箔接続部品の絶縁体部をその両側の導体部より太くした
構成により、従来使用していた実装機械を用いて実装で
き、半田が絶縁体部上をブリッジしてショートすること
のない表裏箔接続部品を提供できる。Effects of the Invention As is clear from the above embodiments, according to the present invention, the insulator portion of the front and back foil connection parts is made thicker than the conductor portions on both sides, so that it can be mounted using a conventional mounting machine. , it is possible to provide front and back foil connection parts that do not cause short-circuits due to solder bridging on insulator parts.
第１図は本発明の一実施例の表裏箔接続部品を両面基板
に挿入したときの断面図、第２図は従来の表裏箔接続部
品を両面基板に挿入したときの断面図である。
１・・・・・表裏箔接続部品、３，４・・・・・・導体
部、６・・・・・両面基板、６ｍ 、６ｂ・・・・・・
表面箔、７ａ、７ｂ・・・・裏面箔、１１・・・・・絶
縁体部。
代理人の氏名 弁理士 粟 野 重 孝 （＋１刀）１
名ｌ ・−８裏 箔 僚峡部 品
３．４ −−− 舅 体部
Ｉ
穎に＆ 捧即
第２図FIG. 1 is a sectional view of a front and back foil connection component according to an embodiment of the present invention inserted into a double-sided board, and FIG. 2 is a sectional view of a conventional front and back foil connection component inserted into a double-sided board. 1...Front and back foil connection parts, 3, 4...Conductor part, 6...Double-sided board, 6m, 6b...
Front foil, 7a, 7b... Back foil, 11... Insulator section. Name of agent: Patent attorney Shigetaka Awano (+1 sword) 1
Name L ・-8 Back Foil Ryokyo Parts 3.4 --- Father Body Part I Gleam & Dedication Figure 2
Claims (1)
続する絶縁体部とその両側に導体部を有する表裏箔接続
部品において、前記絶縁体部の太さが前記両側の導体部
より太いことを特徴とする表裏箔接続部品。In a front and back foil connection component that has an insulating part that connects the front foil and back foil of a double-sided board used in an electric circuit and conductor parts on both sides thereof, the thickness of the insulating part is thicker than the conductor parts on both sides. Features front and back foil connection parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2195384A JP2679365B2 (en) | 1990-07-23 | 1990-07-23 | Front and back foil connection parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2195384A JP2679365B2 (en) | 1990-07-23 | 1990-07-23 | Front and back foil connection parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0479173A true JPH0479173A (en) | 1992-03-12 |
| JP2679365B2 JP2679365B2 (en) | 1997-11-19 |
Family
ID=16340269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2195384A Expired - Fee Related JP2679365B2 (en) | 1990-07-23 | 1990-07-23 | Front and back foil connection parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2679365B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19618976C2 (en) * | 1995-10-30 | 2002-06-27 | Mitsubishi Electric Corp | Resin sealed semiconductor device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6255367U (en) * | 1985-09-27 | 1987-04-06 |
-
1990
- 1990-07-23 JP JP2195384A patent/JP2679365B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6255367U (en) * | 1985-09-27 | 1987-04-06 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19618976C2 (en) * | 1995-10-30 | 2002-06-27 | Mitsubishi Electric Corp | Resin sealed semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2679365B2 (en) | 1997-11-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |