JPH0478132A - Screw for fixing adhesion preventive plate - Google Patents
Screw for fixing adhesion preventive plateInfo
- Publication number
- JPH0478132A JPH0478132A JP19278990A JP19278990A JPH0478132A JP H0478132 A JPH0478132 A JP H0478132A JP 19278990 A JP19278990 A JP 19278990A JP 19278990 A JP19278990 A JP 19278990A JP H0478132 A JPH0478132 A JP H0478132A
- Authority
- JP
- Japan
- Prior art keywords
- screw
- knob
- fixing
- plate
- head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003449 preventive effect Effects 0.000 title abstract 3
- 230000002265 prevention Effects 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 5
- 238000009434 installation Methods 0.000 description 3
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- 230000000181 anti-adherent effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000013049 sediment Substances 0.000 description 1
- 238000007514 turning Methods 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
Description
【発明の詳細な説明】
〔概要]
本発明は、スパッタ装置やCVD装置等の堆積物防着板
の固定用ふジの構造に関し。DETAILED DESCRIPTION OF THE INVENTION [Summary] The present invention relates to the structure of a fixing frame for a deposit prevention plate of a sputtering device, a CVD device, etc.
確実な取り付けが行なえることを目的とし。The purpose is to ensure reliable installation.
成膜用の半導体製造装置のチャンバ内壁に取り付けられ
る防着板固定用ネジの構造において、ネジ部の頭部の上
に、該頭部より更に大きな径のつまみが一体構造にて形
成されてなるように構成する。In the structure of a screw for fixing an adhesion prevention plate that is attached to the inner wall of a chamber of a semiconductor manufacturing device for film formation, a knob having a diameter larger than the head is integrally formed on the head of the screw part. Configure it as follows.
本発明は、スパッタ装置やCVD装置等の堆積物防着板
の固定用ネジの構造に関する。The present invention relates to the structure of a screw for fixing a deposit prevention plate of a sputtering device, a CVD device, or the like.
近年の半導体製造装置のチャンバ内における堆積物防着
板の固定用ネジには1着脱の容易さと。In recent years, screws for fixing deposit prevention plates in the chambers of semiconductor manufacturing equipment have one feature: easy attachment and detachment.
取り付は手番の短縮が要求されている。Installation requires shorter turnaround times.
そのため、従来取外しに時間を要した防着板固定用ネジ
の構造を改良する必要があった。Therefore, it was necessary to improve the structure of the screw for fixing the adhesion prevention plate, which conventionally took time to remove.
第3図は従来例の説明図である。 FIG. 3 is an explanatory diagram of a conventional example.
図において、13はネジ、14はネジキャップ、15は
防着板、 16はチャンバ、17は堆積物である。In the figure, 13 is a screw, 14 is a screw cap, 15 is an adhesion prevention plate, 16 is a chamber, and 17 is a deposit.
従来のスパッタ装置やCVD装置等の半導体製造装置に
おいては、 装置を稼働して、金属膜等をスパッタした
り、ポリSi膜等をCVD成長した場合に、基板7上に
堆積物としての金属膜、或いはポリSi膜等が形成され
るが、同時に、基板とターゲント或いはガス拡散板間の
チャン、/Xの部分にも堆積物が付着する。そのために
、この部分に防着板を取り付けて、チャンバに直接付着
するのを防止するとともに、防着板を取外して、堆積物
の除去をし易くする。しかし1何度もスパッタ等の堆積
を繰り返していると3段々に堆積物厚く堆積されて、堆
積物が繋がってしまい、ネジを回して、ネジを取り外す
ことが大変に困難と成って(る。In conventional semiconductor manufacturing equipment such as sputtering equipment and CVD equipment, when the equipment is operated to sputter a metal film or grow a poly-Si film or the like by CVD, a metal film is deposited on the substrate 7. , or a poly-Si film or the like is formed, but at the same time, deposits also adhere to the portion of the channel /X between the substrate and the target or gas diffusion plate. For this purpose, a deposition prevention plate is attached to this portion to prevent deposits from directly adhering to the chamber, and the deposition prevention plate is removed to facilitate removal of deposits. However, if sputtering or the like is repeated over and over again, three layers of deposits will be deposited thickly, and the deposits will become connected, making it extremely difficult to remove the screws by turning them.
そのため、第3図に示すように、チャンノ1に堆積物が
付かないための防着板の取り付は方法において、取り付
は手番を短縮するためにネジの頭部に傘状の径の広いつ
まみを被せる構造のネジキャップ14を使用していたが
、ネジ13の加工精度や形状、或いは、ネジキャンプ1
4の取り付は時の不確実性のために、使用中に、振動等
により落下するなどの問題が生していた。Therefore, as shown in Figure 3, in order to prevent deposits from adhering to channel No. 1, the attachment prevention plate is installed in the method, and in order to shorten the number of steps, an umbrella-shaped diameter plate is attached to the head of the screw. A screw cap 14 with a structure that covers a wide knob was used, but the machining accuracy and shape of the screw 13, or the screw camp 1
Due to the uncertainty in the installation of No. 4, problems such as falling due to vibration etc. occurred during use.
〔発明が解決しようとする課題]
従って、ふジに対するネジキャップの取り付けに手間が
かかること、及び、使用中にネジキャップが落下してし
まうといった問題があり、安定使用が出来なかった。[Problems to be Solved by the Invention] Therefore, there are problems in that it takes time and effort to attach the screw cap to the Fuji, and that the screw cap falls off during use, making stable use impossible.
本発明は1以上の点に鑑み、これらの欠点を解消して、
防着板取り付はネジが、安定して、確実に、容易に取り
付けが行なえることを目的として提供されるものである
。In view of one or more points, the present invention solves these drawbacks, and
The anti-adhesive plate attachment is provided for the purpose of stably, reliably, and easily attaching screws.
〔課題を解決するための手段] 第1図は本発明の原理説明図である。[Means to solve the problem] FIG. 1 is a diagram explaining the principle of the present invention.
図において、1はネジ部、2は頭部、3はつまみ、4は
ネジである。In the figure, 1 is a threaded portion, 2 is a head, 3 is a knob, and 4 is a screw.
本発明では、上記の問題点を解決するために規格品と同
等のネジ部1を有する防着板固定用ネジ4の頭部2に、
更に大きな径のつまみ3を一体構造により作成して、ネ
ジ4の上部に付着する堆積物12と、防着板に付着する
堆積物12を分断してネジ4の取外しを容易にする。
また、つまみ3の部分を大きくして、掴みやすく、シか
も、ネジ4の着脱時の作業性を大きく向上させている。In the present invention, in order to solve the above-mentioned problems, the head 2 of the anti-adhesion plate fixing screw 4, which has the same threaded part 1 as the standard product, has a
The knob 3 having a larger diameter is made of an integral structure to separate the deposits 12 adhering to the upper part of the screw 4 from the deposits 12 adhering to the adhesion prevention plate, thereby facilitating the removal of the screw 4.
In addition, the knob 3 is made larger so that it is easier to grasp and the workability when attaching and removing the screw 4 is greatly improved.
即ち2本発明の目的は、成膜用の半導体製造装置のチャ
ンバ内壁に取り付けられる防着板固定用ネジの構造にお
いて、ネジ部士の頭部→の上に。That is, two objects of the present invention are, in the structure of a screw for fixing an adhesion prevention plate attached to the inner wall of a chamber of a semiconductor manufacturing apparatus for film formation, above the head of a screw member.
該頭部→より更に大きな径のつまみ3が一体構造にて形
成されてなることにより達成される。This is achieved by integrally forming the knob 3 with a larger diameter than the head.
〔作用]
本発明では、上記のように、ネジの頭部の上に更に大き
なつまみの部分を一体構造として形成する構造となり、
使用中に外れる心配がなくなりしかもおおきなつまみに
よってネジの着脱が容易にでき1手番短縮が可能となる
。[Function] As described above, the present invention has a structure in which a larger knob portion is formed as an integral structure on the head of the screw,
There is no need to worry about it coming off during use, and the large knob makes it easy to attach and remove screws, saving you one turn.
第2図は本発明の一実施例の装置への取り付は部の説明
図である。FIG. 2 is an explanatory diagram of a part of an embodiment of the present invention attached to a device.
図において、4はネジ、5は防着板、6はチャンバ、7
は基板、8は基板ホルダ、9はターゲット、10はガス
導入口、11は排気口、12は堆積物である。In the figure, 4 is a screw, 5 is an anti-adhesion plate, 6 is a chamber, and 7
1 is a substrate, 8 is a substrate holder, 9 is a target, 10 is a gas inlet, 11 is an exhaust port, and 12 is a deposit.
第2図(a)に示すスパッタ装置のチャンノ\6の内壁
に5本発明のネジ4を使用して、防着板5を取り付ける
。An anti-adhesion plate 5 is attached to the inner wall of the channel 6 of the sputtering apparatus shown in FIG. 2(a) using five screws 4 of the present invention.
装置を稼働して、 Affをスパッタした場合、基板
7上に堆積物としての1膜か形成されるが。When the apparatus is operated and Aff is sputtered, at least one film is formed as a deposit on the substrate 7.
同時に、基板7とターゲット9間のチャンノ\6の部分
にも堆積物12が付着する。そのために、この部分に防
着板を取り付けて、チャンバ6に直接付着するのを防止
するとともに、堆積物12の除去をし易くしである。At the same time, the deposit 12 also adheres to the channel part 6 between the substrate 7 and the target 9. Therefore, an adhesion prevention plate is attached to this portion to prevent the deposits 12 from directly adhering to the chamber 6 and to facilitate the removal of the deposits 12.
本発明のネジでは、ネジ4の頭部2に大きな径のつまみ
3がついているので、堆積物12が繋がって ネジ4を
取り外すことが困難となることはなく、堆積物は図に示
すように、ネジ4の下に僅かしか進入せず、2ジ4の着
脱が非常に容易に行なえる。In the screw of the present invention, since the large diameter knob 3 is attached to the head 2 of the screw 4, the deposits 12 will not connect and make it difficult to remove the screw 4, and the deposits will be removed as shown in the figure. , only a small amount goes under the screw 4, and the two screws 4 can be attached and detached very easily.
〔発明の効果]
以上説明したように9本発明によれば、ネジは通常の規
格化されたネジと同様に防着板に取り付けられ、且つ、
防着板とネジの上部に付着した堆積物を、構造的に分断
しているので、ネジの取外しが容易となり、一体成形と
なっているので、従来例のような、振動によるつまみの
落下も起こらない。そして、つまみの部分が大口径化さ
れているので2着脱時の作業性も向上している。[Effects of the Invention] As explained above, according to the present invention, the screw can be attached to the adhesion prevention plate in the same way as a normal standardized screw, and
The deposits attached to the anti-adhesion plate and the top of the screws are structurally separated, making it easy to remove the screws, and since they are integrally molded, there is no possibility of the knobs falling off due to vibration, which is the case with conventional models. It doesn't happen. And since the knob part has a larger diameter, workability when attaching and detaching the two is also improved.
9はターゲット 11は排気口 10はガス導入口 12は堆積物9 is the target 11 is the exhaust port 10 is the gas inlet 12 is sediment
第1図は本発明の原理説明図 第2図は本発明の一実施例の説明図。 第3図は従来例の説明図 である。 図において 1はネジ部、 2は頭部 3はつまみ、 4はネジ。 5は防着板、 6はチャンバ Figure 1 is a diagram explaining the principle of the present invention. FIG. 2 is an explanatory diagram of one embodiment of the present invention. Figure 3 is an explanatory diagram of the conventional example. It is. In the figure 1 is the screw part, 2 is the head 3 is a knob, 4 is a screw. 5 is the anti-adhesion plate, 6 is the chamber
Claims (1)
る防着板固定用ネジの構造において、ネジ部(1)の頭
部(2)の上に、該頭部(2)より更に大きな径のつま
み(3)が一体構造にて形成されてなることを特徴とす
る防着板固定用ネジ。In the structure of the screw for fixing the adhesion prevention plate that is attached to the inner wall of the chamber of semiconductor manufacturing equipment for film formation, a knob with a diameter larger than the head (2) is placed on the head (2) of the screw part (1). A screw for fixing an anti-adhesion plate, characterized in that (3) is formed in one piece.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19278990A JP2869159B2 (en) | 1990-07-19 | 1990-07-19 | Screws for fixing the protection plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19278990A JP2869159B2 (en) | 1990-07-19 | 1990-07-19 | Screws for fixing the protection plate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0478132A true JPH0478132A (en) | 1992-03-12 |
JP2869159B2 JP2869159B2 (en) | 1999-03-10 |
Family
ID=16297025
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19278990A Expired - Fee Related JP2869159B2 (en) | 1990-07-19 | 1990-07-19 | Screws for fixing the protection plate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2869159B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200090219A (en) | 2018-06-20 | 2020-07-28 | 가부시키가이샤 알박 | Desorption member and vacuum processing device |
KR20210006955A (en) | 2018-12-27 | 2021-01-19 | 가부시키가이샤 아루박 | Anti-seizure member and vacuum processing device |
-
1990
- 1990-07-19 JP JP19278990A patent/JP2869159B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200090219A (en) | 2018-06-20 | 2020-07-28 | 가부시키가이샤 알박 | Desorption member and vacuum processing device |
KR20210006955A (en) | 2018-12-27 | 2021-01-19 | 가부시키가이샤 아루박 | Anti-seizure member and vacuum processing device |
Also Published As
Publication number | Publication date |
---|---|
JP2869159B2 (en) | 1999-03-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6632325B2 (en) | Article for use in a semiconductor processing chamber and method of fabricating same | |
US6045665A (en) | Method of manufacturing member for thin-film formation apparatus and the member for the apparatus | |
EP0915178A3 (en) | Sputtering target of highly purified titanium | |
KR940003097B1 (en) | Film forming apparatus and film forming method | |
JPH0478132A (en) | Screw for fixing adhesion preventive plate | |
JP4761569B2 (en) | Deposition mask and mask assembly jig | |
US20030193010A1 (en) | Method and apparatus for early detection of material accretion and peeling in plasma system | |
JPS6156277A (en) | Film forming device | |
US5032246A (en) | Sputtering target wrench and sputtering target design | |
JP3086095B2 (en) | Sputtering equipment | |
CN106191793A (en) | Film formation device and cleaning method thereof | |
JPS6473717A (en) | Selective deposition of metal | |
JPH0642957U (en) | Deposition equipment in film forming equipment | |
JPS593437A (en) | Substrate for manufacturing semiconductor device | |
CA2182245A1 (en) | Process for Depositing Adherent Diamond Thin Films | |
JPS5953211B2 (en) | Thin film silicon production equipment | |
JPS59167017A (en) | Sputtering method for aluminum or alluminum alloy | |
JPH05247634A (en) | Sputtering device | |
JPS62239526A (en) | Epitaxial growth process for metallic coating | |
JPH0747824B2 (en) | Anode structure of sheet plasma deposition system | |
JPH082649Y2 (en) | LCD manufacturing equipment | |
JPH0522553U (en) | Particle getter jig cap | |
JPH01294061A (en) | Manufacture of flat platelike heating element | |
Mongodin | Device for Vacuum Depositing Coating of Aluminum on Transistors | |
JPH01274888A (en) | Apparatus for producing semiconductor device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |