JPH01294061A - Manufacture of flat platelike heating element - Google Patents

Manufacture of flat platelike heating element

Info

Publication number
JPH01294061A
JPH01294061A JP12612388A JP12612388A JPH01294061A JP H01294061 A JPH01294061 A JP H01294061A JP 12612388 A JP12612388 A JP 12612388A JP 12612388 A JP12612388 A JP 12612388A JP H01294061 A JPH01294061 A JP H01294061A
Authority
JP
Japan
Prior art keywords
heating element
alumina
heating electrode
heating
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12612388A
Other languages
Japanese (ja)
Inventor
Nobuhiko Omori
暢彦 大森
Yoichi Hashimoto
陽一 橋本
Osamu Hamada
治 浜田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP12612388A priority Critical patent/JPH01294061A/en
Publication of JPH01294061A publication Critical patent/JPH01294061A/en
Pending legal-status Critical Current

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  • Electronic Switches (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Details Of Resistors (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

PURPOSE:To enable mass producing with good workability highly reliable flat platelike heating elements resistant to a thermal shock extending over a long period of time, by spray coating and accumulating ceramic on the metal shaped into a heating electrode placed on a ceramic base and by holding and fixing said metal between both ceramics. CONSTITUTION:A tungsten foil rapped into a desired shape of heating electrode 1 is temporarily fixed on an alumina single crystal base 2 by adhesive so as to be placed on said base, alumina is accumulated and stuck through plasma spray coating to form an alumina layer 3, and said tungsten foil is held and fixed between the alumina single crystal base 2 and alumina layer 3 so that a flat platelike heating element is obtained. Accordingly, the production time of said element is as short as about one minute and the number of manufacturing processes also decreases to enable the mass production of the heating element. Further, because a tungsten foil is used as the heating electrode 1 for said flat platelike heating element, the element thus manufactured is higher in denseness and less in stress than a vapor deposited film. Therefore, said element causes neither breaking of wire nor crack and can exhibit an excellent thermal shock resistance.

Description

【発明の詳細な説明】 [産業上の1q用分野] この発明は、例えばサーマルヘッドのような大看生産の
必要な平板状発熱素子の製造方法に閏するものである。
DETAILED DESCRIPTION OF THE INVENTION [Industrial 1Q Field] The present invention relates to a method of manufacturing a flat heating element, such as a thermal head, which requires extensive production.

[従来の技術] 第4図は従来の平板状発熱素子を示す平面図で、第5図
は第4図における■一v線断面図であり、図において(
1)は加熱用電極、(2)はセラミック基板である。こ
の従来の平板状発熱素子は、例えば真空蒸着法により 
セラミック基板(2)全面に加熱用電極(1)となる金
属を蒸着し、次に蒸着された金属膜を所望の加熱用電極
形状にするために、金属膜にレジストパターンを形成し
て不要の金属膜をエツチング除去し、レジスト膜を除去
して製造していた。
[Prior Art] Fig. 4 is a plan view showing a conventional flat heating element, and Fig. 5 is a cross-sectional view taken along the line ■-v in Fig.
1) is a heating electrode, and (2) is a ceramic substrate. This conventional flat heating element is produced by, for example, a vacuum evaporation method.
A metal that will become the heating electrode (1) is vapor-deposited on the entire surface of the ceramic substrate (2), and then a resist pattern is formed on the metal film to remove unnecessary material in order to make the metal film into the desired shape of the heating electrode. It was manufactured by etching away the metal film and removing the resist film.

上記のような従来の製造方法では、高価な成膜H置を用
いる必要があり、成膜装置の真空容器には、一般的にφ
4インチのウェハなら1枚程度と、限られた数のセラミ
ック基板しか装入することができなかった。
In the conventional manufacturing method as described above, it is necessary to use an expensive film-forming apparatus, and the vacuum chamber of the film-forming apparatus generally has a
Only a limited number of ceramic substrates, about one 4-inch wafer, could be loaded.

また、真空容器内を成膜用の真空度にするために1時間
以上l$気を行う必要があり、成膜速度が一般に0.1
μs/a+in程度と遅いため加熱電極に必要な3μ国
以上の膜厚を得るために30分以上成膜を行う必要があ
り、不純物のけ清を防止するために30分以上冷却を行
う必要があることから、セラミツ鷲 り基板に金属を成膜させるために2時間以上のキ造時閏
が必要であった。
In addition, it is necessary to heat the vacuum container for more than 1 hour to bring the vacuum level to a level suitable for film formation, and the film formation rate is generally 0.1
Since it is slow at about μs/a+in, it is necessary to form the film for more than 30 minutes to obtain a film thickness of 3μ or more required for the heating electrode, and it is necessary to cool it for more than 30 minutes to prevent impurities from being removed. For this reason, it took more than two hours to form a metal film on a ceramic substrate.

さらに、成膜した金属膜を所望の形状とするためにレジ
スト膜を塗布し、マスクを用いてパターン形成を行い、
その後エツチングし、レジスト膜を除去するために洗浄
する必要があった。
Furthermore, in order to give the formed metal film a desired shape, a resist film is applied, and a pattern is formed using a mask.
After that, it was necessary to perform etching and cleaning to remove the resist film.

[発明が解決しようとする課題] 以上のように従来の平板状発熱素子の製造方法では、製
造工程が多く、製造時閉も長く煩雑で大量生産できない
等の問題点があった。
[Problems to be Solved by the Invention] As described above, the conventional method for manufacturing a flat heating element has problems such as a large number of manufacturing steps, a long and complicated manufacturing process, and the inability to mass-produce the device.

また、成膜によって形成した加熱電極は、加熱冷却を繰
り返すことによりセラミック基板との付着力が低下し剥
離する、  熱応力によりクラックが発生し断線するな
ど、長上縁の耐熱衝撃性に問題があり、信頼性に欠ける
という問題点があった。
In addition, the heating electrode formed by film formation has problems with the thermal shock resistance of the long upper edge, such as the adhesive force with the ceramic substrate decreasing and peeling due to repeated heating and cooling, and cracking and disconnection due to thermal stress. However, there was a problem of lack of reliability.

この発明は上記のような問題点を解消するためになされ
たもので、長期間の熱衝撃に耐える信頼性の高い平板状
発熱素子を、作業住良<Wi便に大量生産できる製造方
法を提供することを目的とする。
This invention was made to solve the above-mentioned problems, and provides a manufacturing method that allows mass production of highly reliable flat heating elements that can withstand long-term thermal shock. The purpose is to

[ff、dを解決するための手段] この発明の平板状発熱素子の製造方法は、セラミック基
板に加熱用電極形状の金属を載置した状態でセラミック
を溶射して上記セラミック基板に上記セラミックを堆積
させ、上記金属をセラミックで挟持固着するようにした
ものである。
[Means for Solving ff, d] The method for manufacturing a flat heating element of the present invention includes thermally spraying ceramic onto the ceramic substrate with metal in the shape of a heating electrode placed on the ceramic substrate. The metal is deposited, and the metal is sandwiched and fixed between ceramics.

[作用] この発明における平板状発熱素子は11:1熱電極を例
えば箔状の金属とし、さらに加熱電極形状の金属を溶射
によるセラミックコーティングで一体成型するようにし
たので、加熱電極を成膜によって形成したものよりも緻
密性が高く、応力が少ない。
[Function] In the flat heating element of the present invention, the 11:1 heating electrode is made of, for example, a foil-like metal, and the metal in the shape of the heating electrode is integrally formed with a ceramic coating by thermal spraying. It has higher density and less stress than the formed one.

従って加熱電極に熱応力によりクラックが発生したり断
線するのを防ぎ、熱?II撃に対する長期18H性が向
上する。ざらに溶射によるセラミック一体成型としたの
で、作業性良好にw使にかつ大量に製造できる。
Therefore, it prevents the heating electrode from cracking or breaking due to thermal stress. Long-term 18H resistance against II blows is improved. Since the ceramic is integrally molded by thermal spraying, it is easy to work, easy to use, and can be manufactured in large quantities.

[実施例] 以下、この発明を図について説明する。第1図はこの発
明の一実施例により得られた平板状発熱素子を示す平W
i図で、第2図は第1図における■−n線断面図で、′
Is3図は第1図の平板状発熱素子の一部を切り欠いて
示す斜視図である0図において、(1)は加熱用電極で
、この場合は厚さが10μmのタングステン箔、(2)
はセラミック基板で、この場合は 厚さが0.3−一の
アルミナ単結晶基板、(3)はセラミックコーティング
層で、この場合はプラズマ溶射により アルミナ単結晶
基板(2)上に堆積されるアルミナ層で、厚さが100
μ−1加熱用電極(1)のタングステン箔をアルミナ単
結晶基板(2)とで挟持固着している。
[Example] The present invention will be explained below with reference to the drawings. FIG. 1 shows a flat heating element obtained by an embodiment of the present invention.
Figure 2 is a cross-sectional view taken along the ■-n line in Figure 1;
Figure Is3 is a partially cutaway perspective view of the flat heating element in Figure 1. In Figure 0, (1) is a heating electrode, in this case a tungsten foil with a thickness of 10 μm; (2)
is a ceramic substrate, in this case an alumina single crystal substrate with a thickness of 0.3-1, and (3) is a ceramic coating layer, in this case an alumina coating layer deposited on an alumina single crystal substrate (2) by plasma spraying. layer, thickness 100
The tungsten foil of the μ-1 heating electrode (1) is sandwiched and fixed between the alumina single crystal substrate (2).

次にこの平板状発熱素子の製造方法について説明する。Next, a method for manufacturing this flat heating element will be explained.

まず、タングステン箔を所望の加熱用電極(1)形状に
型抜きし、加熱用電極(+)形状のタングステン箔を 
アルミナ単結、S基板(2)に接着剤で1反出めして載
置する0次にタングステン箔をff鷹したアルミナ単結
晶基板(2)にアルミナをプラズマ溶射して堆積、付着
させ、アルミナ層(3)を形成し、タングステン箔を 
アルミナ単結晶基板(2)とアルミナ層(3)で挟持固
着して平板状発熱素子を得ていた。Hち、予め所望の形
状に成形したタングステン箔をアルミナのプラズマ溶射
により一体成型していた。そのため、生産上縁が1分程
度と短く、製造工程も少なく、徹産化が可能である。
First, cut out the tungsten foil into the desired heating electrode (1) shape, and then cut out the tungsten foil in the shape of the heating electrode (+).
Alumina is deposited and adhered by plasma spraying on the alumina single crystal substrate (2), which has been made with 0-order tungsten foil. Form layer (3) and tungsten foil
A flat heating element was obtained by sandwiching and fixing the alumina single crystal substrate (2) and the alumina layer (3). First, tungsten foil, which had been previously formed into a desired shape, was integrally molded by alumina plasma spraying. Therefore, the production time is as short as about 1 minute, the number of manufacturing steps is small, and full production is possible.

また、蒸着装置のような高価な装置を使用せず、安価な
装置で製造できる。
Moreover, it can be manufactured using inexpensive equipment without using expensive equipment such as a vapor deposition equipment.

さらに、得られた平板状発熱素子は、加熱用電極にタン
グステン箔を用いており、蒸着膜に比べてm密性が高く
、応力が少ない、従って従来の発熱素子では、通電によ
る800〜1000℃のm5I1分、冷却3分を100
0時閏以上縁り返す熱衝撃に耐えられなかったが、この
発熱素子は加熱用電極が剥離したり、断線やクラックが
発生することもなく、優れた耐熱io性を示した。サー
マルヘッド等の電子部品の発熱体として十分使用できる
信頼性の高いものであった。
Furthermore, the obtained flat heating element uses tungsten foil for the heating electrode, and has higher m-density and less stress than a vapor-deposited film. m5I 1 minute, cooling 3 minutes 100
Although it could not withstand the thermal shock of 0 o'clock leap or more, this heating element exhibited excellent heat resistance without peeling of the heating electrode, disconnection, or cracking. It was highly reliable and could be used as a heating element for electronic components such as thermal heads.

なお、上記実施例では、セラミック基板と同一のセラミ
ックを溶射したものについて説明したが、必ずしも同一
組成である必要はなく、また全面に溶射しているが、必
要な部分のみに溶射するようにしてもよい、また、溶射
もプラズマ溶射に限るものではなく、爆発溶射あるいは
ガス燃焼溶射等も適用できる。
In the above example, the same ceramic as the ceramic substrate was thermally sprayed, but it does not necessarily have to have the same composition, and although the entire surface is thermally sprayed, it is necessary to thermally spray only the necessary areas. Furthermore, thermal spraying is not limited to plasma spraying, and explosive thermal spraying, gas combustion thermal spraying, etc. can also be applied.

さらに、上記実施例では、予め加熱用電極形状に型抜き
して成形されたタングステン箔をセラミック基板上に載
置、セラミックを溶射する場合について説明したが、セ
ラミック基板上に1iilL、た後、例えばレーザトリ
ミング等を用い加熱用電極形状に形成し、セラミックを
溶射するようにしてもよい。
Furthermore, in the above embodiment, a case was described in which a tungsten foil, which had been previously cut and formed into the shape of a heating electrode, was placed on a ceramic substrate and ceramic was thermally sprayed. It is also possible to form a heating electrode shape using laser trimming or the like, and then thermally spray ceramic.

なお、この発明に係わる金属としては、タングステンの
他にモリブデン等が用いられ、厚みとしては加熱用電極
として動作するためには3μ爾以上は必要で実用上10
μ−以上が望ましい。
The metal used in this invention is molybdenum in addition to tungsten, and the thickness is required to be 3 μm or more in order to function as a heating electrode, and in practice it is 10 μm thick.
μ- or more is desirable.

[発明の効果] 以上のように、この発明によれば、セラミック基板に加
熱用電極形状の金属を載置した状態でセラミックを溶射
して上記セラミック基板に上記セラミックを堆積させ、
上記金属をセラミックで挟持固着することにより、長期
閏の熱衝撃に耐える信頼性の高い平板状発熱素子を、作
業性良く簡便に大量生産できる効果がある。
[Effects of the Invention] As described above, according to the present invention, the ceramic is deposited on the ceramic substrate by thermal spraying with a heating electrode-shaped metal placed on the ceramic substrate,
By sandwiching and fixing the metal between ceramics, it is possible to easily mass-produce a highly reliable flat heating element that can withstand long-term thermal shock with good workability.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの発明の一実施例の平板状発熱素子を示す平
面図、第2図は第1図における■−■線断面図、第3図
は第1図の平板状発熱素子の一部を切り欠いて示す斜視
図、第4図は従来の平板状発熱素子を示す平面図、第5
図は第4図におけるV−V線断面図である。 図において、(1)は加熱用電極、(2)はセラミック
基板、(3)はセラミックコーティング層である。 なお、図中、同一符号は同一または相当部分を示す。
Fig. 1 is a plan view showing a flat heating element according to an embodiment of the present invention, Fig. 2 is a sectional view taken along the line ■-■ in Fig. 1, and Fig. 3 is a part of the flat heating element shown in Fig. 1. FIG. 4 is a plan view showing a conventional flat heating element, and FIG.
The figure is a sectional view taken along the line V-V in FIG. 4. In the figure, (1) is a heating electrode, (2) is a ceramic substrate, and (3) is a ceramic coating layer. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.

Claims (1)

【特許請求の範囲】[Claims] セラミック基板に加熱用電極形状の金属を載置した状態
でセラミックを溶射して上記セラミック基板に上記セラ
ミックを堆積させ、上記金属をセラミックで挟持固着す
るようにした平板状発熱素子の製造方法。
A method for manufacturing a flat heating element, in which a heating electrode-shaped metal is placed on a ceramic substrate, the ceramic is deposited on the ceramic substrate by thermal spraying, and the metal is sandwiched and fixed between the ceramics.
JP12612388A 1988-05-23 1988-05-23 Manufacture of flat platelike heating element Pending JPH01294061A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12612388A JPH01294061A (en) 1988-05-23 1988-05-23 Manufacture of flat platelike heating element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12612388A JPH01294061A (en) 1988-05-23 1988-05-23 Manufacture of flat platelike heating element

Publications (1)

Publication Number Publication Date
JPH01294061A true JPH01294061A (en) 1989-11-28

Family

ID=14927222

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12612388A Pending JPH01294061A (en) 1988-05-23 1988-05-23 Manufacture of flat platelike heating element

Country Status (1)

Country Link
JP (1) JPH01294061A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04233787A (en) * 1990-12-28 1992-08-21 Mitsubishi Materials Corp Multilayer printed circuit board
US8386047B2 (en) 2010-07-15 2013-02-26 Advanced Bionics Implantable hermetic feedthrough
US8552311B2 (en) 2010-07-15 2013-10-08 Advanced Bionics Electrical feedthrough assembly

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04233787A (en) * 1990-12-28 1992-08-21 Mitsubishi Materials Corp Multilayer printed circuit board
US8386047B2 (en) 2010-07-15 2013-02-26 Advanced Bionics Implantable hermetic feedthrough
US8552311B2 (en) 2010-07-15 2013-10-08 Advanced Bionics Electrical feedthrough assembly

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