JPH0477639A - Temperature measuring resistor - Google Patents
Temperature measuring resistorInfo
- Publication number
- JPH0477639A JPH0477639A JP19343190A JP19343190A JPH0477639A JP H0477639 A JPH0477639 A JP H0477639A JP 19343190 A JP19343190 A JP 19343190A JP 19343190 A JP19343190 A JP 19343190A JP H0477639 A JPH0477639 A JP H0477639A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- conductive paste
- parts
- resol
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000011248 coating agent Substances 0.000 claims abstract description 13
- 238000000576 coating method Methods 0.000 claims abstract description 13
- -1 amino compound Chemical class 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 9
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 7
- 238000007650 screen-printing Methods 0.000 claims abstract description 7
- 125000000524 functional group Chemical group 0.000 claims abstract description 6
- 238000002834 transmittance Methods 0.000 claims abstract description 5
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims abstract description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims abstract description 3
- 239000011134 resol-type phenolic resin Substances 0.000 claims description 12
- 239000011253 protective coating Substances 0.000 claims description 6
- 239000013522 chelant Substances 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 230000001681 protective effect Effects 0.000 claims description 2
- 239000005011 phenolic resin Substances 0.000 abstract description 6
- 238000009529 body temperature measurement Methods 0.000 abstract description 3
- 238000006467 substitution reaction Methods 0.000 abstract 3
- 239000002184 metal Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000003973 paint Substances 0.000 description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 2
- JESXATFQYMPTNL-UHFFFAOYSA-N 2-ethenylphenol Chemical compound OC1=CC=CC=C1C=C JESXATFQYMPTNL-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- DMBHHRLKUKUOEG-UHFFFAOYSA-N diphenylamine Chemical compound C=1C=CC=CC=1NC1=CC=CC=C1 DMBHHRLKUKUOEG-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 1
- ADVGKWPZRIDURE-UHFFFAOYSA-N 2'-Hydroxyacetanilide Chemical compound CC(=O)NC1=CC=CC=C1O ADVGKWPZRIDURE-UHFFFAOYSA-N 0.000 description 1
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- PCAXITAPTVOLGL-UHFFFAOYSA-N 2,3-diaminophenol Chemical compound NC1=CC=CC(O)=C1N PCAXITAPTVOLGL-UHFFFAOYSA-N 0.000 description 1
- ZOWWQFKBWKBYAE-UHFFFAOYSA-N 2-(3-phenylprop-2-enyl)phenol Chemical group OC1=CC=CC=C1CC=CC1=CC=CC=C1 ZOWWQFKBWKBYAE-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- QIRNGVVZBINFMX-UHFFFAOYSA-N 2-allylphenol Chemical compound OC1=CC=CC=C1CC=C QIRNGVVZBINFMX-UHFFFAOYSA-N 0.000 description 1
- ALYNCZNDIQEVRV-UHFFFAOYSA-N 4-aminobenzoic acid Chemical compound NC1=CC=C(C(O)=O)C=C1 ALYNCZNDIQEVRV-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229960004050 aminobenzoic acid Drugs 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- NTNWKDHZTDQSST-UHFFFAOYSA-N naphthalene-1,2-diamine Chemical compound C1=CC=CC2=C(N)C(N)=CC=C21 NTNWKDHZTDQSST-UHFFFAOYSA-N 0.000 description 1
- BHAAPTBBJKJZER-UHFFFAOYSA-N p-anisidine Chemical compound COC1=CC=C(N)C=C1 BHAAPTBBJKJZER-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
- Paints Or Removers (AREA)
- Thermistors And Varistors (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、導！塗料を用いて作られる測温抵抗体に関
する。[Detailed Description of the Invention] [Industrial Field of Application] This invention is based on the invention. This invention relates to a resistance temperature sensor made using paint.
これまで測温抵抗体といえば、白金、銅などの細線を絶
縁状態でコイル状にし、これをガラス管等の中に封入し
て形成されている。Until now, resistance temperature detectors have been formed by coiling thin wires of platinum, copper, etc. in an insulated state and enclosing the coils in glass tubes or the like.
か＼る従来の測温抵抗体は、細線をコイル状にして製造
されるため、微細な加工に不向きで、製造工程に多くの
時間を必要とするなどの問題がある。Conventional resistance temperature detectors are manufactured by coiling thin wires, which poses problems such as being unsuitable for fine processing and requiring a large amount of time in the manufacturing process.
ところで、出願人はこれまで特願平：２−８５１５３号
、特願平１−３４０７８２号で導電塗料を提案して来た
。この導電塗料は銅粉末を主成分とし、レゾール型フェ
ノール樹脂等を加えた導電性に優れたものである。By the way, the applicant has proposed conductive paints in Japanese Patent Application No. 2-85153 and Japanese Patent Application No. 1-340782. This conductive paint has copper powder as its main component and contains resol type phenol resin, etc., and has excellent conductivity.
そしてこの導電塗料の温度に対する抵抗変化率特性を測
定したところ、広範囲に亘すリニアーな変化を示すこと
を見出した。When we measured the resistance change rate characteristics of this conductive paint with respect to temperature, we found that it showed a linear change over a wide range.
上記知見によりこの導電ペーストを絶縁基材上に連続延
長のパターンで塗布し、このパターンを保護すれば測温
抵抗体を得ることができるであろうとの判断からこの発
明を成すに至ったのである。Based on the above findings, it was determined that if this conductive paste was applied in a continuous pattern on an insulating base material and this pattern was protected, it would be possible to obtain a resistance temperature detector, which led to the creation of this invention. .
以上に鑑みてこの発明は、導電塗料で連続する延長パタ
ーンを形成することにより容易に製造し得る測温抵抗体
を提供することを目的とする。In view of the above, an object of the present invention is to provide a temperature measuring resistor that can be easily manufactured by forming a continuous extended pattern with conductive paint.
（！ＩＩ！を解決するための手段］
そこでこの発明では上記課題を解決するための手段とし
て、金属銅粉１００重量部と、２−１置換体、２．４−
２置換体、２．４．６３置換体、メチロール基、ジメチ
レンエーテル、フェニル基の各赤外線透過率をｌ、ｍ、
ｎ、ａ、ｂ、ｃとするとき、各透過率の間に、
（イ） −−−０，８〜 １．２（ロ）
−＝０．８〜１．２
（ハ） □＝０．８〜１．２
に） □−１，２〜１．５
なる関係が成り立つレゾール型フェノール樹脂２０〜９
５重量％及び塗膜に可撓性を付与する官能基を持つレゾ
ール型フェノール樹脂５〜８０重量％からなるレゾール
型フェノール樹脂混和物５〜３３重量部と、
アミノ化合物０．５〜３．５重量部と、キレート層形成
剤０．５〜２．５重量部とから成る導電ペーストで絶縁
基板に連続した延長パターンをスクリーン印刷により形
成し、その上に保護被覆を設けて成る測温抵抗体の構成
を採用したのである。(Means for solving !II!) Therefore, in this invention, as a means for solving the above problem, 100 parts by weight of metallic copper powder, a 2-1 substituted product, a 2.4-
The infrared transmittance of the 2-substituted product, 2.4.63-substituted product, methylol group, dimethylene ether, and phenyl group is l, m,
When n, a, b, and c, between each transmittance, (a) ---0,8 to 1.2 (b)
-=0.8~1.2 (c) □=0.8~1.2) □-1,2~1.5 Resol type phenolic resin 20~9
5 to 33 parts by weight of a resol type phenolic resin mixture consisting of 5 to 80 weight % of a resol type phenolic resin having a functional group that imparts flexibility to the coating film; and 0.5 to 3.5 parts by weight of an amino compound. part by weight and 0.5 to 2.5 parts by weight of a chelate layer forming agent to form a continuous extended pattern on an insulating substrate by screen printing, and then provide a protective coating thereon. The structure was adopted.
さらに、前記絶縁基材として絶縁棒材を用いた解決手段
として、絶縁フィルム表面に連続した延長パターンを前
記導電ペーストでスクリーン印刷により形成し、その上
に保護被覆を設けて成る測温抵抗体の構成を採用するこ
ともできる。Furthermore, as a solution using an insulating bar as the insulating base material, a continuous extension pattern is formed on the surface of the insulating film by screen printing with the conductive paste, and a protective coating is provided on the extended pattern. It is also possible to adopt a configuration.
上記のように構成したそれぞれの測温抵抗体の導電ペー
ストの抵抗温度特性は、使用可能な温度範囲において完
全な直線性が得られることが確認されている。It has been confirmed that the resistance-temperature characteristics of the conductive paste of each of the temperature-measuring resistors constructed as described above exhibits perfect linearity within the usable temperature range.
従って、これを用いた測温抵抗体は極めて正確で誤差の
ない温度センサとして使用することができる。そして、
上記測温抵抗体は、絶縁基材又は絶縁棒材に導電ペース
トを塗布して形成されるから、製造工程が簡略化される
。Therefore, a temperature measuring resistor using this can be used as an extremely accurate and error-free temperature sensor. and,
Since the temperature measuring resistor is formed by applying a conductive paste to an insulating base material or an insulating bar, the manufacturing process is simplified.
上記測温抵抗体に使用される導電ペーストの配合量等の
意義については次の通りである。The significance of the amount of conductive paste used in the above-mentioned resistance temperature sensor is as follows.
上記金属銅粉は、片状・樹枝状・球状・不定形状などの
いずれの形状であってもよく、その粒径は１１００ｐ以
下が好ましく、特に１〜３０−が好ましい。このとき、
粒径が１μ未満のものは酸化されやすく、得られる塗膜
の導電性が低下するので好ましくない。The metallic copper powder may have any shape such as flake, dendritic, spherical, or irregular shape, and its particle size is preferably 1100p or less, particularly preferably 1 to 30p. At this time,
Particles with a particle size of less than 1 μm are undesirable because they are easily oxidized and the conductivity of the resulting coating film decreases.
上記樹脂混和物は、特願昭６３−１６７２２９号で示し
たレゾール型フェノール樹脂２０〜９５重量％と可撓性
を付与する官能基を持つレゾール型フェノール樹脂５〜
８０重量％とからなるものである。この樹脂混和物の配
合量が５重量部未満であるときは、金属銅粉を充分にバ
インドすることができない上に、銅箔との密着性が著し
く低下し、逆に３３重置部を超えるときは、塗膜の導電
性が著しく低下する。The above resin mixture consists of 20 to 95% by weight of a resol type phenolic resin and 5 to 95% by weight of a resol type phenolic resin having a functional group imparting flexibility as disclosed in Japanese Patent Application No. 167229/1982.
80% by weight. If the amount of this resin mixture is less than 5 parts by weight, not only will it not be possible to bind the metallic copper powder sufficiently, but also the adhesion to the copper foil will be significantly reduced, and on the contrary, if the amount exceeds 33 parts by weight, In this case, the conductivity of the coating film decreases significantly.
上記塗膜に可撓性を付与する官能基を持つレゾール型フ
ェノール樹脂は、ウレタン変性、アクリル変性、ゴム変
性、長鎖アルキル、ポリエステル変性、フッ素変性、シ
リコン変性、ビニルフェノール、アリルフェノール、ク
ロチルフェノール、シンナミルフェノールなどのオレフ
ィン系の官能基を持つフェノール樹脂などが挙げられる
。The resol-type phenolic resins that have functional groups that give flexibility to the coating film include urethane-modified, acrylic-modified, rubber-modified, long-chain alkyl, polyester-modified, fluorine-modified, silicon-modified, vinylphenol, allylphenol, and crotyl. Examples include phenolic resins having olefinic functional groups such as phenol and cinnamylphenol.
また、その配合量は、他のバインダーを使用する特願昭
６３−１９７２２９号のレゾール型フェノール樹脂の配
合量の５〜８０重景％置部る。このとき配合量が５重量
％未満では、塗膜に充分な可撓性を持たせることができ
ず、塗膜が硬くなって銅箔との密着性を著しく低下させ
るので、好ましくなく、逆に、８０重蓋％を超えるとき
は、導電性を著しく低下させるので好ましくない。The blending amount thereof is 5 to 80 weight percent of the blending amount of the resol type phenolic resin of Japanese Patent Application No. 197229/1983 which uses other binders. At this time, if the amount is less than 5% by weight, the coating film will not have sufficient flexibility, and the coating film will become hard and the adhesion with the copper foil will be significantly reduced, which is undesirable. , when it exceeds 80%, it is not preferable because the conductivity is significantly reduced.
上記（イ）〜に）の関係が成り立つレゾール型フェノー
ル樹脂は、硬い耐熱性塗膜を形成する上で有効である。A resol-type phenolic resin that satisfies the relationships (a) to (a) above is effective in forming a hard heat-resistant coating film.
その配合量が２０重量％未満であるときは導電性が著し
く低下するので好ましくなく、逆に、９５重蓋％を超え
るときは、塗膜が硬くなり、銅箔との密着性及び半田耐
熱性が低下するので好ましくない。If the amount is less than 20% by weight, the conductivity will drop significantly, which is undesirable.On the other hand, if it exceeds 95% by weight, the coating will become hard, resulting in poor adhesion to copper foil and soldering heat resistance. This is not preferable because it reduces the
上記アミノ化合物は、アニリン、ジフェニルアミン、フ
ェニレンジアミン、ジアミノナフタリン、アニシジン、
アミノフェノール、ジアミノフェノール、アセチルアミ
ノフェノール、アミノベンゾイックアシッド、Ｎ、Ｎ−
ジフェニルアンジジンなどの内から選ばれる少な（とも
１種である。このアミノ化合物は還元剤として働き、金
属銅粉の酸化を防止し、導電性の維持に寄与する。その
配合量は、金属銅粉１００重量部に対して０．５〜３．
５重量部であり、好ましくは１．５〜３重量部である。The above amino compounds include aniline, diphenylamine, phenylenediamine, diaminonaphthalene, anisidine,
Aminophenol, diaminophenol, acetylaminophenol, aminobenzoic acid, N, N-
This amino compound acts as a reducing agent, prevents oxidation of the metallic copper powder, and contributes to maintaining conductivity. 0.5 to 3.0% per 100 parts by weight of flour.
The amount is 5 parts by weight, preferably 1.5 to 3 parts by weight.
このとき配合量が０．５重量部未満では、塗膜の導電性
が著しく低下し、逆に、３．５重量部を超えると、塗膜
の基材との密着性が著しく低下する。If the amount is less than 0.5 parts by weight, the conductivity of the coating film will be significantly reduced, and if it exceeds 3.5 parts by weight, the adhesion of the coating film to the substrate will be significantly reduced.
上記キレート形成剤は、モノエタノールアミン、ジェタ
ノールアミン、トリエタノールアミン、エチレンジアミ
ン、トリエチレンジアミン、トリエチレンテトラミンな
どの脂肪族アミンから選ばれる少なくとも１種である。The chelate forming agent is at least one selected from aliphatic amines such as monoethanolamine, jetanolamine, triethanolamine, ethylenediamine, triethylenediamine, and triethylenetetramine.
このキレート形成剤は、アミン化合物同様、金属銅粉の
酸化を防止し、導電性の維持に寄与する。その配合量は
、金属銅粉１００重量部に対して０．５〜２．５重量部
である。このとき配合量が０．５重量部未満であると、
塗膜の導電性が低下し、逆に、２．５重量部を超えると
、半田耐熱性が好ましくない。Like the amine compound, this chelate forming agent prevents oxidation of the metallic copper powder and contributes to maintaining conductivity. The blending amount is 0.5 to 2.5 parts by weight per 100 parts by weight of metallic copper powder. At this time, if the blended amount is less than 0.5 parts by weight,
The conductivity of the coating film decreases, and conversely, if it exceeds 2.5 parts by weight, the soldering heat resistance is unfavorable.
以下この発明の実施例について添付図を参照して説明す
る。Embodiments of the present invention will be described below with reference to the accompanying drawings.
第一の実施例の測温抵抗体は、第１図に示すように、絶
縁基板１に導電ペーストで連続した延長パターン２をス
クリーン印刷により形成して作られる。延長パターン２
の端末の接続点３にリード線４が接続され、その後延長
パターン２の上に保護被覆５を被せる。As shown in FIG. 1, the temperature sensing resistor of the first embodiment is made by forming a continuous extension pattern 2 on an insulating substrate 1 with a conductive paste by screen printing. Extension pattern 2
A lead wire 4 is connected to a connection point 3 at the end of the extension pattern 2, and then a protective coating 5 is placed over the extension pattern 2.
絶縁基板１としては、例えばポリエステルフィルムが用
いられる。リード線４の接続は、下記の導電ペーストは
半田付性がよくないため、特願平１〜１３９５７２号で
提案された半田付性のよい導電ペーストを延長パターン
２の端末の接続点３に予めスポット付着させておき、こ
れに半田付けして接続される。As the insulating substrate 1, for example, a polyester film is used. To connect the lead wire 4, since the following conductive paste does not have good solderability, use a conductive paste with good solderability proposed in Japanese Patent Application No. 1-139572 to the connection point 3 of the terminal of the extension pattern 2 in advance. It is spot-attached and connected by soldering.
上記導電ペーストは、次のようにして作成したものを用
いた。即ち、粒径５〜ＩＯＱ、比表面積０゜４以下、水
素還元減量０．２５以下の樹枝状金属銅粉、還元剤のア
ミノフェノール、キレート形成剤のトリエタノールアミ
ン、樹脂混和物を形成する特願昭６３−１６７２２９号
のレゾール型フェノール樹脂をそれぞれ第１表に示す割
合で配合し、溶剤として若干のブチルカルピトールを加
え、２０分間三軸ロールで定位置練りして導電塗料を調
製した。ブチルカルピトールに代えてブチルカルピトー
ルアセテート、メチルイソブチルケトン、トルエン、キ
シレン等公知のものを使用することができる。The above-mentioned conductive paste was prepared as follows. That is, dendritic metallic copper powder with a particle size of 5 to IOQ, a specific surface area of 0°4 or less, and a hydrogen reduction loss of 0.25 or less, aminophenol as a reducing agent, triethanolamine as a chelate forming agent, and a resin mixture-forming agent. The resol type phenolic resins of Application No. 63-167229 were blended in the proportions shown in Table 1, a small amount of butylcarpitol was added as a solvent, and the mixture was kneaded in place with a triaxial roll for 20 minutes to prepare a conductive paint. In place of butyl carpitol, known compounds such as butyl carpitol acetate, methyl isobutyl ketone, toluene, xylene, etc. can be used.
以上のようにして形成された測温抵抗体の抵抗温度特性
を測定したところ、第４図のような結果が得られた。When the resistance temperature characteristics of the temperature measuring resistor formed as described above were measured, the results shown in FIG. 4 were obtained.
この図から分るように、抵抗温度特性はほぼ直線状に変
化している。従って、この実施例の測温抵抗体を用いて
温度測定をすれば、誤差のない極めて正確な測定が可能
である。As can be seen from this figure, the resistance temperature characteristics change almost linearly. Therefore, if the temperature is measured using the resistance temperature detector of this embodiment, extremely accurate measurement without error is possible.
第２図は、前記ポリエステルフィルムの基板にパターン
を形成したものを筒状に（ａ）、又は鳴海巻き（ｂ）に
し、それぞれリード線４を引き出したものを示し、これ
らはそれぞれガラス管等のカプセルに封入して用いられ
る。Fig. 2 shows the above-mentioned polyester film substrate with a pattern formed into a cylindrical shape (a) or Narumi-wound (b) with lead wires 4 drawn out. It is used in a capsule.
第 １
表
第３図は他の実施例の測温抵抗体を示す、基本的には第
一の実施例と同じであるが延長パターン２の終端からリ
ード線４を引き出す位置が中央にある点が異なる。Table 1 and Figure 3 show a resistance temperature detector of another embodiment, which is basically the same as the first embodiment, except that the position where the lead wire 4 is pulled out from the end of the extension pattern 2 is in the center. are different.
以上詳細に説明したように、この発明による測：＄３図
温抵抗体は絶縁基板上に良好な導電性を有しかつ直線状
の抵抗温度特性を有する導電ペーストを塗布し、その上
に保護被覆層を設けたものとして形成するようにしたか
ら、これにより温度測定を行なえば広い温度範囲に対し
て極めて正確な温度測定が可能となるという利点が得ら
れる。As explained in detail above, the $3 temperature resistor according to the present invention is made by applying a conductive paste having good conductivity and linear resistance-temperature characteristics on an insulating substrate, and then applying a protective paste on top of the conductive paste. Since it is formed with a coating layer, an advantage is obtained that extremely accurate temperature measurement can be performed over a wide temperature range.
第１図はこの発明による測温抵抗体の第一実施例の概略
斜視図、第２図は第１図の測温抵抗体を筒状、又は鳴海
巻きにした状態の図、第３図は他の実施例の概略斜視図
、第４図は抵抗温度特性を示すグラフである。
１・・・・・・絶縁基板、 ２・・・・・・延長パ
ターン、３・・・・・・接続点、 ４・・・・
・・リード線、５・・・・・・保護被覆。
特許出願人 タック電線株式会社
同FIG. 1 is a schematic perspective view of a first embodiment of a resistance temperature detector according to the present invention, FIG. 2 is a diagram of the resistance temperature detector shown in FIG. 1 in a cylindrical or Narumi-wound state, and FIG. A schematic perspective view of another embodiment, and FIG. 4 is a graph showing resistance temperature characteristics. 1...Insulating board, 2...Extension pattern, 3...Connection point, 4...
...Lead wire, 5...Protective coating. Patent applicant: Tac Electric Wire Co., Ltd.
Claims (3)
体、メチロール基、ジメチレンエーテル、フェニル基の
各赤外線透過率をｌ、ｍ、ｎ、ａ、ｂ、ｃとするとき、
各透過率の間に、 （イ）ｌ／ｎ＝０．８〜１．２ （ロ）ｍ／ｎ＝０．８〜１．２ （ハ）ｂ／ａ＝０．８〜１．２ （ニ）ｃ／ａ＝１．２〜１．５ なる関係が成り立つレゾール型フェノール樹脂２０〜９
５重量％及び塗膜に可撓性を付与する官能基を持つレゾ
ール型フェノール樹脂５〜８０重量％からなるレゾール
型フェノール樹脂混和物５〜３３重量部と、 アミノ化合物０．５〜３．５重量部と、 キレート層形成剤０．５〜２．５重量部とから成る導電
ペーストで絶縁基板に連続した延長パターンをスクリー
ン印刷により形成し、その上に保護被覆を設けて成るこ
とを特徴とする測温抵抗体。(1) 100 parts by weight of metallic copper powder and each infrared transmittance of 2-1 substituted product, 2,4-2 substituted product, 2,4,6-3 substituted product, methylol group, dimethylene ether, and phenyl group. When l, m, n, a, b, c,
Between each transmittance, (a) l/n = 0.8 to 1.2 (b) m/n = 0.8 to 1.2 (c) b/a = 0.8 to 1.2 ( D) Resol type phenolic resin 20 to 9 that holds the following relationship: c/a = 1.2 to 1.5
5 to 33 parts by weight of a resol type phenolic resin mixture consisting of 5 to 80 weight % of a resol type phenolic resin having a functional group that imparts flexibility to the coating film; and 0.5 to 3.5 parts by weight of an amino compound. part by weight and 0.5 to 2.5 parts by weight of a chelate layer forming agent, a continuous extended pattern is formed on an insulating substrate by screen printing, and a protective coating is provided on the conductive paste. Resistance temperature detector.
導電ペーストでスクリーン印刷により形成し、その上に
保護被覆を設けて成ることを特徴とする請求項１に記載
の測温抵抗体。(2) The resistance temperature detector according to claim 1, wherein a continuous extended pattern is formed on the surface of the insulating film using the conductive paste by screen printing, and a protective coating is provided thereon.
封入して成ることを特徴とする請求項２に記載の測温抵
抗体。(3) The temperature measuring resistor according to claim 2, characterized in that the insulating film is wound into a cylindrical shape and this is enclosed in a protective tube.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19343190A JPH0477639A (en) | 1990-07-20 | 1990-07-20 | Temperature measuring resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19343190A JPH0477639A (en) | 1990-07-20 | 1990-07-20 | Temperature measuring resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0477639A true JPH0477639A (en) | 1992-03-11 |
Family
ID=16307866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19343190A Pending JPH0477639A (en) | 1990-07-20 | 1990-07-20 | Temperature measuring resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0477639A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1995006092A1 (en) * | 1993-08-25 | 1995-03-02 | Tatsuta Electric Wire & Cable Co., Ltd. | Conductive coating material having good adhesiveness to metal oxide molding |
-
1990
- 1990-07-20 JP JP19343190A patent/JPH0477639A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1995006092A1 (en) * | 1993-08-25 | 1995-03-02 | Tatsuta Electric Wire & Cable Co., Ltd. | Conductive coating material having good adhesiveness to metal oxide molding |
| US5567357A (en) * | 1993-08-25 | 1996-10-22 | Tatsuta Electric Wire & Cable Co., Ltd. | Conductive paint having good adhesion to molding of metallic oxide |
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