JPH0477269U - - Google Patents
Info
- Publication number
- JPH0477269U JPH0477269U JP12029990U JP12029990U JPH0477269U JP H0477269 U JPH0477269 U JP H0477269U JP 12029990 U JP12029990 U JP 12029990U JP 12029990 U JP12029990 U JP 12029990U JP H0477269 U JPH0477269 U JP H0477269U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- main surface
- light emitting
- wiring conductor
- display device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 5
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990120299U JP2525554Y2 (ja) | 1990-11-19 | 1990-11-19 | 発光表示装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990120299U JP2525554Y2 (ja) | 1990-11-19 | 1990-11-19 | 発光表示装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0477269U true JPH0477269U (es) | 1992-07-06 |
| JP2525554Y2 JP2525554Y2 (ja) | 1997-02-12 |
Family
ID=31868212
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990120299U Expired - Lifetime JP2525554Y2 (ja) | 1990-11-19 | 1990-11-19 | 発光表示装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2525554Y2 (es) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003229603A (ja) * | 2002-01-31 | 2003-08-15 | Citizen Electronics Co Ltd | 両面発光ｌｅｄパッケージ |
| JP2005277380A (ja) * | 2004-02-23 | 2005-10-06 | Stanley Electric Co Ltd | Ｌｅｄ及びその製造方法 |
| JP2008016593A (ja) * | 2006-07-05 | 2008-01-24 | Ngk Spark Plug Co Ltd | 発光素子搭載用配線基板 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4827767U (es) * | 1971-08-05 | 1973-04-04 | ||
| JPS58159583U (ja) * | 1982-04-20 | 1983-10-24 | 三洋電機株式会社 | 発光ダイオ−ド表示器 |
| JPH01283883A (ja) * | 1988-05-10 | 1989-11-15 | Matsushita Electric Ind Co Ltd | 発光ダイオードおよびその電極の形成方法 |
-
1990
- 1990-11-19 JP JP1990120299U patent/JP2525554Y2/ja not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4827767U (es) * | 1971-08-05 | 1973-04-04 | ||
| JPS58159583U (ja) * | 1982-04-20 | 1983-10-24 | 三洋電機株式会社 | 発光ダイオ−ド表示器 |
| JPH01283883A (ja) * | 1988-05-10 | 1989-11-15 | Matsushita Electric Ind Co Ltd | 発光ダイオードおよびその電極の形成方法 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003229603A (ja) * | 2002-01-31 | 2003-08-15 | Citizen Electronics Co Ltd | 両面発光ｌｅｄパッケージ |
| JP2005277380A (ja) * | 2004-02-23 | 2005-10-06 | Stanley Electric Co Ltd | Ｌｅｄ及びその製造方法 |
| JP4572312B2 (ja) * | 2004-02-23 | 2010-11-04 | スタンレー電気株式会社 | Ｌｅｄ及びその製造方法 |
| JP2008016593A (ja) * | 2006-07-05 | 2008-01-24 | Ngk Spark Plug Co Ltd | 発光素子搭載用配線基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2525554Y2 (ja) | 1997-02-12 |