JPH0476986A - Printed circuit board - Google Patents
Printed circuit boardInfo
- Publication number
- JPH0476986A JPH0476986A JP19015990A JP19015990A JPH0476986A JP H0476986 A JPH0476986 A JP H0476986A JP 19015990 A JP19015990 A JP 19015990A JP 19015990 A JP19015990 A JP 19015990A JP H0476986 A JPH0476986 A JP H0476986A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- solder resist
- solder
- film
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims abstract description 50
- 230000001681 protective effect Effects 0.000 claims abstract description 11
- 229920005989 resin Polymers 0.000 claims abstract description 11
- 239000011347 resin Substances 0.000 claims abstract description 11
- 238000005476 soldering Methods 0.000 claims abstract description 11
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 6
- 238000007639 printing Methods 0.000 claims abstract description 5
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims description 7
- 238000007650 screen-printing Methods 0.000 claims description 3
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 claims description 2
- 230000004907 flux Effects 0.000 abstract description 20
- 238000004140 cleaning Methods 0.000 abstract description 6
- 238000000576 coating method Methods 0.000 abstract description 5
- 239000011248 coating agent Substances 0.000 abstract description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052731 fluorine Inorganic materials 0.000 abstract description 3
- 239000011737 fluorine Substances 0.000 abstract description 3
- 238000003780 insertion Methods 0.000 description 10
- 230000037431 insertion Effects 0.000 description 10
- 239000011253 protective coating Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000003915 air pollution Methods 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0577—Double layer of resist having the same pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野］
本発明はプリント配線板に関し、特に部品実装に際する
フラックス残渣を有効に除去し得るプリント配線板に関
する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a printed wiring board, and particularly to a printed wiring board from which flux residues during component mounting can be effectively removed.
〔従来の技術］
一般りこプリント配線板は、絶縁基板に所要の回路パタ
ーンを導電体を介して形成するとともに、この回路パタ
ーンに対して所要の電子部品を実装することにより構成
されている。[Prior Art] A general printed wiring board is constructed by forming a required circuit pattern on an insulating substrate via a conductor, and mounting required electronic components on this circuit pattern.
しかして、第２図に示すプリント配線板１０における絶
縁基板ｌの両面にはブ１１ント配線回路９が形成される
とともにこのプリント配線回路９には部品（不図示）を
実装するための部品リード６を挿入して電気的に接続す
る挿入孔２が形成されている。Thus, printed wiring circuits 9 are formed on both sides of the insulating substrate l in the printed wiring board 10 shown in FIG. An insertion hole 2 is formed into which the holder 6 is inserted and electrically connected.
また、前記絶縁基板１のプリント配線回路９の上側には
電気的接続部分を残して半田面側のソルダーレジスト３
および部品面側のソルダーレジスト４がそれぞれ被着さ
れている。Further, on the upper side of the printed wiring circuit 9 of the insulating substrate 1, an electrical connection portion is left, and a solder resist 3 is applied on the solder side.
and a solder resist 4 on the component side are respectively applied.
さて、かかる構成から成るプリント配線板１０に対する
電子部品の組み込みは、電子部品のり−ド６を挿入孔２
内に挿入セントするとともにプリント配線板１０の半田
面側を溶融半田槽や噴流式半田槽に浸漬して、半田面側
に半田７を付着させることにより、前記電子部品のり一
ド６と挿入孔２を電気的、機械的に接合せしめることに
よって実装するものである。Now, in order to assemble electronic components into the printed wiring board 10 having such a configuration, the electronic component glue 6 is inserted into the insertion hole 2.
At the same time, the solder side of the printed wiring board 10 is immersed in a molten solder bath or a jet solder bath to adhere the solder 7 to the solder side, thereby bonding the electronic component glue 6 and the insertion hole. It is implemented by electrically and mechanically joining the two parts.
しかるに、前記プリント配線板１０における電子部品の
実装に当たっての、リード６と挿入孔２間半田の際には
、両者間における半田濡れ性を向上促進させるために、
予めフラックスを塗布した後に半田付けが行われている
が、このフラックスが半田付は時に半田面全面のみなら
ず、スルーホールあるいは部品挿入孔２を通して部品面
にも付着してしまう。However, when soldering between the leads 6 and the insertion holes 2 when mounting electronic components on the printed wiring board 10, in order to improve and promote solder wettability between the leads 6 and the insertion holes 2,
Soldering is performed after applying flux in advance, but this flux sometimes adheres not only to the entire soldering surface but also to the component surface through the through hole or component insertion hole 2.
そして、このフラックス残渣はプリント配線回路９の絶
縁性、耐湿性等の信頼性を劣化させる要因となっており
、前記フラックス残渣を除去するためにフロン等の溶剤
による洗浄処理が要求される等の欠点を有するものであ
った。This flux residue is a factor that deteriorates the reliability of the printed wiring circuit 9 such as its insulation properties and moisture resistance, and cleaning treatment using a solvent such as Freon is required to remove the flux residue. It had some drawbacks.
しかも、フロン等の溶剤による洗浄処理の際に発生する
フロンガス等は大気汚染等の環境破壊の原因となってお
るところである。Furthermore, fluorocarbon gas and the like generated during cleaning treatment using solvents such as fluorocarbons are a cause of environmental destruction such as air pollution.
因って、本発明は前記従来のプリント配線板における部
品実装時の欠点に鑑みて開発されたものでフラックス残
渣の除去を洗浄作業の必要な〈実施し得るプリント配線
板の提供を目的とするものである。Therefore, the present invention was developed in view of the drawbacks of the conventional printed wiring boards during component mounting, and an object of the present invention is to provide a printed wiring board that does not require cleaning work to remove flux residue. It is something.
〔課題を解決するための手段］
本発明のプリント配線板は基板の片面または両面にプリ
ント配線回路を設けるとともに前記プリント配線回路の
うちの電気的接続部分を残してソルダーレジスト被膜を
設けて成るプリント配線板において、前記ソルダーレジ
スト被膜の部品面側のソルダーレジスト被膜をシリコン
および／またはフッソ系樹脂またはこれらを含有する絶
縁性被膜にて形成するとともに半田面側のソルダーレジ
スト被膜の上側に剥離自在な保護被膜を設けることによ
り構成したことを特徴とするものである。[Means for Solving the Problems] The printed wiring board of the present invention is a printed wiring board in which a printed wiring circuit is provided on one or both sides of the board, and a solder resist film is provided on the electrical connection portions of the printed wiring circuit. In the wiring board, the solder resist film on the component side of the solder resist film is formed of silicone and/or fluorocarbon resin, or an insulating film containing these, and a removable film is formed on the solder resist film on the solder surface side. It is characterized by being constructed by providing a protective film.
本発明のプリント配線板は部品面側のソルダーレジスト
をシリコンおよび／またはフッソ系樹脂またはこれらを
含有する絶縁性被膜にて形成することにより、プリント
配線板に設けられたスルーホール（不図示）あるいは部
品挿入孔２からフラックスまたは半田７が部品面側に浸
入、付着することを防止し得る作用を有する。The printed wiring board of the present invention has through-holes (not shown) or It has the function of preventing flux or solder 7 from penetrating and adhering to the component surface side from the component insertion hole 2.
また、半田面側ソルダーレジスト上に設けた剥離自在な
保護被膜は半田付は後に手指あるいはピンセント等を使
用した１作業により簡単に剥離することが可能で、前記
半田付は時に前記保護被膜上に付着したフラックス残渣
を保護被膜を介して除去し得る作用を有する。In addition, the removable protective film provided on the solder resist on the solder side can be easily peeled off after soldering by one operation using fingers or a pin, and the soldering is sometimes performed on the protective film. It has the ability to remove attached flux residue through a protective coating.
〔実施例］
以下本発明プリント配線板の実施例を図面とともに説明
する。[Example] Examples of the printed wiring board of the present invention will be described below with reference to the drawings.
第１図は本発明プリント配線板の一実施例を示す拡大断
面図である。FIG. 1 is an enlarged sectional view showing an embodiment of the printed wiring board of the present invention.
図面において、プリント配線板ｌＯは絶縁基板１の両面
にプリント配線回路９を形成するとともに部品挿入孔２
を設け、かつ半田面側には一般的に使用されるソルダー
レジストインクを使用してシルク印刷等の公知の技術に
よりソルダーレジスト被膜３を被着するとともに他方の
部品面側には、フラックスおよび半田の付着を防止し得
るシリコンおよび／またはフッソ系樹脂またはこれらを
含有する絶縁性印刷インクを使用してスクリーン印刷等
の公知の方法により部品面側ソルダーレジスト被膜４を
被着し、さらには前記半田面側ソルダーレジスト被膜３
上には電気的接続部分をのぞいて、半田耐熱性を有し、
塩化ビニル樹脂等を主体とした保護被膜５を剥離自在に
被着することにより構成されている。In the drawing, the printed wiring board 1O has printed wiring circuits 9 formed on both sides of an insulating substrate 1, and component insertion holes 2.
A solder resist film 3 is applied to the solder side by a known technique such as silk printing using commonly used solder resist ink, and the other component side is coated with flux and solder. A solder resist film 4 on the component side is applied by a known method such as screen printing using silicone and/or fluorocarbon resin or an insulating printing ink containing them, which can prevent the adhesion of the solder. Surface side solder resist film 3
The top has soldering heat resistance, except for the electrical connection part.
It is constructed by releasably applying a protective coating 5 mainly made of vinyl chloride resin or the like.
さて、かかる構成のプリント配線板１０に電子部品を実
装する場合には、前記第２図の説明と同様の方法によっ
て電子部品のり一ド６を挿入孔２中にセットし、これを
半田７にて半田付けするものであるが、部品面側ソルダ
ーレジスト４はシリコンおよび／またはフッソ系樹脂ま
たはこれらを含有する絶縁性印刷インクをコーティング
することにより形成したものであるから、シリコン樹脂
あるいはフッソ系樹脂の特性によってフラックスおよび
半田をはじくため、部品面へのフラックスおよび半田の
付着を防止することができる。Now, when mounting electronic components on the printed wiring board 10 having such a structure, the electronic component glue 6 is set in the insertion hole 2 by the same method as explained in FIG. However, since the component side solder resist 4 is formed by coating with silicone and/or fluorine-based resin, or insulating printing ink containing these, silicone resin or fluorine-based resin is used. Because it repels flux and solder due to its properties, it can prevent flux and solder from adhering to the component surface.
また、半田面側ソルダーレジスト被膜３には手等にて剥
離可能な保護被膜５を形成しであるので、前記半田付は
後に保護被膜５を手指あるいはピンセット等を使用しつ
つ剥離することにより、半田付は時に保護被膜５上に付
着したフラックス残渣８を保護被膜５とともに除去し得
るものである。Further, since the solder resist film 3 on the solder side side is formed with a protective film 5 that can be peeled off by hand, etc., the soldering can be done by peeling off the protective film 5 later using fingers or tweezers. Soldering can sometimes remove flux residue 8 deposited on the protective coating 5 together with the protective coating 5.
尚、前述の実施例におけるソルダーレジスト被膜３およ
び４は、それぞれスクリーン印刷にてコーティングする
場合について述べたが、ドライフィルムを被着すること
により形成することも可能である。Although the solder resist coatings 3 and 4 in the above-mentioned embodiments were each coated by screen printing, they can also be formed by applying a dry film.
〔発明の効果］
本発明のプリント配線板によれば、半田付は作業の実施
に対し、部品面側ソルダーレジストはノリコン樹脂およ
びフッソ系樹脂の特性によりフラックスおよび半田の部
品面への付着を防止することができ、半田面側の保護被
膜は手作業で剥離可能であるため半田付は時に半田全面
に付着したフラックス残渣は保護被膜を剥離することに
より除去できるため、洗浄作業を不要とし、フラックス
残渣による絶縁性、耐湿性等の信転性の劣化を防止し得
る効果を有する。[Effects of the Invention] According to the printed wiring board of the present invention, during soldering work, the solder resist on the component side prevents flux and solder from adhering to the component surface due to the properties of Noricon resin and fluorocarbon resin. The protective film on the solder side can be removed manually, so flux residue that adheres to the entire surface of the solder can sometimes be removed by peeling off the protective film, eliminating the need for cleaning and removing flux. It has the effect of preventing deterioration of reliability such as insulation and moisture resistance due to residue.
また、従来のフロン等の溶剤による洗浄作業を不要とす
ることができるためフロンガス等による大気汚染等の環
境破壊防止にも効果を有する。Furthermore, since the conventional cleaning work using solvents such as chlorofluorocarbons is not necessary, it is also effective in preventing environmental damage such as air pollution caused by fluorocarbon gases.
第１図は本発明プリント配線板の一実施例を示す拡大断
面図、第２図は従来のプリント配線板を示す拡大断面図
である。
１・・・絶縁基板
２・・・挿入孔
３・・半田面側ソルダーレジスト被膜
４・・部品面側ソルダーレジスト被膜
５・・・保護被膜
６・−・部品リード
７・・・半田
８・・・フラックス残渣
９・・・プリント配線回路
１０・・・プリント配線板FIG. 1 is an enlarged sectional view showing one embodiment of the printed wiring board of the present invention, and FIG. 2 is an enlarged sectional view showing a conventional printed wiring board. 1...Insulating substrate 2...Insertion hole 3...Solder resist coating on the solder side 4...Solder resist coating on the component side 5...Protective coating 6...Component lead 7...Solder 8...・Flux residue 9...Printed wiring circuit 10...Printed wiring board
Claims (3)
るとともに前記プリント配線回路のうちの電気的接続部
分を残してソルダーレジスト被膜を設けて成るプリント
配線板において、 前記ソルダーレジスト被膜の部品面側のソルダーレジス
ト被膜をシリコンおよび／またはフッソ系樹脂またはこ
れらを含有する絶縁性被膜にて形成するとともに半田面
側のソルダーレジスト被膜の上側に剥離自在な保護被膜
を設けることにより構成したことを特徴とするプリント
配線板。(1) In a printed wiring board in which a printed wiring circuit is provided on one side or both sides of the board, and a solder resist film is provided on the electrical connection portion of the printed wiring circuit while leaving the electrical connection portion of the printed wiring circuit, the component side of the solder resist film is provided with a solder resist film. The solder resist film is formed of silicone and/or fluorocarbon resin, or an insulating film containing these, and a removable protective film is provided above the solder resist film on the solder side. printed wiring board.
ビニル樹脂等を主成分とする保護被膜から成る請求項１
記載のプリント配線板。(2) Claim 1, wherein the protective film is resistant to soldering heat and is composed mainly of vinyl chloride resin or the like.
The printed wiring board described.
または／およびフッソ系樹脂またはこれらを含有する絶
縁性印刷インクをスクリーン印刷等の手段にて被着する
ことにより形成して成る請求項１記載のプリント配線板
。(3) The solder resist film on the side of the component is formed by applying silicone and/or fluorocarbon resin, or an insulating printing ink containing these, by means such as screen printing. printed wiring board.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19015990A JPH0476986A (en) | 1990-07-18 | 1990-07-18 | Printed circuit board |
| GB9114040A GB2246731B (en) | 1990-07-18 | 1991-06-26 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19015990A JPH0476986A (en) | 1990-07-18 | 1990-07-18 | Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0476986A true JPH0476986A (en) | 1992-03-11 |
Family
ID=16253409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19015990A Pending JPH0476986A (en) | 1990-07-18 | 1990-07-18 | Printed circuit board |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH0476986A (en) |
| GB (1) | GB2246731B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3610495B2 (en) * | 2002-07-19 | 2005-01-12 | オリオン電機株式会社 | Soldering structure for printed circuit boards and electronic components |
-
1990
- 1990-07-18 JP JP19015990A patent/JPH0476986A/en active Pending
-
1991
- 1991-06-26 GB GB9114040A patent/GB2246731B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| GB9114040D0 (en) | 1991-08-14 |
| GB2246731A (en) | 1992-02-12 |
| GB2246731B (en) | 1993-12-22 |
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