JPH0475665U - - Google Patents

Info

Publication number
JPH0475665U
JPH0475665U JP1990118910U JP11891090U JPH0475665U JP H0475665 U JPH0475665 U JP H0475665U JP 1990118910 U JP1990118910 U JP 1990118910U JP 11891090 U JP11891090 U JP 11891090U JP H0475665 U JPH0475665 U JP H0475665U
Authority
JP
Japan
Prior art keywords
image forming
forming apparatus
transfer paper
conveying
transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990118910U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0739483Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=14748199&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JPH0475665(U) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed filed Critical
Priority to JP1990118910U priority Critical patent/JPH0739483Y2/ja
Priority to EP91403052A priority patent/EP0486390B1/en
Priority to DE69111752T priority patent/DE69111752T2/de
Publication of JPH0475665U publication Critical patent/JPH0475665U/ja
Priority to US08/062,160 priority patent/US5338008A/en
Application granted granted Critical
Publication of JPH0739483Y2 publication Critical patent/JPH0739483Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Tunnel Furnaces (AREA)
JP1990118910U 1990-11-15 1990-11-15 リフロー炉 Expired - Lifetime JPH0739483Y2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP1990118910U JPH0739483Y2 (ja) 1990-11-15 1990-11-15 リフロー炉
EP91403052A EP0486390B1 (en) 1990-11-15 1991-11-14 Solder reflow furnace
DE69111752T DE69111752T2 (de) 1990-11-15 1991-11-14 Wiederaufschmelzlötofen.
US08/062,160 US5338008A (en) 1990-11-15 1993-05-17 Solder reflow furnace

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990118910U JPH0739483Y2 (ja) 1990-11-15 1990-11-15 リフロー炉

Publications (2)

Publication Number Publication Date
JPH0475665U true JPH0475665U (US06420036-20020716-C00037.png) 1992-07-02
JPH0739483Y2 JPH0739483Y2 (ja) 1995-09-13

Family

ID=14748199

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990118910U Expired - Lifetime JPH0739483Y2 (ja) 1990-11-15 1990-11-15 リフロー炉

Country Status (4)

Country Link
US (1) US5338008A (US06420036-20020716-C00037.png)
EP (1) EP0486390B1 (US06420036-20020716-C00037.png)
JP (1) JPH0739483Y2 (US06420036-20020716-C00037.png)
DE (1) DE69111752T2 (US06420036-20020716-C00037.png)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0661640A (ja) * 1992-08-07 1994-03-04 Matsushita Electric Ind Co Ltd リフロー装置およびリフロー方法
JPH06120655A (ja) * 1992-09-30 1994-04-28 A Tec Tekutoron Kk 自動半田付け装置
JPH06232546A (ja) * 1993-02-02 1994-08-19 Senju Metal Ind Co Ltd リフロー炉およびリフロー炉用冷却装置
JPH07154063A (ja) * 1993-11-29 1995-06-16 Hitachi Techno Eng Co Ltd リフローはんだ付け装置
JP2003181682A (ja) * 2001-12-20 2003-07-02 Tamura Seisakusho Co Ltd はんだ付け用冷却装置
JP2018162932A (ja) * 2017-03-27 2018-10-18 株式会社タムラ製作所 リフロー装置

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2683713B2 (ja) * 1992-11-24 1997-12-03 ティーディーケイ株式会社 電子部品のはんだ付け方法及び装置
US5526978A (en) * 1992-11-24 1996-06-18 Tdk Corporation Method for soldering electronic components
US6145734A (en) * 1996-04-16 2000-11-14 Matsushita Electric Industrial Co., Ltd. Reflow method and reflow device
US5814789A (en) * 1996-07-18 1998-09-29 Btu International, Inc. Forced convection furnance gas plenum
DE19723894A1 (de) * 1997-06-06 1998-12-10 Seho Systemtechnik Gmbh Prozeßkammer zur thermischen Behandlung von Oberflächen mit einem Prozeßgas
US6005224A (en) * 1997-10-30 1999-12-21 U.S. Philips Corporation Method of soldering components to at least one carrier
US6106281A (en) * 1997-12-12 2000-08-22 Materna; Peter A. Method of reducing the flow of gas needed for a chamber with controlled temperature and controlled composition of gas
US6050814A (en) * 1998-12-09 2000-04-18 Glasstech, Inc. Forced convection furnace for heating glass sheets
US6457971B2 (en) 1999-06-17 2002-10-01 Btu International, Inc. Continuous furnace having traveling gas barrier
US6283748B1 (en) * 1999-06-17 2001-09-04 Btu International, Inc. Continuous pusher furnace having traveling gas barrier
US6129256A (en) * 1999-09-21 2000-10-10 Intel Corporation Reflow furnace for an electronic assembly
US6533996B2 (en) * 2001-02-02 2003-03-18 The Boc Group, Inc. Method and apparatus for metal processing
US6386422B1 (en) * 2001-05-03 2002-05-14 Asm Assembly Automation Limited Solder reflow oven
US6592364B2 (en) * 2001-11-30 2003-07-15 David Zapata Apparatus, method and system for independently controlling airflow in a conveyor oven
FR2860862B1 (fr) * 2003-10-09 2006-08-04 Air Liquide Procede de traitement thermique d'une serie d'objets et appareil associe
WO2005096367A1 (ja) * 2004-03-30 2005-10-13 Tamura Corporation 加熱装置及びリフロー装置，はんだバンプ形成方法及び装置
US7708183B2 (en) * 2008-03-28 2010-05-04 Illinois Tool Works Inc. Reflow solder oven with cooling diffuser
JP5541354B1 (ja) * 2012-12-28 2014-07-09 千住金属工業株式会社 気体吹き出し孔の配列構造及びはんだ付け装置
JP5541353B1 (ja) * 2012-12-28 2014-07-09 千住金属工業株式会社 気体吸込み孔の配列構造及びはんだ付け装置
US9837559B2 (en) * 2013-03-13 2017-12-05 China Sunergy (Nanjing) Co. Ltd. Soldering system
RU2533892C1 (ru) * 2013-06-13 2014-11-27 Сергей Борисович Либкинд Способ изготовления композитного теплообменника
US20160271716A1 (en) * 2013-10-15 2016-09-22 Luvata Franklin, Inc. Cooling system to reduce liquid metal embrittlement in metal tube and pipe
US20150118012A1 (en) * 2013-10-31 2015-04-30 Lam Research Corporation Wafer entry port with gas concentration attenuators
DE102016110040A1 (de) * 2016-05-31 2017-11-30 Endress + Hauser Gmbh + Co. Kg Fertigungslinie zum Löten
JP6769923B2 (ja) * 2017-05-19 2020-10-14 トヨタ自動車株式会社 燃料タンク製造装置
CN107838516B (zh) * 2017-12-29 2023-10-03 山东才聚电子科技有限公司 一种真空焊接炉的焊接机构
CN107931768B (zh) * 2017-12-29 2023-05-16 山东才聚电子科技有限公司 一种真空焊接炉及焊接工艺
US11633797B2 (en) * 2019-11-15 2023-04-25 General Electric Company Braze joints for a component and methods of forming the same
CN116265162A (zh) * 2021-12-16 2023-06-20 伊利诺斯工具制品有限公司 回流焊炉
CN117352443B (zh) * 2023-12-05 2024-03-26 北京中科同志科技股份有限公司 一种凸点回流封装焊接设备

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS522277A (en) * 1975-06-24 1977-01-08 Hitachi Ltd Soldering device
JPH01118369A (ja) * 1987-10-30 1989-05-10 Fujitsu Ltd ハンダ付けリフロー炉

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2536160A1 (fr) * 1982-11-17 1984-05-18 Piezo Ceram Electronique Four continu de brasure de composants electroniques
JPS62183960A (ja) * 1986-02-10 1987-08-12 R I Denshi Kogyo:Kk ハンダ付け用還元性雰囲気炉
EP0323451B1 (en) * 1986-09-16 1991-08-28 Edward Michael Goldberg Chest drainage apparatus
KR910005959B1 (ko) * 1988-01-19 1991-08-09 니혼 덴네쯔 게이기 가부시끼가이샤 리플로우 납땜 방법 및 그 장치
JPH0244185A (ja) * 1988-08-03 1990-02-14 Furukawa Electric Co Ltd:The 加熱装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS522277A (en) * 1975-06-24 1977-01-08 Hitachi Ltd Soldering device
JPH01118369A (ja) * 1987-10-30 1989-05-10 Fujitsu Ltd ハンダ付けリフロー炉

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0661640A (ja) * 1992-08-07 1994-03-04 Matsushita Electric Ind Co Ltd リフロー装置およびリフロー方法
JPH06120655A (ja) * 1992-09-30 1994-04-28 A Tec Tekutoron Kk 自動半田付け装置
JPH06232546A (ja) * 1993-02-02 1994-08-19 Senju Metal Ind Co Ltd リフロー炉およびリフロー炉用冷却装置
JPH07154063A (ja) * 1993-11-29 1995-06-16 Hitachi Techno Eng Co Ltd リフローはんだ付け装置
JP2003181682A (ja) * 2001-12-20 2003-07-02 Tamura Seisakusho Co Ltd はんだ付け用冷却装置
JP2018162932A (ja) * 2017-03-27 2018-10-18 株式会社タムラ製作所 リフロー装置

Also Published As

Publication number Publication date
DE69111752D1 (de) 1995-09-07
JPH0739483Y2 (ja) 1995-09-13
US5338008A (en) 1994-08-16
EP0486390B1 (en) 1995-08-02
DE69111752T2 (de) 1996-04-04
EP0486390A1 (en) 1992-05-20

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Legal Events

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R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term